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Class Information
Number: 438/691
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal
Description: Processes wherein the nonchemical material removal is a mechanical (e.g., abrading, cutting, etc.) removal method.

Sub-classes under this class:

Class Number Class Name Patents
438/692 Simultaneous (e.g., chemical-mechanical polishing, etc.) 2,959

Patents under this class:

Patent Number Title Of Patent Date Issued
8192644 Highly dilutable polishing concentrates and slurries Jun. 5, 2012
8192640 Method of manufacturing ink-jet head Jun. 5, 2012
8187977 Automatic gain control May. 29, 2012
8187966 Manufacturing method for semiconductor integrated circuit device May. 29, 2012
8183112 Method for fabricating semiconductor device with vertical channel May. 22, 2012
8165710 Polishing method, polishing apparatus, and program for controlling polishing apparatus Apr. 24, 2012
8163650 Adjuvant for controlling polishing selectivity and chemical mechanical polishing slurry comprising the same Apr. 24, 2012
8163630 Method of manufacturing a semiconductor device Apr. 24, 2012
8157617 Method for polishing a semiconductor wafer Apr. 17, 2012
8153525 Polishing method, polishing apparatus, and method for manufacturing semiconductor device Apr. 10, 2012
8145342 Methods and systems for adjusting operation of a wafer grinder using feedback from warp data Mar. 27, 2012
8133815 Method of polishing compound semiconductor substrate, compound semiconductor substrate, method of manufacturing compound semiconductor epitaxial substrate, and compound semiconductor epitaxial Mar. 13, 2012
8133800 Free-standing thickness of single crystal material and method having carrier lifetimes Mar. 13, 2012
8129277 Method of machining wafer Mar. 6, 2012
8124526 Methods of forming a thin ferroelectric layer and methods of manufacturing a semiconductor device including the same Feb. 28, 2012
8114774 Semiconductor device, and semiconductor device obtained by such a method Feb. 14, 2012
8105948 Use of CMP to contact a MTJ structure without forming a via Jan. 31, 2012
8105894 Semiconductor device manufacturing method and semiconductor device Jan. 31, 2012
8101523 Method of processing of nitride semiconductor wafer, nitride semiconductor wafer, method of producing nitride semiconductor device and nitride semiconductor device Jan. 24, 2012
8092707 Compositions and methods for modifying a surface suited for semiconductor fabrication Jan. 10, 2012
8088690 CMP method Jan. 3, 2012
8083964 Metal-polishing liquid and polishing method Dec. 27, 2011
8080476 Polishing composition and polishing process Dec. 20, 2011
8080475 Removal chemistry for selectively etching metal hard mask Dec. 20, 2011
8076246 Method of manufacturing thermally assisted magnetic head Dec. 13, 2011
8071482 Manufacturing method of a silicon carbide semiconductor device Dec. 6, 2011
8071479 Chemical mechanical polishing composition and methods relating thereto Dec. 6, 2011
8070843 Polishing fluids and methods for CMP Dec. 6, 2011
8058173 Methods for producing smooth wafers Nov. 15, 2011
8058172 Polishing process of a semiconductor substrate Nov. 15, 2011
8048808 Slurry compositions for polishing metal, methods of polishing a metal object and methods of forming a metal wiring using the same Nov. 1, 2011
8048807 Method and apparatus for thinning a substrate Nov. 1, 2011
8048726 SOI semiconductor device with reduced topography above a substrate window area Nov. 1, 2011
8043970 Slurry compositions for selectively polishing silicon nitride relative to silicon oxide, methods of polishing a silicon nitride layer and methods of manufacturing a semiconductor device using Oct. 25, 2011
8034718 Method to recover patterned semiconductor wafers for rework Oct. 11, 2011
8030213 Polishing compound for semiconductor integrated circuit device, polishing method and method for producing semiconductor integrated circuit device Oct. 4, 2011
8029687 Polishing slurry, production method of glass substrate for information recording medium and production method of information recording medium Oct. 4, 2011
8021983 Method of forming pattern of inorganic material film comprising thermally induced cracking Sep. 20, 2011
8021566 Method for pre-conditioning CMP polishing pad Sep. 20, 2011
8008201 Aqueous cerium oxide dispersion Aug. 30, 2011
8008172 Methods of forming semiconductor devices including multistage planarization and crystalization of a semiconductor layer Aug. 30, 2011
8007676 Slurry compositions, methods of preparing slurry compositions, and methods of polishing an object using slurry compositions Aug. 30, 2011
8003537 Method for the production of planar structures Aug. 23, 2011
7998867 Method for manufacturing epitaxial wafer Aug. 16, 2011
7998866 Silicon carbide polishing method utilizing water-soluble oxidizers Aug. 16, 2011
7994057 Polishing composition and method utilizing abrasive particles treated with an aminosilane Aug. 9, 2011
7989358 Prevention of backside cracks in semiconductor chips or wafers using backside film or backside wet etch Aug. 2, 2011
7989348 Polishing method and polishing apparatus Aug. 2, 2011
7985681 Method for selectively forming symmetrical or asymmetrical features using a symmetrical photomask during fabrication of a semiconductor device and electronic systems including the semiconducto Jul. 26, 2011
7981801 Chemical mechanical polishing (CMP) method for gate last process Jul. 19, 2011

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