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Class Information
Number: 438/691
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal
Description: Processes wherein the nonchemical material removal is a mechanical (e.g., abrading, cutting, etc.) removal method.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6743660 |
Method of making a wafer level chip scale package |
Jun. 1, 2004 |
| 6743075 |
Method for determining chemical mechanical polishing time |
Jun. 1, 2004 |
| 6743268 |
Chemical-mechanical planarization of barriers or liners for copper metallurgy |
Jun. 1, 2004 |
| 6740589 |
Composition for polishing semiconductor wafer, semiconductor circuit wafer, and method for producing the same |
May. 25, 2004 |
| 6734427 |
TEM/SEM sample preparation |
May. 11, 2004 |
| 6730615 |
High reflector tunable stress coating, such as for a MEMS mirror |
May. 4, 2004 |
| 6730592 |
Methods for planarization of metal-containing surfaces using halogens and halide salts |
May. 4, 2004 |
| 6730602 |
Method for forming aluminum bumps by sputtering and chemical mechanical polishing |
May. 4, 2004 |
| 6730603 |
System and method of determining a polishing endpoint by monitoring signal intensity |
May. 4, 2004 |
| 6722963 |
Apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane |
Apr. 20, 2004 |
| 6723644 |
Method of fabricating a semiconductor device using two chemical mechanical polishing processes to polish regions having different conductive pattern densities |
Apr. 20, 2004 |
| 6723144 |
Semiconductor device fabricating method |
Apr. 20, 2004 |
| 6723626 |
Method of manufacturing semiconductor device |
Apr. 20, 2004 |
| 6723655 |
Methods for fabricating a semiconductor device |
Apr. 20, 2004 |
| 6725120 |
Apparatus and methods with resolution enhancement feature for improving accuracy of conversion of required chemical mechanical polishing pressure to force to be applied by polishing head to wa |
Apr. 20, 2004 |
| 6713394 |
Process for planarization of integrated circuit structure which inhibits cracking of low dielectric constant dielectric material adjacent underlying raised structures |
Mar. 30, 2004 |
| 6706608 |
Memory cell capacitors having an over/under configuration |
Mar. 16, 2004 |
| 6706633 |
Method of forming a self-aligned contact pad for use in a semiconductor device |
Mar. 16, 2004 |
| 6699402 |
Chemical mechanical polishing compositions for CMP removal of iridium thin films |
Mar. 2, 2004 |
| 6699299 |
Composition and method for polishing in metal CMP |
Mar. 2, 2004 |
| 6699795 |
Gate etch process |
Mar. 2, 2004 |
| 6693002 |
Semiconductor device and its manufacture |
Feb. 17, 2004 |
| 6693034 |
Deadhesion method and mechanism for wafer processing |
Feb. 17, 2004 |
| 6689627 |
Process for manufacturing micromechanical components in a semiconductor material wafer with reduction in the starting wafer thickness |
Feb. 10, 2004 |
| 6689691 |
Method of simultaneously polishing a plurality of objects of a similar type, in particular silicon wafers, on a polishing installation |
Feb. 10, 2004 |
| 6689692 |
Composition for oxide CMP |
Feb. 10, 2004 |
| 6686283 |
Shallow trench isolation planarization using self aligned isotropic etch |
Feb. 3, 2004 |
| 6686600 |
TEM sample slicing process |
Feb. 3, 2004 |
| 6686250 |
Method of forming self-aligned bipolar transistor |
Feb. 3, 2004 |
| 6685543 |
Compensating chemical mechanical wafer polishing apparatus and method |
Feb. 3, 2004 |
| 6683003 |
Global planarization method and apparatus |
Jan. 27, 2004 |
| 6679761 |
Polishing compound for semiconductor containing peptide |
Jan. 20, 2004 |
| 6680252 |
Method for planarizing barc layer in dual damascene process |
Jan. 20, 2004 |
| 6676484 |
COPPER CHEMICAL-MECHANICAL POLISHING PROCESS USING A FIXED ABRASIVE POLISHING PAD AND A COPPER LAYER CHEMICAL-MECHANICAL POLISHING SOLUTION SPECIFICALLY ADAPTED FOR CHEMICAL-MECHANICAL POLISHI |
Jan. 13, 2004 |
| 6677250 |
CVD apparatuses and methods of forming a layer over a semiconductor substrate |
Jan. 13, 2004 |
| 6670272 |
Method for reducing dishing in chemical mechanical polishing |
Dec. 30, 2003 |
| 6670274 |
Method of forming a copper damascene structure comprising a recessed copper-oxide-free initial copper structure |
Dec. 30, 2003 |
| 6667239 |
Chemical mechanical polishing of copper-oxide damascene structures |
Dec. 23, 2003 |
| 6660637 |
Process for chemical mechanical polishing |
Dec. 9, 2003 |
| 6660636 |
Highly selective and complete interconnect metal line and via/contact hole filling by electroless plating |
Dec. 9, 2003 |
| 6656842 |
Barrier layer buffing after Cu CMP |
Dec. 2, 2003 |
| 6645862 |
Double-side polishing process with reduced scratch rate and device for carrying out the process |
Nov. 11, 2003 |
| 6642147 |
Method of making thermally stable planarizing films |
Nov. 4, 2003 |
| 6635574 |
Method of removing material from a semiconductor substrate |
Oct. 21, 2003 |
| 6627546 |
Process for removing contaminant from a surface and composition useful therefor |
Sep. 30, 2003 |
| 6627550 |
Post-planarization clean-up |
Sep. 30, 2003 |
| 6623993 |
Method of determining the time for polishing the surface of an integrated circuit wafer |
Sep. 23, 2003 |
| 6620735 |
Method for processing substrates |
Sep. 16, 2003 |
| 6617251 |
Method of shallow trench isolation formation and planarization |
Sep. 9, 2003 |
| 6616514 |
High selectivity CMP slurry |
Sep. 9, 2003 |
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