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Class Information
Number: 438/692
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal > Simultaneous (e.g., chemical-mechanical polishing, etc.)
Description: Processes wherein the chemical and mechanical material removal processes are concurrent.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7148145 |
Semiconductor device having T-shaped gate structure comprising in situ sidewall spacers and method of forming the semiconductor device |
Dec. 12, 2006 |
| 7148137 |
Method of forming metal line in semiconductor device |
Dec. 12, 2006 |
| 7147682 |
Polishing composition |
Dec. 12, 2006 |
| 7146593 |
Method of implementing polishing uniformity and modifying layout data |
Dec. 5, 2006 |
| 7144816 |
Polysilicon opening polish |
Dec. 5, 2006 |
| 7144815 |
Chemical mechanical polishing slurry |
Dec. 5, 2006 |
| 7144814 |
Abrasive composition for the integrated circuits electronics industry |
Dec. 5, 2006 |
| 7141503 |
Methods for manufacturing a soft error and defect resistant pre-metal dielectric layer |
Nov. 28, 2006 |
| 7141502 |
Slurry-less polishing for removal of excess interconnect material during fabrication of a silicon integrated circuit |
Nov. 28, 2006 |
| 7141501 |
Polishing method, polishing apparatus, and method of manufacturing semiconductor device |
Nov. 28, 2006 |
| RE39413 |
Low friction polish-stop stratum for endpointing chemical-mechanical planarization processing of semiconductor wafers |
Nov. 28, 2006 |
| 7138654 |
Chemical-mechanical polishing proximity correction method and correction pattern thereof |
Nov. 21, 2006 |
| 7138073 |
Slurry for chemical mechanical polishing for copper and method of manufacturing semiconductor device using the slurry |
Nov. 21, 2006 |
| 7135444 |
Cleaning composition useful in semiconductor integrated circuit fabrication |
Nov. 14, 2006 |
| 7135380 |
Method for manufacturing semiconductor device |
Nov. 14, 2006 |
| 7135124 |
Method for thinning wafers that have contact bumps |
Nov. 14, 2006 |
| 7132367 |
Polishing method |
Nov. 7, 2006 |
| 7129177 |
Write head fabrication by inverting order of process steps |
Oct. 31, 2006 |
| 7129174 |
Methods of fabricating a semiconductor substrate for reducing wafer warpage |
Oct. 31, 2006 |
| 7129173 |
Process for producing and removing a mask layer |
Oct. 31, 2006 |
| 7129167 |
Methods and systems for a stress-free cleaning a surface of a substrate |
Oct. 31, 2006 |
| 7129160 |
Method for simultaneously removing multiple conductive materials from microelectronic substrates |
Oct. 31, 2006 |
| 7125808 |
Method for manufacturing non-volatile memory cells on a semiconductor substrate |
Oct. 24, 2006 |
| 7125807 |
Method for manufacturing non-volatile memory cells on a semiconductor substrate |
Oct. 24, 2006 |
| 7125803 |
Reverse tone mask method for post-CMP elimination of copper overburden |
Oct. 24, 2006 |
| 7125802 |
CMP process leaving no residual oxide layer or slurry particles |
Oct. 24, 2006 |
| 7125751 |
Semiconductor device and method for the fabrication thereof grinding frame portion such that plural electrode constituent portions |
Oct. 24, 2006 |
| 7125324 |
Insulated pad conditioner and method of using same |
Oct. 24, 2006 |
| 7122475 |
Methods for using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies |
Oct. 17, 2006 |
| 7122465 |
Method for achieving increased control over interconnect line thickness across a wafer and between wafers |
Oct. 17, 2006 |
| 7122424 |
Method for making improved bottom electrodes for metal-insulator-metal crown capacitors |
Oct. 17, 2006 |
| 7119009 |
Semiconductor device with dual damascene wiring |
Oct. 10, 2006 |
| 7118685 |
Polishing liquid composition |
Oct. 10, 2006 |
| 7115516 |
Method of depositing a material layer |
Oct. 3, 2006 |
| 7115510 |
Method for electrochemically processing a workpiece |
Oct. 3, 2006 |
| 7112528 |
Fully planarized dual damascene metallization using copper line interconnect and selective CVD aluminum plug |
Sep. 26, 2006 |
| 7109118 |
Electrochemical fabrication methods including use of surface treatments to reduce overplating and/or planarization during formation of multi-layer three-dimensional structures |
Sep. 19, 2006 |
| 7109117 |
Method for chemical mechanical polishing of a shallow trench isolation structure |
Sep. 19, 2006 |
| 7104267 |
Planarized copper cleaning for reduced defects |
Sep. 12, 2006 |
| 7105399 |
Selective epitaxial growth for tunable channel thickness |
Sep. 12, 2006 |
| 7105475 |
Cleaning solution and cleaning method of a semiconductor device |
Sep. 12, 2006 |
| 7105914 |
Integrated circuit and seed layers |
Sep. 12, 2006 |
| 7101259 |
Polishing method and apparatus |
Sep. 5, 2006 |
| 7101272 |
Carrier head for thermal drift compensation |
Sep. 5, 2006 |
| 7101799 |
Feedforward and feedback control for conditioning of chemical mechanical polishing pad |
Sep. 5, 2006 |
| 7101800 |
Chemical-mechanical polishing slurry and method |
Sep. 5, 2006 |
| 7094695 |
Apparatus and method for conditioning a polishing pad used for mechanical and/or chemical-mechanical planarization |
Aug. 22, 2006 |
| 7090786 |
Aqueous dispersion for chemical/mechanical polishing |
Aug. 15, 2006 |
| 7091123 |
Method of forming metal wiring line including using a first insulating film as a stopper film |
Aug. 15, 2006 |
| 7091126 |
Method for copper surface smoothing |
Aug. 15, 2006 |
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