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Class Information
Number: 438/691
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal
Description: Processes wherein the nonchemical material removal is a mechanical (e.g., abrading, cutting, etc.) removal method.










Sub-classes under this class:

Class Number Class Name Patents
438/692 Simultaneous (e.g., chemical-mechanical polishing, etc.) 2,959


Patents under this class:

Patent Number Title Of Patent Date Issued
7354530 Chemical mechanical polishing systems and methods for their use Apr. 8, 2008
7351662 Composition and associated method for catalyzing removal rates of dielectric films during chemical mechanical planarization Apr. 1, 2008
7348276 Fabrication process of semiconductor device and polishing method Mar. 25, 2008
7344988 Alumina abrasive for chemical mechanical polishing Mar. 18, 2008
7344987 Method for CMP with variable down-force adjustment Mar. 18, 2008
7335600 Method for removing photoresist Feb. 26, 2008
7335599 Method and apparatus for making coplanar isolated regions of different semiconductor materials on a substrate Feb. 26, 2008
7335598 Chemical-mechanical polishing method Feb. 26, 2008
7335239 Chemical mechanical planarization pad Feb. 26, 2008
7332437 Method for processing semiconductor wafer and semiconductor wafer Feb. 19, 2008
7323415 Polishing pad for semiconductor wafer, polishing multilayered body for semiconductor wafer having same, and method for polishing semiconductor wafer Jan. 29, 2008
7323414 Method for polishing a substrate surface Jan. 29, 2008
7323413 Method for stripping silicon nitride Jan. 29, 2008
7319072 Polishing medium for chemical-mechanical polishing, and method of polishing substrate member Jan. 15, 2008
7318870 Method of cleaning semiconductor substrate Jan. 15, 2008
7316976 Polishing method to reduce dishing of tungsten on a dielectric Jan. 8, 2008
7312154 Method of polishing a semiconductor-on-insulator structure Dec. 25, 2007
7309653 Method of forming damascene filament wires and the structure so formed Dec. 18, 2007
7307021 Method for planarizing a thin film Dec. 11, 2007
7300874 Chemical mechanical polishing compositions and methods relating thereto Nov. 27, 2007
7297632 Scratch reduction for chemical mechanical polishing Nov. 20, 2007
7294575 Chemical mechanical polishing process for forming shallow trench isolation structure Nov. 13, 2007
7294569 Semiconductor device fabrication method and semiconductor device fabrication system for minimizing film-thickness variations Nov. 13, 2007
7291561 MEMS device integrated chip package, and method of making same Nov. 6, 2007
7288206 High-purity alkali etching solution for silicon wafers and use thereof Oct. 30, 2007
7287314 One step copper damascene CMP process and slurry Oct. 30, 2007
7285496 Hardening of copper to improve copper CMP performance Oct. 23, 2007
7285145 Electro chemical mechanical polishing method and device for planarizing semiconductor surfaces Oct. 23, 2007
7276446 Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies Oct. 2, 2007
7276445 Method for forming pattern using printing method Oct. 2, 2007
7271100 Slurry composition, polishing method using the slurry composition and method of forming a gate pattern using the slurry composition Sep. 18, 2007
7265054 Chemical mechanical polishing method for manufacturing semiconductor device Sep. 4, 2007
7253111 Barrier polishing solution Aug. 7, 2007
7247566 CMP method for copper, tungsten, titanium, polysilicon, and other substrates using organosulfonic acids as oxidizers Jul. 24, 2007
7247558 Method and system for electroprocessing conductive layers Jul. 24, 2007
7244678 Methods for planarization of Group VIII metal-containing surfaces using complexing agents Jul. 17, 2007
7238606 Semiconductor devices and method for fabricating the same Jul. 3, 2007
7235488 In-situ chemical-mechanical planarization pad metrology using ultrasonic imaging Jun. 26, 2007
7230335 Inspection methods and structures for visualizing and/or detecting specific chip structures Jun. 12, 2007
7229926 Method of manufacturing nitride substrate for semiconductors, and nitride semiconductor substrate Jun. 12, 2007
7226864 Method for producing a silicon wafer Jun. 5, 2007
7223685 Damascene fabrication with electrochemical layer removal May. 29, 2007
7217650 Metallic nanowire interconnections for integrated circuit fabrication May. 15, 2007
7214623 Planarization system and method using a carbonate containing fluid May. 8, 2007
7208417 Apparatus and method for supplying chemicals Apr. 24, 2007
7205239 Method of manufacturing semiconductor wafer and method of manufacturing semiconductor device Apr. 17, 2007
7205238 Chemical mechanical polish of PCMO thin films for RRAM applications Apr. 17, 2007
7205236 Semiconductor substrate polishing methods and equipment Apr. 17, 2007
7199054 Semiconductor memory device and method for fabricating the same Apr. 3, 2007
7196011 Apparatus and method for treating substrates Mar. 27, 2007











 
 
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