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Class Information
Number: 438/691
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal
Description: Processes wherein the nonchemical material removal is a mechanical (e.g., abrading, cutting, etc.) removal method.

Sub-classes under this class:

Class Number Class Name Patents
438/692 Simultaneous (e.g., chemical-mechanical polishing, etc.) 2,959

Patents under this class:

Patent Number Title Of Patent Date Issued
7723234 Method for selective CMP of polysilicon May. 25, 2010
7718522 Method and apparatus for plating a semiconductor package May. 18, 2010
7713832 Semiconductor device and method of fabricating the same May. 11, 2010
7708788 Cerium oxide abrasive and method of polishing substrates May. 4, 2010
7704856 Semiconductor device, wiring substrate forming method, and substrate processing apparatus Apr. 27, 2010
7700489 Method of manufacturing a semiconductor device Apr. 20, 2010
7700488 Recycling of ion implantation monitor wafers Apr. 20, 2010
7699901 Alumina-film-polishing composition and chemical mechanical polishing method using the same Apr. 20, 2010
7696095 Auto-stopping slurries for chemical-mechanical polishing of topographic dielectric silicon dioxide Apr. 13, 2010
7682975 Semiconductor device fabrication method Mar. 23, 2010
7682974 Method for manufacturing semiconductor device Mar. 23, 2010
7682937 Method of treating a substrate, method of processing a substrate using a laser beam, and arrangement Mar. 23, 2010
7682515 Nano-imprint lithography method involving substrate pressing Mar. 23, 2010
7678702 CMP composition of boron surface-modified abrasive and nitro-substituted sulfonic acid and method of use Mar. 16, 2010
7678701 Flexible substrate with electronic devices formed thereon Mar. 16, 2010
7678700 Silicon carbide polishing method utilizing water-soluble oxidizers Mar. 16, 2010
7665055 Semiconductor apparatus design method in which dummy line is placed in close proximity to signal line Feb. 16, 2010
7659201 Process for manufacturing semiconductor integrated circuit device Feb. 9, 2010
7655559 Post-CMP treating liquid and manufacturing method of semiconductor device using the same Feb. 2, 2010
7642190 Method of forming thin insulating layer in MRAM device Jan. 5, 2010
7629258 Method for one-to-one polishing of silicon nitride and silicon oxide Dec. 8, 2009
7628680 Method and apparatus for removing material from microfeature workpieces Dec. 8, 2009
7628667 Method for manufacturing display, display, and electronic device Dec. 8, 2009
7625821 Process and apparatus for thinning a semiconductor workpiece Dec. 1, 2009
7622391 Method of forming an electrically conductive line in an integrated circuit Nov. 24, 2009
7615475 Method for fabricating landing polysilicon contact structures for semiconductor devices Nov. 10, 2009
7611552 Semiconductor polishing composition Nov. 3, 2009
7601642 Method of processing silicon wafer Oct. 13, 2009
7598175 Apparatus and method for confined area planarization Oct. 6, 2009
7597729 Polishing composition and polishing method using the same Oct. 6, 2009
7589023 Method of manufacturing semiconductor wafer Sep. 15, 2009
7589022 Method of chemical mechanical polishing and method of fabricating semiconductor device using the same Sep. 15, 2009
7585341 Polishing material comprising diamond clusters Sep. 8, 2009
7582221 Wafer manufacturing method, polishing apparatus, and wafer Sep. 1, 2009
7582127 Polishing composition for a tungsten-containing substrate Sep. 1, 2009
7579279 Method to passivate conductive surfaces during semiconductor processing Aug. 25, 2009
7575615 Process for preparing a polishing composition Aug. 18, 2009
7572693 Methods for transistor formation using selective gate implantation Aug. 11, 2009
7563716 Polishing method Jul. 21, 2009
7557041 Apparatus and method for supplying chemicals Jul. 7, 2009
7556972 Detection and characterization of SiCOH-based dielectric materials during device fabrication Jul. 7, 2009
7553768 Substrate and a method for polishing a substrate Jun. 30, 2009
7553700 Chemical-enhanced package singulation process Jun. 30, 2009
7553430 Polishing slurries and methods for chemical mechanical polishing Jun. 30, 2009
7550387 Semiconductor wafer processing method Jun. 23, 2009
7550092 Chemical mechanical polishing composition Jun. 23, 2009
7550020 Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method Jun. 23, 2009
7544618 Two-step chemical mechanical polishing process Jun. 9, 2009
7544617 Die scale control of chemical mechanical polishing Jun. 9, 2009
7544606 Method to implement stress free polishing Jun. 9, 2009

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