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Class Information
Number: 438/692
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal > Simultaneous (e.g., chemical-mechanical polishing, etc.)
Description: Processes wherein the chemical and mechanical material removal processes are concurrent.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6794285 |
Slurry for CMP, and method of manufacturing semiconductor device |
Sep. 21, 2004 |
| 6794289 |
Method and apparatuses for making and using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies |
Sep. 21, 2004 |
| 6794691 |
Use of irregularly shaped conductive filler features to improve planarization of the conductive layer while reducing parasitic capacitance introduced by the filler features |
Sep. 21, 2004 |
| 6794756 |
Integrated circuit structure having low dielectric constant material and having silicon oxynitride caps over closely spaced apart metal lines |
Sep. 21, 2004 |
| 6790678 |
Method for forming capacitor of ferroelectric random access memory |
Sep. 14, 2004 |
| 6790742 |
Chemical mechanical polishing in forming semiconductor device |
Sep. 14, 2004 |
| 6790768 |
Methods and apparatus for polishing substrates comprising conductive and dielectric materials with reduced topographical defects |
Sep. 14, 2004 |
| 6790769 |
CMP slurry and method of manufacturing semiconductor device |
Sep. 14, 2004 |
| 6790780 |
Fabrication of 3-D capacitor with dual damascene process |
Sep. 14, 2004 |
| 6790786 |
Etching processes for integrated circuit manufacturing including methods of forming capacitors |
Sep. 14, 2004 |
| 6790790 |
High modulus filler for low k materials |
Sep. 14, 2004 |
| 6786944 |
Aqueous dispersion for chemical mechanical polishing |
Sep. 7, 2004 |
| 6786945 |
Polishing compound and method for polishing substrate |
Sep. 7, 2004 |
| 6787056 |
Planarization method using anisotropic wet etching |
Sep. 7, 2004 |
| 6787061 |
Copper polish slurry for reduced interlayer dielectric erosion and method of using same |
Sep. 7, 2004 |
| 6787470 |
Sacrificial feature for corrosion prevention during CMP |
Sep. 7, 2004 |
| 6787471 |
Method of manufacturing a semiconductor device |
Sep. 7, 2004 |
| 6787472 |
Utilization of disappearing silicon hard mask for fabrication of semiconductor structures |
Sep. 7, 2004 |
| 6787473 |
Post-planarization clean-up |
Sep. 7, 2004 |
| 6783434 |
CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate |
Aug. 31, 2004 |
| 6784093 |
Copper surface passivation during semiconductor manufacturing |
Aug. 31, 2004 |
| 6784098 |
Method for forming salicide process |
Aug. 31, 2004 |
| 6780770 |
Method for stacking semiconductor die within an implanted medical device |
Aug. 24, 2004 |
| 6780771 |
Forming a substantially planar upper surface at the outer edge of a semiconductor topography |
Aug. 24, 2004 |
| 6780773 |
Method of chemical mechanical polishing with high throughput and low dishing |
Aug. 24, 2004 |
| 6780775 |
Design of lithography alignment and overlay measurement marks on CMP finished damascene surface |
Aug. 24, 2004 |
| 6776696 |
Continuous chemical mechanical polishing process for polishing multiple conductive and non-conductive layers on semiconductor wafers |
Aug. 17, 2004 |
| 6776810 |
Anionic abrasive particles treated with positively charged polyelectrolytes for CMP |
Aug. 17, 2004 |
| 6776852 |
Process of removing holefill residue from a metallic surface of an electronic substrate |
Aug. 17, 2004 |
| 6776917 |
Chemical mechanical polishing thickness control in magnetic head fabrication |
Aug. 17, 2004 |
| 6777307 |
Method of forming semiconductor structures with reduced step heights |
Aug. 17, 2004 |
| 6777335 |
Polishing method |
Aug. 17, 2004 |
| 6777336 |
Method of forming a shallow trench isolation structure |
Aug. 17, 2004 |
| 6777337 |
Planarizing method of semiconductor wafer and apparatus thereof |
Aug. 17, 2004 |
| 6777338 |
Edge and bevel cleaning process and system |
Aug. 17, 2004 |
| 6777339 |
Method for planarizing deposited film |
Aug. 17, 2004 |
| 6777341 |
Method of forming a self-aligned contact, and method of fabricating a semiconductor device having a self-aligned contact |
Aug. 17, 2004 |
| 6773476 |
Polishing composition and polishing method employing it |
Aug. 10, 2004 |
| 6774030 |
Method and system for improving the manufacturing of metal damascene structures |
Aug. 10, 2004 |
| 6774041 |
Polishing method, metallization fabrication method, method for manufacturing semiconductor device and semiconductor device |
Aug. 10, 2004 |
| 6774042 |
Planarization method for deep sub micron shallow trench isolation process |
Aug. 10, 2004 |
| 6770218 |
Composition for polishing metal on semiconductor wafer and method of using same |
Aug. 3, 2004 |
| 6770495 |
Method for revealing active regions in a SOI structure for DUT backside inspection |
Aug. 3, 2004 |
| 6770523 |
Method for semiconductor wafer planarization by CMP stop layer formation |
Aug. 3, 2004 |
| 6770552 |
Method of forming a semiconductor device having T-shaped gate structure |
Aug. 3, 2004 |
| 6767377 |
Aqueous dispersion containing cerium oxide-coated silicon powder, process for the production thereof and use thereof |
Jul. 27, 2004 |
| 6767476 |
Polishing composition for metal CMP |
Jul. 27, 2004 |
| 6767822 |
Method of forming metallic film and method of producing semiconductor system |
Jul. 27, 2004 |
| 6767826 |
Method of manufacturing semiconductor device |
Jul. 27, 2004 |
| 6764868 |
Use of slurry waste composition to determine the amount of metal removed during chemical mechanical polishing, and system for accomplishing same |
Jul. 20, 2004 |
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