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Class Information
Number: 438/691
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal
Description: Processes wherein the nonchemical material removal is a mechanical (e.g., abrading, cutting, etc.) removal method.










Sub-classes under this class:

Class Number Class Name Patents
438/692 Simultaneous (e.g., chemical-mechanical polishing, etc.) 2,959


Patents under this class:
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Patent Number Title Of Patent Date Issued
6225224 System for dispensing polishing liquid during chemical mechanical polishing of a semiconductor wafer May. 1, 2001
6221772 Method of cleaning the polymer from within holes on a semiconductor wafer Apr. 24, 2001
6221773 Method for working semiconductor wafer Apr. 24, 2001
6221774 Method for surface treatment of substrates Apr. 24, 2001
6221775 Combined chemical mechanical polishing and reactive ion etching process Apr. 24, 2001
6218285 Method for forming inter-metal dielectric layers in metallization process Apr. 17, 2001
6218305 Composition and method for polishing a composite of silica and silicon nitride Apr. 17, 2001
6214717 Method for adding plasma treatment on bond pad to prevent bond pad staining problems Apr. 10, 2001
6214732 Chemical mechanical polishing endpoint detection by monitoring component activity in effluent slurry Apr. 10, 2001
6214733 Process for lift off and handling of thin film materials Apr. 10, 2001
6210525 Apparatus and methods for chemical-mechanical polishing of semiconductor wafers Apr. 3, 2001
6211067 Method for manufacturing metal plug Apr. 3, 2001
6211087 Chemical wet etch removal of underlayer material after performing chemical mechanical polishing on a primary layer Apr. 3, 2001
6211088 Manufacturing method for semiconductor gas-phase epitaxial wafer Apr. 3, 2001
6211089 Method for fabricating GaN substrate Apr. 3, 2001
6204169 Processing for polishing dissimilar conductive layers in a semiconductor device Mar. 20, 2001
6204182 In-situ fluid jet orifice Mar. 20, 2001
6200896 Employing an acidic liquid and an abrasive surface to polish a semiconductor topography Mar. 13, 2001
6197690 Chemically preventing Cu dendrite formation and growth by double sided scrubbing Mar. 6, 2001
6197691 Shallow trench isolation process Mar. 6, 2001
6194720 Preparation of transmission electron microscope samples Feb. 27, 2001
6191037 Methods, apparatuses and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes Feb. 20, 2001
6191038 Apparatus and method for chemical/mechanical polishing Feb. 20, 2001
6191050 Interlayer dielectric with a composite dielectric stack Feb. 20, 2001
6187681 Method and apparatus for planarization of a substrate Feb. 13, 2001
6184139 Oscillating orbital polisher and method Feb. 6, 2001
6184140 Methods of making microelectronic packages utilizing coining Feb. 6, 2001
6184159 Interlayer dielectric planarization process Feb. 6, 2001
6180020 Polishing method and apparatus Jan. 30, 2001
6180527 Method and apparatus for thinning article, and article Jan. 30, 2001
6171976 Method of chemical-mechanical polishing Jan. 9, 2001
6162301 Methods and apparatus for cleaning semiconductor substrates after polishing of copper film Dec. 19, 2000
6162727 Chemical treatment for preventing copper dendrite formation and growth Dec. 19, 2000
6159770 Method and apparatus for fabricating semiconductor device Dec. 12, 2000
6160314 Polishing stop structure Dec. 12, 2000
6156660 Method of planarization using dummy leads Dec. 5, 2000
6153460 Method of fabricating semiconductor memory device Nov. 28, 2000
6153524 Cluster tool method using plasma immersion ion implantation Nov. 28, 2000
6153528 Method of fabricating a dual damascene structure Nov. 28, 2000
6150270 Method for forming barrier layer for copper metallization Nov. 21, 2000
6150271 Differential temperature control in chemical mechanical polishing processes Nov. 21, 2000
6143656 Slurry for chemical mechanical polishing of copper Nov. 7, 2000
6143662 Chemical mechanical polishing composition and method of polishing a substrate Nov. 7, 2000
6143663 Employing deionized water and an abrasive surface to polish a semiconductor topography Nov. 7, 2000
6140211 Method for recycling wafers used for quality assurance testing of integrated circuit fabrication equipment Oct. 31, 2000
6136710 Chemical mechanical polishing apparatus with improved substrate carrier head and method of use Oct. 24, 2000
6127194 Package removal for FBGA devices Oct. 3, 2000
6121142 Magnetic frictionless gimbal for a polishing apparatus Sep. 19, 2000
6117775 Polishing method Sep. 12, 2000
6117776 Wafer holder and method of producing a semiconductor wafer Sep. 12, 2000

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