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Class Information
Number: 438/692
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal > Simultaneous (e.g., chemical-mechanical polishing, etc.)
Description: Processes wherein the chemical and mechanical material removal processes are concurrent.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7351662 |
Composition and associated method for catalyzing removal rates of dielectric films during chemical mechanical planarization |
Apr. 1, 2008 |
| 7351653 |
Method for damascene process |
Apr. 1, 2008 |
| 7351642 |
Deglaze route to compensate for film non-uniformities after STI oxide processing |
Apr. 1, 2008 |
| 7351354 |
Tungsten metal removing solution and method for removing tungsten metal by use thereof |
Apr. 1, 2008 |
| 7348277 |
Methods of fabricating semiconductor device using sacrificial layer |
Mar. 25, 2008 |
| 7348276 |
Fabrication process of semiconductor device and polishing method |
Mar. 25, 2008 |
| 7348275 |
Processing method for semiconductor wafer |
Mar. 25, 2008 |
| 7344989 |
CMP wafer contamination reduced by insitu clean |
Mar. 18, 2008 |
| 7344988 |
Alumina abrasive for chemical mechanical polishing |
Mar. 18, 2008 |
| 7344987 |
Method for CMP with variable down-force adjustment |
Mar. 18, 2008 |
| 7344955 |
Cut-and-paste imprint lithographic mold and method therefor |
Mar. 18, 2008 |
| 7342638 |
Electro-optical device, method of manufacturing the same, and method of manufacturing substrate device |
Mar. 11, 2008 |
| 7341502 |
Methods and systems for planarizing workpieces, e.g., microelectronic workpieces |
Mar. 11, 2008 |
| 7338905 |
Semiconductor device manufacture method |
Mar. 4, 2008 |
| 7338904 |
Method for manufacturing single-side mirror surface wafer |
Mar. 4, 2008 |
| 7338882 |
Method of fabricating nano SOI wafer and nano SOI wafer fabricated by the same |
Mar. 4, 2008 |
| 7335564 |
Method for forming device isolation layer of semiconductor device |
Feb. 26, 2008 |
| 7333875 |
Method of predicting CMP removal rate for CMP process in a CMP process tool in order to determine a required polishing time |
Feb. 19, 2008 |
| 7332438 |
Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool |
Feb. 19, 2008 |
| 7329608 |
Method of processing a substrate |
Feb. 12, 2008 |
| 7329606 |
Semiconductor device having nanowire contact structures and method for its fabrication |
Feb. 12, 2008 |
| 7329598 |
Method of manufacturing a semiconductor device |
Feb. 12, 2008 |
| 7329168 |
Extended Kalman filter incorporating offline metrology |
Feb. 12, 2008 |
| 7323416 |
Method and composition for polishing a substrate |
Jan. 29, 2008 |
| 7323415 |
Polishing pad for semiconductor wafer, polishing multilayered body for semiconductor wafer having same, and method for polishing semiconductor wafer |
Jan. 29, 2008 |
| 7323414 |
Method for polishing a substrate surface |
Jan. 29, 2008 |
| 7323111 |
Angle control of multi-cavity molded components for MEMS and NEMS group assembly |
Jan. 29, 2008 |
| 7322014 |
Method of implementing polishing uniformity and modifying layout data |
Jan. 22, 2008 |
| 7320940 |
Method for manufacturing electronic device including package |
Jan. 22, 2008 |
| 7319072 |
Polishing medium for chemical-mechanical polishing, and method of polishing substrate member |
Jan. 15, 2008 |
| 7318870 |
Method of cleaning semiconductor substrate |
Jan. 15, 2008 |
| 7316977 |
Chemical-mechanical planarization composition having ketooxime compounds and associated method for use |
Jan. 8, 2008 |
| 7316976 |
Polishing method to reduce dishing of tungsten on a dielectric |
Jan. 8, 2008 |
| 7316603 |
Compositions and methods for tantalum CMP |
Jan. 8, 2008 |
| 7314831 |
Copper line of semiconductor device and method for forming the same |
Jan. 1, 2008 |
| 7312486 |
Stripe board dummy metal for reducing coupling capacitance |
Dec. 25, 2007 |
| 7312154 |
Method of polishing a semiconductor-on-insulator structure |
Dec. 25, 2007 |
| 7311856 |
Polymeric inhibitors for enhanced planarization |
Dec. 25, 2007 |
| 7311855 |
Polishing slurry for chemical mechanical polishing and method for polishing substrate |
Dec. 25, 2007 |
| 7309653 |
Method of forming damascene filament wires and the structure so formed |
Dec. 18, 2007 |
| 7309624 |
Semiconductor device and method for the fabrication thereof including grinding a major portion of the frame |
Dec. 18, 2007 |
| 7307023 |
Polishing method of Cu film and method for manufacturing semiconductor device |
Dec. 11, 2007 |
| 7307022 |
Method of treating conductive layer for use in a circuitized substrate and method of making said substrate having said conductive layer as part thereof |
Dec. 11, 2007 |
| 7306954 |
Process flow for building MRAM structures |
Dec. 11, 2007 |
| 7306637 |
Anionic abrasive particles treated with positively charged polyelectrolytes for CMP |
Dec. 11, 2007 |
| 7303993 |
Chemical mechanical polishing compositions and methods relating thereto |
Dec. 4, 2007 |
| 7303691 |
Polishing method for semiconductor wafer |
Dec. 4, 2007 |
| 7300877 |
Method of manufacturing a semiconductor device |
Nov. 27, 2007 |
| 7300876 |
Method for cleaning slurry particles from a surface polished by chemical mechanical polishing |
Nov. 27, 2007 |
| 7300875 |
Post metal chemical mechanical polishing dry cleaning |
Nov. 27, 2007 |
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