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Class Information
Number: 438/692
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal > Simultaneous (e.g., chemical-mechanical polishing, etc.)
Description: Processes wherein the chemical and mechanical material removal processes are concurrent.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6686283 |
Shallow trench isolation planarization using self aligned isotropic etch |
Feb. 3, 2004 |
| 6686284 |
Chemical mechanical polisher equipped with chilled retaining ring and method of using |
Feb. 3, 2004 |
| 6686285 |
Semiconductor device manufacture method preventing dishing and erosion during chemical mechanical polishing |
Feb. 3, 2004 |
| 6682398 |
Method for characterizing the planarizing properties of an expendable material combination in a chemical-mechanical polishing process; simulation technique; and polishing technique |
Jan. 27, 2004 |
| 6682575 |
Methanol-containing silica-based CMP compositions |
Jan. 27, 2004 |
| 6682985 |
Semiconductor device and manufacturing method thereof |
Jan. 27, 2004 |
| 6683004 |
Method of manufacturing a semiconductor device, and semiconductor device manufactured thereby |
Jan. 27, 2004 |
| 6679928 |
Polishing composition having a surfactant |
Jan. 20, 2004 |
| 6679929 |
Polishing composition and polishing method employing it |
Jan. 20, 2004 |
| 6680252 |
Method for planarizing barc layer in dual damascene process |
Jan. 20, 2004 |
| 6676718 |
Polishing of semiconductor substrates |
Jan. 13, 2004 |
| 6676719 |
Aqueous dispersion, a process for the preparation and the use thereof |
Jan. 13, 2004 |
| 6677239 |
Methods and compositions for chemical mechanical polishing |
Jan. 13, 2004 |
| 6676487 |
Method for polishing surface of vapor-phase synthesized thin diamond film |
Jan. 13, 2004 |
| 6676496 |
Apparatus for processing semiconductor wafers |
Jan. 13, 2004 |
| 6673634 |
Wafer protection method |
Jan. 6, 2004 |
| 6675058 |
Method and apparatus for controlling the flow of wafers through a process flow |
Jan. 6, 2004 |
| 6670272 |
Method for reducing dishing in chemical mechanical polishing |
Dec. 30, 2003 |
| 6670274 |
Method of forming a copper damascene structure comprising a recessed copper-oxide-free initial copper structure |
Dec. 30, 2003 |
| 6667238 |
Polishing method and apparatus |
Dec. 23, 2003 |
| 6667239 |
Chemical mechanical polishing of copper-oxide damascene structures |
Dec. 23, 2003 |
| RE38363 |
Method of forming trench isolation having polishing step and method of manufacturing semiconductor device |
Dec. 23, 2003 |
| 6663683 |
Aqueous dispersions, process for their production, and their use |
Dec. 16, 2003 |
| 6664188 |
Semiconductor wafer with a resistant film |
Dec. 16, 2003 |
| 6664189 |
Removal of wafer edge defocus due to CMP |
Dec. 16, 2003 |
| 6660636 |
Highly selective and complete interconnect metal line and via/contact hole filling by electroless plating |
Dec. 9, 2003 |
| 6660637 |
Process for chemical mechanical polishing |
Dec. 9, 2003 |
| 6660638 |
CMP process leaving no residual oxide layer or slurry particles |
Dec. 9, 2003 |
| 6660639 |
Method of fabricating a copper damascene structure |
Dec. 9, 2003 |
| 6656241 |
Silica-based slurry |
Dec. 2, 2003 |
| 6656818 |
Manufacturing process for semiconductor wafer comprising surface grinding and planarization or polishing |
Dec. 2, 2003 |
| 6656842 |
Barrier layer buffing after Cu CMP |
Dec. 2, 2003 |
| 6652708 |
Methods and apparatus for conditioning and temperature control of a processing surface |
Nov. 25, 2003 |
| 6652764 |
Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates |
Nov. 25, 2003 |
| 6653194 |
Method for forming contact hole in semiconductor device |
Nov. 25, 2003 |
| 6653202 |
Method of shallow trench isolation (STI) formation using amorphous carbon |
Nov. 25, 2003 |
| 6649451 |
Structure and method for wafer comprising dielectric and semiconductor |
Nov. 18, 2003 |
| 6649460 |
Fabricating a substantially self-aligned MOSFET |
Nov. 18, 2003 |
| 6649523 |
Method and system to provide material removal and planarization employing a reactive pad |
Nov. 18, 2003 |
| 6645051 |
Polishing composition and polishing method for polishing a substrate to be used for a memory hard disk employing it |
Nov. 11, 2003 |
| 6645825 |
Planarization of shallow trench isolation (STI) |
Nov. 11, 2003 |
| 6645862 |
Double-side polishing process with reduced scratch rate and device for carrying out the process |
Nov. 11, 2003 |
| 6645863 |
Method of manufacturing semiconductor device and semiconductor device |
Nov. 11, 2003 |
| 6645864 |
Physical vapor deposition of an amorphous silicon liner to eliminate resist poisoning |
Nov. 11, 2003 |
| 6645865 |
Methods, apparatuses and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes |
Nov. 11, 2003 |
| 6645866 |
Method of fabricating a semiconductor device using trench isolation method including hydrogen annealing step |
Nov. 11, 2003 |
| 6645869 |
Etching back process to improve topographic planarization of a polysilicon layer |
Nov. 11, 2003 |
| 6641630 |
CMP compositions containing iodine and an iodine vapor-trapping agent |
Nov. 4, 2003 |
| 6642147 |
Method of making thermally stable planarizing films |
Nov. 4, 2003 |
| 6638830 |
Method for fabricating a high-density capacitor |
Oct. 28, 2003 |
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