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Class Information
Number: 438/692
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal > Simultaneous (e.g., chemical-mechanical polishing, etc.)
Description: Processes wherein the chemical and mechanical material removal processes are concurrent.










Sub-classes under this class:

Class Number Class Name Patents
438/693 Utilizing particulate abradant 1,139


Patents under this class:

Patent Number Title Of Patent Date Issued
8709952 Etching method, etching apparatus, and computer-readable recording medium Apr. 29, 2014
8709944 Method to alter silicide properties using GCIB treatment Apr. 29, 2014
8709915 Method of manufacturing semiconductor device Apr. 29, 2014
8709278 Polishing composition Apr. 29, 2014
8703607 Method to alter silicide properties using GCIB treatment Apr. 22, 2014
8703004 Method for chemical planarization and chemical planarization apparatus Apr. 22, 2014
8702472 Polishing composition and polishing method using the same Apr. 22, 2014
8691695 CMP compositions and methods for suppressing polysilicon removal rates Apr. 8, 2014
8685909 Antioxidants for post-CMP cleaning formulations Apr. 1, 2014
8685857 Chemical mechanical polishing method of organic film and method of manufacturing semiconductor device Apr. 1, 2014
8685270 Method for producing a semiconductor wafer Apr. 1, 2014
8679980 Aqueous metal polishing agent comprising a polymeric abrasiv containing pendant functional groups and its use in a CMP process Mar. 25, 2014
8679979 Using optical metrology for within wafer feed forward process control Mar. 25, 2014
8679360 Base surface processing method and MEMS device Mar. 25, 2014
8674410 Method of manufacturing metal silicide and semiconductor structure using the same Mar. 18, 2014
8673784 Method for producing silicon epitaxial wafer Mar. 18, 2014
8673783 Metal conductor chemical mechanical polish Mar. 18, 2014
8673781 Plasma etching method Mar. 18, 2014
8673770 Methods of forming conductive structures in dielectric layers on an integrated circuit device Mar. 18, 2014
8673768 Fabrication method for improving surface planarity after tungsten chemical mechanical polishing Mar. 18, 2014
8669184 Method for improving flatness of a layer deposited on polycrystalline layer Mar. 11, 2014
8668553 Method of manufacturing semiconductor device Mar. 11, 2014
8666665 Automatic initiation of reference spectra library generation for optical monitoring Mar. 4, 2014
8665605 Substrate structure and package structure using the same Mar. 4, 2014
8664118 Semiconductor device and method for manufacturing the same Mar. 4, 2014
8663490 Semiconductor wafer handler Mar. 4, 2014
8658538 Method of fabricating memory device Feb. 25, 2014
8652295 CMP tool implementing cyclic self-limiting CM process Feb. 18, 2014
8647991 Method for forming dual damascene opening Feb. 11, 2014
8647987 Method for improving uniformity of chemical-mechanical planarization process Feb. 11, 2014
8647986 Semiconductor process Feb. 11, 2014
8647985 Method for polishing a substrate composed of semiconductor material Feb. 11, 2014
8647965 Radiographic image detector, method of producing the same, and protective member Feb. 11, 2014
8641920 Polishing composition for planarizing metal layer Feb. 4, 2014
8637405 Silicon surface texturing method for reducing surface reflectance Jan. 28, 2014
8637404 Metal cations for initiating polishing Jan. 28, 2014
8637403 Locally tailoring chemical mechanical polishing (CMP) polish rate for dielectrics Jan. 28, 2014
8636917 Solution for forming polishing slurry, polishing slurry and related methods Jan. 28, 2014
8636913 Removing residues in magnetic head fabrication Jan. 28, 2014
8633111 Composition for polishing surfaces of silicon dioxide Jan. 21, 2014
8629064 Multiple patterning lithography using spacer and self-aligned assist patterns Jan. 14, 2014
8629063 Forming features on a substrate having varying feature densities Jan. 14, 2014
8629031 Method for manufacturing SOI substrate and semiconductor device Jan. 14, 2014
8623767 Method for polishing aluminum/copper and titanium in damascene structures Jan. 7, 2014
8623766 Composition and method for polishing aluminum semiconductor substrates Jan. 7, 2014
8623674 Method of manufacturing liquid ejection head substrate Jan. 7, 2014
8623673 Structure and method for detecting defects in BEOL processing Jan. 7, 2014
8618036 Aqueous cerium-containing solution having an extended bath lifetime for removing mask material Dec. 31, 2013
8617994 Polishing liquid composition Dec. 31, 2013
8617908 Method for producing a substrate including a step of thinning with stop when a porous zone is detected Dec. 31, 2013











 
 
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