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Class Information
Number: 438/691
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal
Description: Processes wherein the nonchemical material removal is a mechanical (e.g., abrading, cutting, etc.) removal method.










Sub-classes under this class:

Class Number Class Name Patents
438/692 Simultaneous (e.g., chemical-mechanical polishing, etc.) 2,959


Patents under this class:

Patent Number Title Of Patent Date Issued
7981793 Method of forming a metal directly on a conductive barrier layer by electrochemical deposition using an oxygen-depleted ambient Jul. 19, 2011
7981238 Method for relaxing a stressed thin film Jul. 19, 2011
7972963 Polished semiconductor wafer and process for producing it Jul. 5, 2011
7972962 Planarization method using hybrid oxide and polysilicon CMP Jul. 5, 2011
7968443 Cross-contamination control for processing of circuits comprising MOS devices that include metal comprising high-K dielectrics Jun. 28, 2011
7964508 Dielectric trenches, nickel/tantalum oxide structures, and chemical mechanical polishing techniques Jun. 21, 2011
7964507 Flexible substrate with electronic devices formed thereon Jun. 21, 2011
7960284 III-V compound semiconductor substrate manufacturing method Jun. 14, 2011
7960188 Polishing method Jun. 14, 2011
7951715 Semiconductor device fabrication method May. 31, 2011
7951300 Water-scale needle array May. 31, 2011
7935637 Resist stripping methods using backfilling material layer May. 3, 2011
7931713 Chemical mechanical planarization pad Apr. 26, 2011
7927993 Cross-contamination control for semiconductor process flows having metal comprising gate electrodes Apr. 19, 2011
7923351 Manufacturing method of semiconductor devices Apr. 12, 2011
7919394 Method for thinning substrate and method for manufacturing circuit device Apr. 5, 2011
7915169 Processes for forming electronic devices including polishing metal-containing layers Mar. 29, 2011
7915162 Method of forming damascene filament wires Mar. 29, 2011
7906430 Method of manufacturing a semiconductor device with a peeling prevention layer Mar. 15, 2011
7902072 Metal-polishing composition and chemical-mechanical polishing method Mar. 8, 2011
7871931 Method for chemical mechanical planarization of a metal layer located over a photoresist layer and a method for manufacturing a micro pixel array using the same Jan. 18, 2011
7867909 Polishing composition and polishing method Jan. 11, 2011
7858527 Additive composition, slurry composition including the same, and method of polishing an object using the slurry composition Dec. 28, 2010
7857876 Method of producing polishing material comprising diamond clusters Dec. 28, 2010
7846842 Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios Dec. 7, 2010
7838341 Self-aligned memory cells and method for forming Nov. 23, 2010
7833900 Interconnections for integrated circuits including reducing an overburden and annealing Nov. 16, 2010
7831327 Precision abrasive machining of work piece surfaces Nov. 9, 2010
7829464 Planarization method using hybrid oxide and polysilicon CMP Nov. 9, 2010
7825027 Method for manufacturing memory device Nov. 2, 2010
RE41842 Methods of forming electrical interconnects on integrated circuit substrates using selective slurries Oct. 19, 2010
7803712 Multilevel imprint lithography Sep. 28, 2010
7803711 Low pH barrier slurry based on titanium dioxide Sep. 28, 2010
7799689 Method and apparatus for chemical mechanical polishing including first and second polishing Sep. 21, 2010
7790618 Selective slurry for chemical mechanical polishing Sep. 7, 2010
7785487 Polymeric barrier removal polishing slurry Aug. 31, 2010
7781341 Method of manufacturing semiconductor device Aug. 24, 2010
7776746 Method and apparatus for ultra thin wafer backside processing Aug. 17, 2010
7776230 CMP system utilizing halogen adduct Aug. 17, 2010
7767585 Method of cleaning and process for producing semiconductor device Aug. 3, 2010
7754611 Chemical mechanical polishing process Jul. 13, 2010
7754098 Chemical-mechanical polishing composition and method for using the same Jul. 13, 2010
7754009 Unpolished semiconductor wafer and method for producing an unpolished semiconductor wafer Jul. 13, 2010
7753974 Polishing composition for semiconductor wafer, method for production thereof and polishing method Jul. 13, 2010
7749908 Edge removal of silicon-on-insulator transfer wafer Jul. 6, 2010
7749325 Method of producing gallium nitride (GaN) independent substrate, method of producing GaN crystal body, and method of producing GaN substrate Jul. 6, 2010
7737038 Method of fabricating semiconductor device including planarizing conductive layer using parameters of pattern density and depth of trenches Jun. 15, 2010
7736956 Lateral undercut of metal gate in SOI device Jun. 15, 2010
7732332 Chemical mechanical polishing method with inspection pre and post processing Jun. 8, 2010
7727894 Formation of an integrated circuit structure with reduced dishing in metallization levels Jun. 1, 2010











 
 
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