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Class Information
Number: 438/691
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal
Description: Processes wherein the nonchemical material removal is a mechanical (e.g., abrading, cutting, etc.) removal method.










Sub-classes under this class:

Class Number Class Name Patents
438/692 Simultaneous (e.g., chemical-mechanical polishing, etc.) 2,959


Patents under this class:

Patent Number Title Of Patent Date Issued
7541287 Method for machining a semiconductor wafer on both sides in a carrier, carrier, and a semiconductor wafer produced by the method Jun. 2, 2009
7538028 Barrier layer, IC via, and IC line forming methods May. 26, 2009
7534719 Method for reduction in metal dishing after CMP May. 19, 2009
7534277 Slurry composition for secondary polishing of silicon wafer May. 19, 2009
7524347 CMP composition comprising surfactant Apr. 28, 2009
7521363 MEMS device with non-standard profile Apr. 21, 2009
7514363 Chemical-mechanical planarization composition having benzenesulfonic acid and per-compound oxidizing agents, and associated method for use Apr. 7, 2009
7513920 Free radical-forming activator attached to solid and used to enhance CMP formulations Apr. 7, 2009
7510973 Method for forming fine pattern in semiconductor device Mar. 31, 2009
7510972 Method of processing substrate, post-chemical mechanical polishing cleaning method, and method of and program for manufacturing electronic device Mar. 31, 2009
7510970 Process for manufacturing semiconductor integrated circuit device Mar. 31, 2009
7504337 IC chip uniform delayering methods Mar. 17, 2009
7501051 Electropolishing electrolyte and method for planarizing a metal layer using the same Mar. 10, 2009
7501035 Method of manufacturing replica diffraction grating Mar. 10, 2009
7498263 Method of planarizing an inter-metal insulation film Mar. 3, 2009
7485162 Polishing composition Feb. 3, 2009
7476613 Method of forming an electrical contact in a semiconductor device using an improved self-aligned contact (SAC) process Jan. 13, 2009
7475368 Deflection analysis system and method for circuit design Jan. 6, 2009
7456106 Method for producing a silicon wafer Nov. 25, 2008
7452816 Semiconductor processing method and chemical mechanical polishing methods Nov. 18, 2008
7452481 Polishing slurry and method of reclaiming wafers Nov. 18, 2008
7446045 Method of manufacturing nitride substrate for semiconductors Nov. 4, 2008
7446039 Integrated circuit system with dummy region Nov. 4, 2008
7446020 Wafer dividing method and dividing apparatus Nov. 4, 2008
7442646 Slurry, chemical mechanical polishing method using the slurry, and method of forming metal wiring using the slurry Oct. 28, 2008
7442645 Method of polishing a silicon-containing dielectric Oct. 28, 2008
7435683 Apparatus and method for selectively recessing spacers on multi-gate devices Oct. 14, 2008
7435682 Method of manufacturing semiconductor device Oct. 14, 2008
7432205 Method for controlling polishing process Oct. 7, 2008
7432204 Wafer and the manufacturing and reclaiming methods thereof Oct. 7, 2008
7419909 Methods of forming a semiconductor device that allow patterns in different regions that have different pitches to be connected Sep. 2, 2008
7419519 Engineered non-polymeric organic particles for chemical mechanical planarization Sep. 2, 2008
7416984 Method of producing a MEMS device Aug. 26, 2008
7413987 Method for manufacturing a semiconductor device Aug. 19, 2008
7410904 Sensor produced using imprint lithography Aug. 12, 2008
7405152 Reducing wire erosion during damascene processing Jul. 29, 2008
7402521 Method for chemically mechanically polishing organic film, method of manufacturing semiconductor device, and program therefor Jul. 22, 2008
7390747 Nitride semiconductor substrate and method of producing same Jun. 24, 2008
7387963 Semiconductor wafer and process for producing a semiconductor wafer Jun. 17, 2008
7387455 Substrate processing device, substrate processing method, and developing device Jun. 17, 2008
7384870 Method for manufacturing glass substrate Jun. 10, 2008
7378347 Method of forming catalyst nanoparticles for nanowire growth and other applications May. 27, 2008
7377836 Versatile wafer refining May. 27, 2008
7371687 Electronic circuit device May. 13, 2008
7371686 Method and apparatus for polishing a semiconductor device May. 13, 2008
7368388 Cerium oxide abrasives for chemical mechanical polishing May. 6, 2008
7364835 Developer-soluble materials and methods of using the same in via-first dual damascene applications Apr. 29, 2008
7361974 Manufacturing method for an integrated semiconductor structure Apr. 22, 2008
7361600 Semiconductor manufacturing apparatus having a built-in inspection apparatus and a device manufacturing method using said manufacturing apparatus Apr. 22, 2008
7357877 Dispersion of nanowires of semiconductor material Apr. 15, 2008











 
 
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