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Class Information
Number: 438/691
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal
Description: Processes wherein the nonchemical material removal is a mechanical (e.g., abrading, cutting, etc.) removal method.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7074721 |
Method for forming thick copper self-aligned dual damascene |
Jul. 11, 2006 |
| 7071105 |
Method of polishing a silicon-containing dielectric |
Jul. 4, 2006 |
| 7071104 |
Laser alignment target |
Jul. 4, 2006 |
| 7071107 |
Method for manufacturing a semiconductor device |
Jul. 4, 2006 |
| 7067431 |
Method of forming damascene pattern in a semiconductor device |
Jun. 27, 2006 |
| 7067427 |
Manufacturing method of semiconductor device |
Jun. 27, 2006 |
| 7064070 |
Removal of CMP and post-CMP residue from semiconductors using supercritical carbon dioxide process |
Jun. 20, 2006 |
| 7060621 |
Slurry for CMP, polishing method and method of manufacturing semiconductor device |
Jun. 13, 2006 |
| 7056812 |
Process for strengthening semiconductor substrates following thinning |
Jun. 6, 2006 |
| 7052994 |
Method for manufacturing semiconductor device, and processing system and semiconductor device |
May. 30, 2006 |
| 7052620 |
Polishing slurry for aluminum-based metal, and method of manufacturing semiconductor device |
May. 30, 2006 |
| 7052995 |
Process of manufacturing semiconductor device including chemical-mechanical polishing |
May. 30, 2006 |
| 7049236 |
Method of manufacturing a semiconductor device |
May. 23, 2006 |
| 7041600 |
Methods of planarization |
May. 9, 2006 |
| 7041230 |
Method for selectively etching organosilicate glass with respect to a doped silicon carbide |
May. 9, 2006 |
| 7040966 |
Carbonation of pH controlled KOH solution for improved polishing of oxide films on semiconductor wafers |
May. 9, 2006 |
| 7037851 |
Methods for selective integration of airgaps and devices made by such methods |
May. 2, 2006 |
| 7037840 |
Methods of forming planarized surfaces over semiconductor substrates |
May. 2, 2006 |
| 7037839 |
Method for polishing organic film on semiconductor substrate by use of resin particles, and slurry |
May. 2, 2006 |
| 7037838 |
Method for polishing a substrate surface |
May. 2, 2006 |
| 7033409 |
Compositions for chemical mechanical planarization of tantalum and tantalum nitride |
Apr. 25, 2006 |
| 7029937 |
Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
Apr. 18, 2006 |
| 7030017 |
Method for the planarization of a semiconductor structure |
Apr. 18, 2006 |
| 7025854 |
Method and apparatus for aligning and setting the axis of rotation of spindles of a multi-body system |
Apr. 11, 2006 |
| 7026245 |
Polishing agent and polishing method |
Apr. 11, 2006 |
| 7022608 |
Method and composition for the removal of residual materials during substrate planarization |
Apr. 4, 2006 |
| 7012025 |
Tantalum removal during chemical mechanical polishing |
Mar. 14, 2006 |
| 7008874 |
Process for reclaiming semiconductor wafers and reclaimed wafers |
Mar. 7, 2006 |
| 7001846 |
High-density SOI cross-point memory array and method for fabricating same |
Feb. 21, 2006 |
| 7001827 |
Semiconductor wafer front side protection |
Feb. 21, 2006 |
| 6997776 |
Process for producing a semiconductor wafer |
Feb. 14, 2006 |
| 6995089 |
Method to remove copper without pattern density effect |
Feb. 7, 2006 |
| 6992009 |
Method of manufacturing a semiconductor device |
Jan. 31, 2006 |
| 6984586 |
Method of thinning semiconductor wafer capable of preventing its front from being contaminated and back grinding device for semiconductor wafers |
Jan. 10, 2006 |
| 6984587 |
Integrated polishing and electroless deposition |
Jan. 10, 2006 |
| 6984588 |
Compositions for oxide CMP |
Jan. 10, 2006 |
| 6984613 |
Post chemical mechanical polishing cleaning solution for 2.45T CoFeNi structures of thin film magnetic heads |
Jan. 10, 2006 |
| 6979649 |
Fabrication method of semiconductor integrated circuit device |
Dec. 27, 2005 |
| 6979650 |
Fabrication method of semiconductor integrated circuit device |
Dec. 27, 2005 |
| 6967166 |
Method for monitoring and controlling force applied on workpiece surface during electrochemical mechanical processing |
Nov. 22, 2005 |
| 6964923 |
Selective polishing with slurries containing polyelectrolytes |
Nov. 15, 2005 |
| 6964924 |
Integrated circuit process monitoring and metrology system |
Nov. 15, 2005 |
| 6955980 |
Reducing the migration of grain boundaries |
Oct. 18, 2005 |
| 6953388 |
Polishing pad, and method and apparatus for polishing |
Oct. 11, 2005 |
| 6953750 |
Methods and systems for controlling belt surface temperature and slurry temperature in linear chemical mechanical planarization |
Oct. 11, 2005 |
| 6951695 |
High surface quality GaN wafer and method of fabricating same |
Oct. 4, 2005 |
| 6949466 |
CMP apparatus and method for polishing multiple semiconductor wafers on a single polishing pad using multiple slurry delivery lines |
Sep. 27, 2005 |
| 6949411 |
Method for post-etch and strip residue removal on coral films |
Sep. 27, 2005 |
| 6946384 |
Stacked device underfill and a method of fabrication |
Sep. 20, 2005 |
| 6946397 |
Chemical mechanical polishing process with reduced defects in a copper process |
Sep. 20, 2005 |
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