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Class Information
Number: 438/691
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal
Description: Processes wherein the nonchemical material removal is a mechanical (e.g., abrading, cutting, etc.) removal method.

Sub-classes under this class:

Class Number Class Name Patents
438/692 Simultaneous (e.g., chemical-mechanical polishing, etc.) 2,959

Patents under this class:

Patent Number Title Of Patent Date Issued
4978421 Monolithic silicon membrane device fabrication process Dec. 18, 1990
4931412 Method of producing a thin film solar cell having a n-i-p structure Jun. 5, 1990
4885056 Method of reducing defects on semiconductor wafers Dec. 5, 1989
4876224 Silicon wafer for a semiconductor substrate and the method for making the same Oct. 24, 1989
4713353 Method of producing a transparent photocathode Dec. 15, 1987
4622098 Method for manufacturing semiconductor strain sensor Nov. 11, 1986
4601779 Method of producing a thin silicon-on-insulator layer Jul. 22, 1986
4588473 Semiconductor wafer process May. 13, 1986
4541168 Method for making metal contact studs between first level metal and regions of a semiconductor device compatible with polyimide-filled deep trench isolation schemes Sep. 17, 1985
4410395 Method of removing bulk impurities from semiconductor wafers Oct. 18, 1983
4373991 Methods and apparatus for polishing a semiconductor wafer Feb. 15, 1983
4276114 Semiconductor substrate and a manufacturing method thereof Jun. 30, 1981
4268348 Method for making semiconductor structure May. 19, 1981
4256535 Method of polishing a semiconductor wafer Mar. 17, 1981
3990925 Removal of projections on epitaxial layers Nov. 9, 1976

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