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Class Information
Number: 438/692
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal > Simultaneous (e.g., chemical-mechanical polishing, etc.)
Description: Processes wherein the chemical and mechanical material removal processes are concurrent.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7199018 |
Plasma assisted pre-planarization process |
Apr. 3, 2007 |
| 7198729 |
CMP slurry and method of manufacturing semiconductor device |
Apr. 3, 2007 |
| 7198560 |
Wafer planarization composition and method of use |
Apr. 3, 2007 |
| 7196011 |
Apparatus and method for treating substrates |
Mar. 27, 2007 |
| 7196010 |
Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the same |
Mar. 27, 2007 |
| 7196009 |
Lapping carrier, apparatus for lapping a wafer and method of fabricating a lapping carrier |
Mar. 27, 2007 |
| 7192873 |
Method of manufacturing nano scale semiconductor device using nano particles |
Mar. 20, 2007 |
| 7192870 |
Semiconductor device and fabrication process therefor |
Mar. 20, 2007 |
| 7192869 |
Methods for planarizing a metal layer |
Mar. 20, 2007 |
| 7192868 |
Method of obtaining release-standing micro structures and devices by selective etch removal of protective and sacrificial layer using the same |
Mar. 20, 2007 |
| 7192461 |
High concentration silica slurry |
Mar. 20, 2007 |
| 7189684 |
Polishing composition and method for forming wiring structure using the same |
Mar. 13, 2007 |
| 7189651 |
Stopper for chemical mechanical planarization, method for manufacturing same, and chemical mechanical planarization method |
Mar. 13, 2007 |
| 7189647 |
Sequential station tool for wet processing of semiconductor wafers |
Mar. 13, 2007 |
| 7188630 |
Method to passivate conductive surfaces during semiconductor processing |
Mar. 13, 2007 |
| 7186655 |
Method for manufacturing semiconductor device |
Mar. 6, 2007 |
| 7186653 |
Polishing slurries and methods for chemical mechanical polishing |
Mar. 6, 2007 |
| 7186652 |
Method for preventing Cu contamination and oxidation in semiconductor device manufacturing |
Mar. 6, 2007 |
| 7186651 |
Chemical mechanical polishing method and apparatus |
Mar. 6, 2007 |
| 7186574 |
CMP process metrology test structures |
Mar. 6, 2007 |
| 7183213 |
Chemical mechanical polishing pad and chemical mechanical polishing method |
Feb. 27, 2007 |
| 7183211 |
Process for chemical mechanical polishing of semiconductor substrate and aqueous dispersion for chemical mechanical polishing |
Feb. 27, 2007 |
| 7183199 |
Method of reducing the pattern effect in the CMP process |
Feb. 27, 2007 |
| 7182882 |
Method of improving chemical mechanical polish endpoint signals by use of chemical additives |
Feb. 27, 2007 |
| 7179758 |
Recovery of hydrophobicity of low-k and ultra low-k organosilicate films used as inter metal dielectrics |
Feb. 20, 2007 |
| 7179716 |
Method of forming a metal-containing layer over selected regions of a semiconductor substrate |
Feb. 20, 2007 |
| 7176145 |
Manufacturing method of semiconductor device |
Feb. 13, 2007 |
| 7176135 |
EBR shape of spin-on low-k material providing good film stacking |
Feb. 13, 2007 |
| 7176041 |
PAA-based etchant, methods of using same, and resultant structures |
Feb. 13, 2007 |
| 7172970 |
Polish method for semiconductor device planarization |
Feb. 6, 2007 |
| 7172963 |
Manufacturing method of semiconductor integrated circuit device that includes chemically and mechanically polishing two conductive layers using two polishing pads that have different propertie |
Feb. 6, 2007 |
| 7169664 |
Method of reducing wafer contamination by removing under-metal layers at the wafer edge |
Jan. 30, 2007 |
| 7163895 |
Polishing method |
Jan. 16, 2007 |
| 7163644 |
CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate |
Jan. 16, 2007 |
| 7161247 |
Polishing composition for noble metals |
Jan. 9, 2007 |
| 7160807 |
CMP of noble metals |
Jan. 9, 2007 |
| 7160739 |
Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles |
Jan. 9, 2007 |
| 7160477 |
Method for making a contact magnetic transfer template |
Jan. 9, 2007 |
| 7153777 |
Methods and apparatuses for electrochemical-mechanical polishing |
Dec. 26, 2006 |
| 7153767 |
Chemical mechanical polishing stopper film, process for producing the same, and method of chemical mechanical polishing |
Dec. 26, 2006 |
| 7153731 |
Method of forming a field effect transistor with halo implant regions |
Dec. 26, 2006 |
| 7153335 |
Tunable composition and method for chemical-mechanical planarization with aspartic acid/tolyltriazole |
Dec. 26, 2006 |
| 7151056 |
Method and apparatus for forming a planarizing pad having a film and texture elements for planarization of microelectronic substrates |
Dec. 19, 2006 |
| 7151026 |
Semiconductor processing methods |
Dec. 19, 2006 |
| 7148147 |
CMP composition containing organic nitro compounds |
Dec. 12, 2006 |
| 7148146 |
Method of fabricating an integral capacitor and gate transistor having nitride and oxide polish stop layers using chemical mechanical polishing elimination |
Dec. 12, 2006 |
| 7148145 |
Semiconductor device having T-shaped gate structure comprising in situ sidewall spacers and method of forming the semiconductor device |
Dec. 12, 2006 |
| 7148137 |
Method of forming metal line in semiconductor device |
Dec. 12, 2006 |
| 7147682 |
Polishing composition |
Dec. 12, 2006 |
| 7146593 |
Method of implementing polishing uniformity and modifying layout data |
Dec. 5, 2006 |
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