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Class Information
Number: 438/691
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal
Description: Processes wherein the nonchemical material removal is a mechanical (e.g., abrading, cutting, etc.) removal method.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6514815 |
Method for fabricating polysilicon capacitor |
Feb. 4, 2003 |
| 6514862 |
Wafer polishing slurry and chemical mechanical polishing (CMP) method using the same |
Feb. 4, 2003 |
| 6514673 |
Rule to determine CMP polish time |
Feb. 4, 2003 |
| 6511859 |
IC-compatible parylene MEMS technology and its application in integrated sensors |
Jan. 28, 2003 |
| 6511914 |
Reactor for processing a workpiece using sonic energy |
Jan. 28, 2003 |
| 6509273 |
Method for manufacturing a semiconductor device |
Jan. 21, 2003 |
| 6509270 |
Method for polishing a semiconductor topography |
Jan. 21, 2003 |
| 6509269 |
Elimination of pad glazing for Al CMP |
Jan. 21, 2003 |
| 6506679 |
Deadhesion method and mechanism for wafer processing |
Jan. 14, 2003 |
| 6506660 |
Semiconductor with nanoscale features |
Jan. 14, 2003 |
| 6503837 |
Method of rinsing residual etching reactants/products on a semiconductor wafer |
Jan. 7, 2003 |
| 6503836 |
Method and apparatus for manufacturing semiconductor device |
Jan. 7, 2003 |
| 6503839 |
Endpoint stabilization for polishing process |
Jan. 7, 2003 |
| 6498102 |
Method for planarizing a semiconductor device using ceria-based slurry |
Dec. 24, 2002 |
| 6498101 |
Planarizing pads, planarizing machines and methods for making and using planarizing pads in mechanical and chemical-mechanical planarization of microelectronic device substrate assemblies |
Dec. 24, 2002 |
| 6498100 |
Method of manufacturing semiconductor devices |
Dec. 24, 2002 |
| 6495463 |
Method for chemical mechanical polishing |
Dec. 17, 2002 |
| 6495464 |
Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool |
Dec. 17, 2002 |
| 6495465 |
Method for appraising the condition of a semiconductor polishing cloth |
Dec. 17, 2002 |
| 6491836 |
Semiconductor wafer and production method therefor |
Dec. 10, 2002 |
| 6490497 |
Working process end point real time determination method |
Dec. 3, 2002 |
| 6489243 |
Method for polishing semiconductor device |
Dec. 3, 2002 |
| 6489242 |
Process for planarization of integrated circuit structure which inhibits cracking of low dielectric constant dielectric material adjacent underlying raised structures |
Dec. 3, 2002 |
| 6482743 |
Method of forming a semiconductor device using CMP to polish a metal film |
Nov. 19, 2002 |
| 6479385 |
Interlevel dielectric composite layer for insulation of polysilicon and metal structures |
Nov. 12, 2002 |
| 6479387 |
Method for reducing micro-particle adsorption effects |
Nov. 12, 2002 |
| 6479389 |
Method of doping copper metallization |
Nov. 12, 2002 |
| 6479443 |
Cleaning solution and method for cleaning semiconductor substrates after polishing of copper film |
Nov. 12, 2002 |
| 6475914 |
Method of manufacturing semiconductor device for protecting Cu layer from post chemical mechanical polishing-corrosion |
Nov. 5, 2002 |
| 6475398 |
Semiconductor device incorporating hemispherical solid immersion lens, apparatus and method for manufacturing same |
Nov. 5, 2002 |
| 6468909 |
Isolation and/or removal of ionic contaminants from planarization fluid compositions using macrocyclic polyethers and methods of using such compositions |
Oct. 22, 2002 |
| 6468897 |
Method of forming damascene structure |
Oct. 22, 2002 |
| 6465327 |
Method for producing a thin membrane and resulting structure with membrane |
Oct. 15, 2002 |
| 6461965 |
Method for effecting a finishing operation on a semiconductor workpiece |
Oct. 8, 2002 |
| 6462409 |
Semiconductor wafer polishing apparatus |
Oct. 8, 2002 |
| 6458688 |
Semiconductor wafer with improved flatness, and process for producing the semiconductor wafer |
Oct. 1, 2002 |
| 6458289 |
CMP slurry for polishing semiconductor wafers and related methods |
Oct. 1, 2002 |
| 6455432 |
Method for removing carbon-rich particles adhered on a copper surface |
Sep. 24, 2002 |
| 6455431 |
NH3 plasma descumming and resist stripping in semiconductor applications |
Sep. 24, 2002 |
| 6455430 |
Method of embedding contact hole by damascene method |
Sep. 24, 2002 |
| 6455428 |
Method of forming a metal silicide layer |
Sep. 24, 2002 |
| 6451697 |
Method for abrasive-free metal CMP in passivation domain |
Sep. 17, 2002 |
| 6451696 |
Method for reclaiming wafer substrate and polishing solution compositions therefor |
Sep. 17, 2002 |
| 6451700 |
Method and apparatus for measuring planarity of a polished layer |
Sep. 17, 2002 |
| 6448164 |
Dark field image reversal for gate or line patterning |
Sep. 10, 2002 |
| 6444582 |
Methods for removing silicon-oxy-nitride layer and wafer surface cleaning |
Sep. 3, 2002 |
| 6444491 |
Composite semiconductor devices and method for manufacture thereof |
Sep. 3, 2002 |
| 6440856 |
Cleaning agent for semiconductor parts and method for cleaning semiconductor parts |
Aug. 27, 2002 |
| 6440855 |
Method of processing surface of workpiece and method of forming semiconductor thin layer |
Aug. 27, 2002 |
| 6436829 |
Two phase chemical/mechanical polishing process for tungsten layers |
Aug. 20, 2002 |
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