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Class Information
Number: 438/691
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal
Description: Processes wherein the nonchemical material removal is a mechanical (e.g., abrading, cutting, etc.) removal method.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6617251 |
Method of shallow trench isolation formation and planarization |
Sep. 9, 2003 |
| 6613675 |
Methods, apparatuses, and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes |
Sep. 2, 2003 |
| 6613676 |
Process of reclamation of SOI substrate and reproduced substrate |
Sep. 2, 2003 |
| 6610596 |
Method of forming metal interconnection using plating and semiconductor device manufactured by the method |
Aug. 26, 2003 |
| 6607983 |
Method of processing a defect source at a wafer edge region in a semiconductor manufacturing |
Aug. 19, 2003 |
| 6605537 |
Polishing of metal substrates |
Aug. 12, 2003 |
| 6605539 |
Electro-mechanical polishing of platinum container structure |
Aug. 12, 2003 |
| 6602380 |
Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine |
Aug. 5, 2003 |
| 6599836 |
Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
Jul. 29, 2003 |
| 6596638 |
Polishing method |
Jul. 22, 2003 |
| 6596637 |
Chemically preventing Cu dendrite formation and growth by immersion |
Jul. 22, 2003 |
| 6593238 |
Method for determining an endpoint and semiconductor wafer |
Jul. 15, 2003 |
| 6593226 |
Method for adding features to a design layout and process for designing a mask |
Jul. 15, 2003 |
| 6589871 |
Processing method, measuring method and producing method of semiconductor devices |
Jul. 8, 2003 |
| 6586326 |
Metal planarization system |
Jul. 1, 2003 |
| 6579797 |
Cleaning brush conditioning apparatus |
Jun. 17, 2003 |
| 6579407 |
Method and apparatus for aligning and setting the axis of rotation of spindles of a multi-body system |
Jun. 17, 2003 |
| 6576552 |
Method for polishing semiconductor device |
Jun. 10, 2003 |
| 6576551 |
Chemical mechanical polish planarizing method with pressure compensating layer |
Jun. 10, 2003 |
| 6576553 |
Chemical mechanical planarization of conductive material |
Jun. 10, 2003 |
| 6576539 |
Semiconductor chip assembly with interlocked conductive trace |
Jun. 10, 2003 |
| 6573177 |
Protection layer to prevent under-layer damage during deposition |
Jun. 3, 2003 |
| 6573186 |
Method for forming plug of semiconductor device |
Jun. 3, 2003 |
| 6569769 |
Slurry-less chemical-mechanical polishing |
May. 27, 2003 |
| 6569343 |
Method for producing liquid discharge head, liquid discharge head, head cartridge, liquid discharging recording apparatus, method for producing silicon plate and silicon plate |
May. 27, 2003 |
| 6566268 |
Method and apparatus for planarizing a wafer surface of a semiconductor wafer having an elevated portion extending therefrom |
May. 20, 2003 |
| 6566266 |
Method of polishing a layer comprising copper using an oxide inhibitor slurry |
May. 20, 2003 |
| 6562184 |
Planarization system with multiple polishing pads |
May. 13, 2003 |
| 6562719 |
Methods of polishing, interconnect-fabrication, and producing semiconductor devices |
May. 13, 2003 |
| 6561883 |
Method of polishing |
May. 13, 2003 |
| 6559054 |
Methods of treating surfaces of substrates |
May. 6, 2003 |
| 6555916 |
Integrated circuit prepared by selectively cleaning copper substrates, in-situ, to remove copper oxides |
Apr. 29, 2003 |
| 6551922 |
Method for making a semiconductor device by variable chemical mechanical polish downforce |
Apr. 22, 2003 |
| 6551933 |
Abrasive finishing with lubricant and tracking |
Apr. 22, 2003 |
| 6552360 |
Method and circuit layout for reducing post chemical mechanical polishing defect count |
Apr. 22, 2003 |
| 6548388 |
Semiconductor device including gate electrode having damascene structure and method of fabricating the same |
Apr. 15, 2003 |
| 6544893 |
Method of manufacturing a glass substrate for an information recording medium, and method of manufacturing an information recording medium |
Apr. 8, 2003 |
| 6541381 |
Finishing method for semiconductor wafers using a lubricating boundary layer |
Apr. 1, 2003 |
| 6537137 |
Methods for chemical-mechanical polishing of semiconductor wafers |
Mar. 25, 2003 |
| 6534380 |
Semiconductor substrate and method of manufacturing the same |
Mar. 18, 2003 |
| 6530826 |
Process for the surface polishing of silicon wafers |
Mar. 11, 2003 |
| 6531400 |
Process for manufacturing semiconductor integrated circuit device |
Mar. 11, 2003 |
| 6531080 |
Method for producing and magazining micro-components |
Mar. 11, 2003 |
| 6527870 |
Wafer cleaning module and method for cleaning the surface of a substrate |
Mar. 4, 2003 |
| 6528423 |
PROCESS FOR FORMING COMPOSITE OF BARRIER LAYERS OF DIELECTRIC MATERIAL TO INHIBIT MIGRATION OF COPPER FROM COPPER METAL INTERCONNECT OF INTEGRATED CIRCUIT STRUCTURE INTO ADJACENT LAYER OF LOW |
Mar. 4, 2003 |
| 6524961 |
Semiconductor device fabricating method |
Feb. 25, 2003 |
| 6524959 |
Chemical mechanical polish (CMP) planarizing method employing derivative signal end-point monitoring and control |
Feb. 25, 2003 |
| 6521534 |
Treatment of exposed silicon and silicon dioxide surfaces |
Feb. 18, 2003 |
| 6521535 |
Insitu oxidation for polishing non-oxide ceramics |
Feb. 18, 2003 |
| 6514864 |
Fabrication method for semiconductor integrated circuit device |
Feb. 4, 2003 |
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