| |
 |
|
Class Information
Number: 438/692
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal > Simultaneous (e.g., chemical-mechanical polishing, etc.)
Description: Processes wherein the chemical and mechanical material removal processes are concurrent.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615386 |
Thick oxide film for wafer backside prior to metalization loop |
Nov. 10, 2009 |
| 7611958 |
Method of making a semiconductor element |
Nov. 3, 2009 |
| 7611552 |
Semiconductor polishing composition |
Nov. 3, 2009 |
| 7608543 |
Method for planarizing thin layer of semiconductor device |
Oct. 27, 2009 |
| 7608536 |
Method of manufacturing contact opening |
Oct. 27, 2009 |
| 7604527 |
Methods and systems for planarizing workpieces, e.g., microelectronic workpieces |
Oct. 20, 2009 |
| 7601645 |
Methods for fabricating device features having small dimensions |
Oct. 13, 2009 |
| 7601644 |
Method for manufacturing silicon wafers |
Oct. 13, 2009 |
| 7601643 |
Arrangement and method for fabricating a semiconductor wafer |
Oct. 13, 2009 |
| 7601640 |
Method of manfacturing semiconductor device |
Oct. 13, 2009 |
| 7601615 |
Method of grinding back surface of semiconductor wafer and semiconductor wafer grinding apparatus |
Oct. 13, 2009 |
| 7601273 |
Polishing slurry composition and method of using the same |
Oct. 13, 2009 |
| 7598175 |
Apparatus and method for confined area planarization |
Oct. 6, 2009 |
| 7598098 |
Monitoring the reduction in thickness as material is removed from a wafer composite and test structure for monitoring removal of material |
Oct. 6, 2009 |
| 7597729 |
Polishing composition and polishing method using the same |
Oct. 6, 2009 |
| 7589052 |
Slurry composition and method for chemical mechanical polishing of copper integrated with tungsten based barrier metals |
Sep. 15, 2009 |
| 7589023 |
Method of manufacturing semiconductor wafer |
Sep. 15, 2009 |
| 7585772 |
Process for smoothening III-N substrates |
Sep. 8, 2009 |
| 7585341 |
Polishing material comprising diamond clusters |
Sep. 8, 2009 |
| 7582565 |
Method and apparatus for semiconductor wafer planarization |
Sep. 1, 2009 |
| 7582564 |
Process and composition for conductive material removal by electrochemical mechanical polishing |
Sep. 1, 2009 |
| 7582556 |
Circuitry component and method for forming the same |
Sep. 1, 2009 |
| 7582221 |
Wafer manufacturing method, polishing apparatus, and wafer |
Sep. 1, 2009 |
| 7582127 |
Polishing composition for a tungsten-containing substrate |
Sep. 1, 2009 |
| 7579279 |
Method to passivate conductive surfaces during semiconductor processing |
Aug. 25, 2009 |
| 7575615 |
Process for preparing a polishing composition |
Aug. 18, 2009 |
| 7566663 |
Method for manufacturing semiconductor device or semiconductor wafer using a chucking unit |
Jul. 28, 2009 |
| 7563717 |
Method for fabricating a semiconductor device |
Jul. 21, 2009 |
| 7563383 |
CMP composition with a polymer additive for polishing noble metals |
Jul. 21, 2009 |
| 7562662 |
Cleaning solution and cleaning method of a semiconductor device |
Jul. 21, 2009 |
| 7560384 |
Chemical mechanical polishing method |
Jul. 14, 2009 |
| 7557041 |
Apparatus and method for supplying chemicals |
Jul. 7, 2009 |
| 7556972 |
Detection and characterization of SiCOH-based dielectric materials during device fabrication |
Jul. 7, 2009 |
| 7554199 |
Substrate for evaluation |
Jun. 30, 2009 |
| 7553768 |
Substrate and a method for polishing a substrate |
Jun. 30, 2009 |
| 7553763 |
Salicide process utilizing a cluster ion implantation process |
Jun. 30, 2009 |
| 7553677 |
Method for manufacturing ferroelectric memory |
Jun. 30, 2009 |
| 7553430 |
Polishing slurries and methods for chemical mechanical polishing |
Jun. 30, 2009 |
| RE40790 |
Method for making electrical contact with an active area through sub-micron contact openings and a semiconductor device |
Jun. 23, 2009 |
| 7550388 |
Polishing composition and polishing method |
Jun. 23, 2009 |
| 7550092 |
Chemical mechanical polishing composition |
Jun. 23, 2009 |
| 7550020 |
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method |
Jun. 23, 2009 |
| 7544618 |
Two-step chemical mechanical polishing process |
Jun. 9, 2009 |
| 7544606 |
Method to implement stress free polishing |
Jun. 9, 2009 |
| 7544307 |
Metal polishing liquid and polishing method using it |
Jun. 9, 2009 |
| 7541287 |
Method for machining a semiconductor wafer on both sides in a carrier, carrier, and a semiconductor wafer produced by the method |
Jun. 2, 2009 |
| 7540080 |
Method for mounting component by suction nozzle |
Jun. 2, 2009 |
| 7538035 |
Lapping of gold pads in a liquid medium for work hardening the surface of the pads |
May. 26, 2009 |
| 7538028 |
Barrier layer, IC via, and IC line forming methods |
May. 26, 2009 |
| 7537833 |
Pyrogenically produced silicon dioxide powder and dispersion thereof |
May. 26, 2009 |
|
|
|
