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Class Information
Number: 438/692
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal > Simultaneous (e.g., chemical-mechanical polishing, etc.)
Description: Processes wherein the chemical and mechanical material removal processes are concurrent.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 8709952 |
Etching method, etching apparatus, and computer-readable recording medium |
Apr. 29, 2014 |
| 8709944 |
Method to alter silicide properties using GCIB treatment |
Apr. 29, 2014 |
| 8709915 |
Method of manufacturing semiconductor device |
Apr. 29, 2014 |
| 8709278 |
Polishing composition |
Apr. 29, 2014 |
| 8703607 |
Method to alter silicide properties using GCIB treatment |
Apr. 22, 2014 |
| 8703004 |
Method for chemical planarization and chemical planarization apparatus |
Apr. 22, 2014 |
| 8702472 |
Polishing composition and polishing method using the same |
Apr. 22, 2014 |
| 8691695 |
CMP compositions and methods for suppressing polysilicon removal rates |
Apr. 8, 2014 |
| 8685909 |
Antioxidants for post-CMP cleaning formulations |
Apr. 1, 2014 |
| 8685857 |
Chemical mechanical polishing method of organic film and method of manufacturing semiconductor device |
Apr. 1, 2014 |
| 8685270 |
Method for producing a semiconductor wafer |
Apr. 1, 2014 |
| 8679980 |
Aqueous metal polishing agent comprising a polymeric abrasiv containing pendant functional groups and its use in a CMP process |
Mar. 25, 2014 |
| 8679979 |
Using optical metrology for within wafer feed forward process control |
Mar. 25, 2014 |
| 8679360 |
Base surface processing method and MEMS device |
Mar. 25, 2014 |
| 8674410 |
Method of manufacturing metal silicide and semiconductor structure using the same |
Mar. 18, 2014 |
| 8673784 |
Method for producing silicon epitaxial wafer |
Mar. 18, 2014 |
| 8673783 |
Metal conductor chemical mechanical polish |
Mar. 18, 2014 |
| 8673781 |
Plasma etching method |
Mar. 18, 2014 |
| 8673770 |
Methods of forming conductive structures in dielectric layers on an integrated circuit device |
Mar. 18, 2014 |
| 8673768 |
Fabrication method for improving surface planarity after tungsten chemical mechanical polishing |
Mar. 18, 2014 |
| 8669184 |
Method for improving flatness of a layer deposited on polycrystalline layer |
Mar. 11, 2014 |
| 8668553 |
Method of manufacturing semiconductor device |
Mar. 11, 2014 |
| 8666665 |
Automatic initiation of reference spectra library generation for optical monitoring |
Mar. 4, 2014 |
| 8665605 |
Substrate structure and package structure using the same |
Mar. 4, 2014 |
| 8664118 |
Semiconductor device and method for manufacturing the same |
Mar. 4, 2014 |
| 8663490 |
Semiconductor wafer handler |
Mar. 4, 2014 |
| 8658538 |
Method of fabricating memory device |
Feb. 25, 2014 |
| 8652295 |
CMP tool implementing cyclic self-limiting CM process |
Feb. 18, 2014 |
| 8647991 |
Method for forming dual damascene opening |
Feb. 11, 2014 |
| 8647987 |
Method for improving uniformity of chemical-mechanical planarization process |
Feb. 11, 2014 |
| 8647986 |
Semiconductor process |
Feb. 11, 2014 |
| 8647985 |
Method for polishing a substrate composed of semiconductor material |
Feb. 11, 2014 |
| 8647965 |
Radiographic image detector, method of producing the same, and protective member |
Feb. 11, 2014 |
| 8641920 |
Polishing composition for planarizing metal layer |
Feb. 4, 2014 |
| 8637405 |
Silicon surface texturing method for reducing surface reflectance |
Jan. 28, 2014 |
| 8637404 |
Metal cations for initiating polishing |
Jan. 28, 2014 |
| 8637403 |
Locally tailoring chemical mechanical polishing (CMP) polish rate for dielectrics |
Jan. 28, 2014 |
| 8636917 |
Solution for forming polishing slurry, polishing slurry and related methods |
Jan. 28, 2014 |
| 8636913 |
Removing residues in magnetic head fabrication |
Jan. 28, 2014 |
| 8633111 |
Composition for polishing surfaces of silicon dioxide |
Jan. 21, 2014 |
| 8629064 |
Multiple patterning lithography using spacer and self-aligned assist patterns |
Jan. 14, 2014 |
| 8629063 |
Forming features on a substrate having varying feature densities |
Jan. 14, 2014 |
| 8629031 |
Method for manufacturing SOI substrate and semiconductor device |
Jan. 14, 2014 |
| 8623767 |
Method for polishing aluminum/copper and titanium in damascene structures |
Jan. 7, 2014 |
| 8623766 |
Composition and method for polishing aluminum semiconductor substrates |
Jan. 7, 2014 |
| 8623674 |
Method of manufacturing liquid ejection head substrate |
Jan. 7, 2014 |
| 8623673 |
Structure and method for detecting defects in BEOL processing |
Jan. 7, 2014 |
| 8618036 |
Aqueous cerium-containing solution having an extended bath lifetime for removing mask material |
Dec. 31, 2013 |
| 8617994 |
Polishing liquid composition |
Dec. 31, 2013 |
| 8617908 |
Method for producing a substrate including a step of thinning with stop when a porous zone is detected |
Dec. 31, 2013 |
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