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Class Information
Number: 438/691
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal
Description: Processes wherein the nonchemical material removal is a mechanical (e.g., abrading, cutting, etc.) removal method.

Sub-classes under this class:

Class Number Class Name Patents
438/692 Simultaneous (e.g., chemical-mechanical polishing, etc.) 2,959

Patents under this class:

Patent Number Title Of Patent Date Issued
7196009 Lapping carrier, apparatus for lapping a wafer and method of fabricating a lapping carrier Mar. 27, 2007
7189651 Stopper for chemical mechanical planarization, method for manufacturing same, and chemical mechanical planarization method Mar. 13, 2007
7188630 Method to passivate conductive surfaces during semiconductor processing Mar. 13, 2007
7183212 Polishing method, metallization fabrication method, method for manufacturing semiconductor device and semiconductor device Feb. 27, 2007
7183211 Process for chemical mechanical polishing of semiconductor substrate and aqueous dispersion for chemical mechanical polishing Feb. 27, 2007
7176135 EBR shape of spin-on low-k material providing good film stacking Feb. 13, 2007
7169664 Method of reducing wafer contamination by removing under-metal layers at the wafer edge Jan. 30, 2007
7169322 Aqueous dispersion, process for its production and use Jan. 30, 2007
7160807 CMP of noble metals Jan. 9, 2007
7157376 Method and apparatus for handling thin semiconductor wafers Jan. 2, 2007
7151056 Method and apparatus for forming a planarizing pad having a film and texture elements for planarization of microelectronic substrates Dec. 19, 2006
7148098 System and method of forming a split-gate flash memory structure Dec. 12, 2006
7144816 Polysilicon opening polish Dec. 5, 2006
7141503 Methods for manufacturing a soft error and defect resistant pre-metal dielectric layer Nov. 28, 2006
7141502 Slurry-less polishing for removal of excess interconnect material during fabrication of a silicon integrated circuit Nov. 28, 2006
7141501 Polishing method, polishing apparatus, and method of manufacturing semiconductor device Nov. 28, 2006
7141275 Imprinting lithography using the liquid/solid transition of metals and their alloys Nov. 28, 2006
RE39413 Low friction polish-stop stratum for endpointing chemical-mechanical planarization processing of semiconductor wafers Nov. 28, 2006
7132367 Polishing method Nov. 7, 2006
7129582 Reducing the migration of grain boundaries Oct. 31, 2006
7125801 Method of manufacturing Group III nitride crystal substrate, etchant used in the method, Group III nitride crystal substrate, and semiconductor device including the same Oct. 24, 2006
7122475 Methods for using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies Oct. 17, 2006
7115510 Method for electrochemically processing a workpiece Oct. 3, 2006
7105449 Method for cleaning substrate and method for producing semiconductor device Sep. 12, 2006
7100263 Structure manufacturing method Sep. 5, 2006
7101800 Chemical-mechanical polishing slurry and method Sep. 5, 2006
7098098 Methods for transistors formation using selective gate implantation Aug. 29, 2006
7094679 Carbon nanotube interconnect Aug. 22, 2006
7094695 Apparatus and method for conditioning a polishing pad used for mechanical and/or chemical-mechanical planarization Aug. 22, 2006
7091103 TEOS assisted oxide CMP process Aug. 15, 2006
7087527 Extended kalman filter incorporating offline metrology Aug. 8, 2006
7084022 Method of manufacturing a semiconductor device including forming a pattern, an interlayer insulation film, exposing the patterning and flattening Aug. 1, 2006
7084063 Fabrication method of semiconductor integrated circuit device Aug. 1, 2006
7081403 Thin leadless plastic chip carrier Jul. 25, 2006
7078343 Method of manufacturing compound semiconductor wafer Jul. 18, 2006
7078352 Methods for selective integration of airgaps and devices made by such methods Jul. 18, 2006
7074721 Method for forming thick copper self-aligned dual damascene Jul. 11, 2006
7071104 Laser alignment target Jul. 4, 2006
7071105 Method of polishing a silicon-containing dielectric Jul. 4, 2006
7071107 Method for manufacturing a semiconductor device Jul. 4, 2006
7067427 Manufacturing method of semiconductor device Jun. 27, 2006
7067431 Method of forming damascene pattern in a semiconductor device Jun. 27, 2006
7064070 Removal of CMP and post-CMP residue from semiconductors using supercritical carbon dioxide process Jun. 20, 2006
7060621 Slurry for CMP, polishing method and method of manufacturing semiconductor device Jun. 13, 2006
7056812 Process for strengthening semiconductor substrates following thinning Jun. 6, 2006
7052620 Polishing slurry for aluminum-based metal, and method of manufacturing semiconductor device May. 30, 2006
7052994 Method for manufacturing semiconductor device, and processing system and semiconductor device May. 30, 2006
7052995 Process of manufacturing semiconductor device including chemical-mechanical polishing May. 30, 2006
7049236 Method of manufacturing a semiconductor device May. 23, 2006
7040966 Carbonation of pH controlled KOH solution for improved polishing of oxide films on semiconductor wafers May. 9, 2006

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