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Class Information
Number: 438/692
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal > Simultaneous (e.g., chemical-mechanical polishing, etc.)
Description: Processes wherein the chemical and mechanical material removal processes are concurrent.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6857940 |
Polishing apparatus and method |
Feb. 22, 2005 |
| 6857950 |
Polishing apparatus, semiconductor device manufacturing method using the polishing apparatus, and semiconductor device manufactured by the manufacturing method |
Feb. 22, 2005 |
| 6858449 |
Process and device for the abrasive machining of surfaces, in particular semiconductor wafers |
Feb. 22, 2005 |
| 6858527 |
Method to increase electromigration resistance of copper using self-assembled organic thiolate monolayers |
Feb. 22, 2005 |
| 6858531 |
Electro chemical mechanical polishing method |
Feb. 22, 2005 |
| 6858537 |
Process for smoothing a rough surface on a substrate by dry etching |
Feb. 22, 2005 |
| 6858538 |
Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
Feb. 22, 2005 |
| 6858539 |
Post-CMP treating liquid and method for manufacturing semiconductor device |
Feb. 22, 2005 |
| 6858540 |
Selective removal of tantalum-containing barrier layer during metal CMP |
Feb. 22, 2005 |
| 6855267 |
Chemical mechanical polishing slurry |
Feb. 15, 2005 |
| 6855602 |
Method for forming a box shaped polygate |
Feb. 15, 2005 |
| 6855633 |
Method for fabricating semiconductor device |
Feb. 15, 2005 |
| 6855634 |
Polishing method and polishing apparatus |
Feb. 15, 2005 |
| 6855635 |
Coated doped oxides |
Feb. 15, 2005 |
| 6852563 |
Process of fabricating electro-optic polymer devices with polymer sustained microelectrodes |
Feb. 8, 2005 |
| 6852630 |
Electroetching process and system |
Feb. 8, 2005 |
| 6852631 |
Copper polish slurry for reduced interlayer dielectric erosion and method of using same |
Feb. 8, 2005 |
| 6852632 |
Method of polishing a multi-layer substrate |
Feb. 8, 2005 |
| 6852633 |
Method for operating chemical mechanical polishing ("CMP") tool for the manufacture of semiconductor devices |
Feb. 8, 2005 |
| 6849099 |
Polishing composition |
Feb. 1, 2005 |
| 6849493 |
Methods of forming polished material and methods of forming isolation regions |
Feb. 1, 2005 |
| 6849535 |
Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit device |
Feb. 1, 2005 |
| 6849537 |
Method of suppressing void formation in a metal line |
Feb. 1, 2005 |
| 6849547 |
Apparatus and process for polishing a workpiece |
Feb. 1, 2005 |
| 6849548 |
Method of reducing particulate contamination during polishing of a wafer |
Feb. 1, 2005 |
| 6849549 |
Method for forming dummy structures for improved CMP and reduced capacitance |
Feb. 1, 2005 |
| 6849946 |
Planarized semiconductor interconnect topography and method for polishing a metal layer to form interconnect |
Feb. 1, 2005 |
| 6847092 |
Microelectronic capacitor structure with radial current flow |
Jan. 25, 2005 |
| 6844237 |
Method for improving dielectric polishing |
Jan. 18, 2005 |
| 6844241 |
Fabrication of semiconductor structures having multiple conductive layers in an opening |
Jan. 18, 2005 |
| 6844262 |
CMP process |
Jan. 18, 2005 |
| 6844263 |
LSI device polishing composition and method for producing LSI device |
Jan. 18, 2005 |
| 6841479 |
Method of reducing in-trench smearing during polishing |
Jan. 11, 2005 |
| 6841480 |
Polyelectrolyte dispensing polishing pad, production thereof and method of polishing a substrate |
Jan. 11, 2005 |
| 6840971 |
Chemical mechanical polishing systems and methods for their use |
Jan. 11, 2005 |
| 6837942 |
Device and method for collecting and measuring chemical samples pad surface in CMP |
Jan. 4, 2005 |
| 6838016 |
Polishing composition and polishing method employing it |
Jan. 4, 2005 |
| 6838357 |
Chemical mechanical polishing for forming a shallow trench isolation structure |
Jan. 4, 2005 |
| 6838371 |
Method of manufacturing semiconductor device |
Jan. 4, 2005 |
| 6838382 |
Method and apparatus for forming a planarizing pad having a film and texture elements for planarization of microelectronic substrates |
Jan. 4, 2005 |
| 6838383 |
Copper polish slurry for reduced interlayer dielectric erosion and method of using same |
Jan. 4, 2005 |
| 6835119 |
Method for lapping and a lapping apparatus |
Dec. 28, 2004 |
| 6835645 |
Method for fabricating semiconductor device |
Dec. 28, 2004 |
| 6833109 |
Method and apparatus for storing a semiconductor wafer after its CMP polishing |
Dec. 21, 2004 |
| 6833324 |
Process and device for cleaning a semiconductor wafer |
Dec. 21, 2004 |
| 6830504 |
Barrier-slurry-free copper CMP process |
Dec. 14, 2004 |
| 6831014 |
Method of manufacturing a semiconductor apparatus using chemical mechanical polishing |
Dec. 14, 2004 |
| 6831015 |
Fabrication method of semiconductor device and abrasive liquid used therein |
Dec. 14, 2004 |
| 6831016 |
Method to prevent electrical shorts between adjacent metal lines |
Dec. 14, 2004 |
| 6831047 |
Cleaning composition useful in semiconductor integrated circuit fabrication |
Dec. 14, 2004 |
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