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Class Information
Number: 438/692
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal > Simultaneous (e.g., chemical-mechanical polishing, etc.)
Description: Processes wherein the chemical and mechanical material removal processes are concurrent.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7371686 |
Method and apparatus for polishing a semiconductor device |
May. 13, 2008 |
| 7368389 |
Methods of forming electrically conductive plugs |
May. 6, 2008 |
| 7368388 |
Cerium oxide abrasives for chemical mechanical polishing |
May. 6, 2008 |
| 7368387 |
Polishing composition and polishing method |
May. 6, 2008 |
| 7368385 |
Method for producing a structure on the surface of a substrate |
May. 6, 2008 |
| 7368066 |
Gold CMP composition and method |
May. 6, 2008 |
| 7365013 |
System for the preferential removal of silicon oxide |
Apr. 29, 2008 |
| 7365009 |
Structure of metal interconnect and fabrication method thereof |
Apr. 29, 2008 |
| 7361974 |
Manufacturing method for an integrated semiconductor structure |
Apr. 22, 2008 |
| 7361603 |
Passivative chemical mechanical polishing composition for copper film planarization |
Apr. 22, 2008 |
| 7361602 |
CMP process |
Apr. 22, 2008 |
| 7361601 |
Chemical mechanical polish process and method for improving accuracy of determining polish endpoint thereof |
Apr. 22, 2008 |
| 7361600 |
Semiconductor manufacturing apparatus having a built-in inspection apparatus and a device manufacturing method using said manufacturing apparatus |
Apr. 22, 2008 |
| 7361599 |
Integrated circuit and method |
Apr. 22, 2008 |
| 7361571 |
Method for fabricating a trench isolation with spacers |
Apr. 22, 2008 |
| 7358132 |
Self-aligned bipolar semiconductor device and fabrication method thereof |
Apr. 15, 2008 |
| 7355173 |
Delineation of wafers |
Apr. 8, 2008 |
| 7354890 |
Cleaning composition and method |
Apr. 8, 2008 |
| 7354862 |
Thin passivation layer on 3D devices |
Apr. 8, 2008 |
| 7354861 |
Polishing method and polishing liquid |
Apr. 8, 2008 |
| 7354530 |
Chemical mechanical polishing systems and methods for their use |
Apr. 8, 2008 |
| 7354527 |
Chemical mechanical polishing pad and chemical mechanical polishing process |
Apr. 8, 2008 |
| 7351662 |
Composition and associated method for catalyzing removal rates of dielectric films during chemical mechanical planarization |
Apr. 1, 2008 |
| 7351653 |
Method for damascene process |
Apr. 1, 2008 |
| 7351642 |
Deglaze route to compensate for film non-uniformities after STI oxide processing |
Apr. 1, 2008 |
| 7351354 |
Tungsten metal removing solution and method for removing tungsten metal by use thereof |
Apr. 1, 2008 |
| 7348277 |
Methods of fabricating semiconductor device using sacrificial layer |
Mar. 25, 2008 |
| 7348276 |
Fabrication process of semiconductor device and polishing method |
Mar. 25, 2008 |
| 7348275 |
Processing method for semiconductor wafer |
Mar. 25, 2008 |
| 7344989 |
CMP wafer contamination reduced by insitu clean |
Mar. 18, 2008 |
| 7344988 |
Alumina abrasive for chemical mechanical polishing |
Mar. 18, 2008 |
| 7344987 |
Method for CMP with variable down-force adjustment |
Mar. 18, 2008 |
| 7344955 |
Cut-and-paste imprint lithographic mold and method therefor |
Mar. 18, 2008 |
| 7342638 |
Electro-optical device, method of manufacturing the same, and method of manufacturing substrate device |
Mar. 11, 2008 |
| 7341502 |
Methods and systems for planarizing workpieces, e.g., microelectronic workpieces |
Mar. 11, 2008 |
| 7338905 |
Semiconductor device manufacture method |
Mar. 4, 2008 |
| 7338904 |
Method for manufacturing single-side mirror surface wafer |
Mar. 4, 2008 |
| 7338882 |
Method of fabricating nano SOI wafer and nano SOI wafer fabricated by the same |
Mar. 4, 2008 |
| 7335564 |
Method for forming device isolation layer of semiconductor device |
Feb. 26, 2008 |
| 7333875 |
Method of predicting CMP removal rate for CMP process in a CMP process tool in order to determine a required polishing time |
Feb. 19, 2008 |
| 7332438 |
Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool |
Feb. 19, 2008 |
| 7329608 |
Method of processing a substrate |
Feb. 12, 2008 |
| 7329606 |
Semiconductor device having nanowire contact structures and method for its fabrication |
Feb. 12, 2008 |
| 7329598 |
Method of manufacturing a semiconductor device |
Feb. 12, 2008 |
| 7329168 |
Extended Kalman filter incorporating offline metrology |
Feb. 12, 2008 |
| 7323416 |
Method and composition for polishing a substrate |
Jan. 29, 2008 |
| 7323415 |
Polishing pad for semiconductor wafer, polishing multilayered body for semiconductor wafer having same, and method for polishing semiconductor wafer |
Jan. 29, 2008 |
| 7323414 |
Method for polishing a substrate surface |
Jan. 29, 2008 |
| 7323111 |
Angle control of multi-cavity molded components for MEMS and NEMS group assembly |
Jan. 29, 2008 |
| 7322014 |
Method of implementing polishing uniformity and modifying layout data |
Jan. 22, 2008 |
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