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Class Information
Number: 438/692
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal > Simultaneous (e.g., chemical-mechanical polishing, etc.)
Description: Processes wherein the chemical and mechanical material removal processes are concurrent.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6831014 |
Method of manufacturing a semiconductor apparatus using chemical mechanical polishing |
Dec. 14, 2004 |
| 6831015 |
Fabrication method of semiconductor device and abrasive liquid used therein |
Dec. 14, 2004 |
| 6831016 |
Method to prevent electrical shorts between adjacent metal lines |
Dec. 14, 2004 |
| 6831047 |
Cleaning composition useful in semiconductor integrated circuit fabrication |
Dec. 14, 2004 |
| 6831307 |
Semiconductor mounting system |
Dec. 14, 2004 |
| 6827752 |
Cerium oxide slurry, and method of manufacturing substrate |
Dec. 7, 2004 |
| 6828208 |
Method of fabricating shallow trench isolation structure |
Dec. 7, 2004 |
| 6828210 |
Method of forming a device isolation trench in an integrated circuit device |
Dec. 7, 2004 |
| 6828226 |
Removal of SiON residue after CMP |
Dec. 7, 2004 |
| 6825093 |
Process window enhancement for deep trench spacer conservation |
Nov. 30, 2004 |
| 6825116 |
Method for removing structures |
Nov. 30, 2004 |
| 6825117 |
High PH slurry for chemical mechanical polishing of copper |
Nov. 30, 2004 |
| 6825118 |
Method of manufacturing semiconductor device having trench element-isolating structure |
Nov. 30, 2004 |
| 6825119 |
Method of piping defect detection |
Nov. 30, 2004 |
| 6821794 |
Flexible snapshot in endpoint detection |
Nov. 23, 2004 |
| 6821881 |
Method for chemical mechanical polishing of semiconductor substrates |
Nov. 23, 2004 |
| 6821894 |
CMP process |
Nov. 23, 2004 |
| 6821895 |
Dynamically adjustable slurry feed arm for wafer edge profile improvement in CMP |
Nov. 23, 2004 |
| 6821896 |
Method to eliminate via poison effect |
Nov. 23, 2004 |
| 6821897 |
Method for copper CMP using polymeric complexing agents |
Nov. 23, 2004 |
| 6818030 |
Process for producing abrasive particles and abrasive particles produced by the process |
Nov. 16, 2004 |
| 6818031 |
Polishing composition |
Nov. 16, 2004 |
| 6818507 |
Method of manufacturing semiconductor device including memory region and logic circuit region |
Nov. 16, 2004 |
| 6818526 |
Method for moat nitride pull back for shallow trench isolation |
Nov. 16, 2004 |
| 6814766 |
Polishing composition and polishing method employing it |
Nov. 9, 2004 |
| 6815348 |
Method of plugging through-holes in silicon substrate |
Nov. 9, 2004 |
| 6815353 |
Multi-layer film stack polish stop |
Nov. 9, 2004 |
| 6815354 |
Method and structure for thru-mask contact electrodeposition |
Nov. 9, 2004 |
| 6812544 |
Integrated circuit having oversized components |
Nov. 2, 2004 |
| 6809004 |
Method of forming a shallow trench isolation |
Oct. 26, 2004 |
| 6809031 |
Method for manufacturing a reclaimable test pattern wafer for CMP applications |
Oct. 26, 2004 |
| 6809032 |
Method and apparatus for detecting the endpoint of a chemical-mechanical polishing operation using optical techniques |
Oct. 26, 2004 |
| 6805812 |
Phosphono compound-containing polishing composition and method of using same |
Oct. 19, 2004 |
| 6806193 |
CMP in-situ conditioning with pad and retaining ring clean |
Oct. 19, 2004 |
| 6806199 |
Method for manufacturing silicon mirror wafer, silicon mirror wafer, and heat treatment furnace |
Oct. 19, 2004 |
| 6803315 |
Method for blocking implants from the gate of an electronic device via planarizing films |
Oct. 12, 2004 |
| 6803316 |
Method of planarizing by removing all or part of an oxidizable material layer from a semiconductor substrate |
Oct. 12, 2004 |
| 6803353 |
Copper chemical mechanical polishing solutions using sulfonated amphiprotic agents |
Oct. 12, 2004 |
| 6800556 |
Polishing method using ceria slurry, and method of manufacturing semiconductor device |
Oct. 5, 2004 |
| 6800557 |
Process for manufacturing semiconductor integrated circuit device |
Oct. 5, 2004 |
| 6797190 |
Wafer carrier assembly for a chemical mechanical polishing apparatus and a polishing method using the same |
Sep. 28, 2004 |
| 6797623 |
Methods of producing and polishing semiconductor device and polishing apparatus |
Sep. 28, 2004 |
| 6797624 |
Solution for ruthenium chemical mechanical planarization |
Sep. 28, 2004 |
| 6797625 |
Method of forming a protective step on the edge of a semiconductor wafer |
Sep. 28, 2004 |
| 6797626 |
Method of polishing copper layer of substrate |
Sep. 28, 2004 |
| 6797632 |
Bonded wafer producing method and bonded wafer |
Sep. 28, 2004 |
| 6797682 |
Resist stripper |
Sep. 28, 2004 |
| 6793837 |
Process for material-removing machining of both sides of semiconductor wafers |
Sep. 21, 2004 |
| 6794206 |
Method of polishing a film |
Sep. 21, 2004 |
| 6794263 |
Method of manufacturing a semiconductor device including alignment mark |
Sep. 21, 2004 |
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