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Class Information
Number: 438/691
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal
Description: Processes wherein the nonchemical material removal is a mechanical (e.g., abrading, cutting, etc.) removal method.










Sub-classes under this class:

Class Number Class Name Patents
438/692 Simultaneous (e.g., chemical-mechanical polishing, etc.) 2,959


Patents under this class:
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Patent Number Title Of Patent Date Issued
6423639 Planarization method of insulating layer for semiconductor device Jul. 23, 2002
6423640 Headless CMP process for oxide planarization Jul. 23, 2002
6419554 Fixed abrasive chemical-mechanical planarization of titanium nitride Jul. 16, 2002
6420265 Method for polishing semiconductor device Jul. 16, 2002
6413834 Methods for etching silicon dioxide; and methods for forming isolation regions Jul. 2, 2002
6413871 Nitrogen treatment of polished halogen-doped silicon glass Jul. 2, 2002
6413873 System for chemical mechanical planarization Jul. 2, 2002
6409936 Composition and method of formation and use therefor in chemical-mechanical polishing Jun. 25, 2002
6410436 Method of cleaning porous body, and process for producing porous body, non-porous film or bonded substrate Jun. 25, 2002
6410438 Method and device for polishing work edge Jun. 25, 2002
6410439 Semiconductor polishing apparatus and method for chemical/mechanical polishing of films Jun. 25, 2002
6410440 Method and apparatus for a gaseous environment providing improved control of CMP process Jun. 25, 2002
6403439 Method of preparing for structural analysis a deep trench-type capacitor and method of structural analysis therefor Jun. 11, 2002
6399498 Method and apparatus for polishing work Jun. 4, 2002
6399501 Method and apparatus for detecting polishing endpoint with optical monitoring Jun. 4, 2002
6399506 Method for planarizing an oxide layer Jun. 4, 2002
6395634 Glass substrate for magnetic recording medium, magnetic recording medium, and method of manufacturing the same May. 28, 2002
6391779 Planarization process May. 21, 2002
6391792 Multi-step chemical mechanical polish (CMP) planarizing method for forming patterned planarized aperture fill layer May. 21, 2002
6387759 Method of fabricating a semiconductor device May. 14, 2002
6387808 Method of correcting topographical effects on a micro-electronic substrate May. 14, 2002
6387809 Method and apparatus for lapping or polishing semiconductor silicon single crystal wafer May. 14, 2002
6387810 Method for homogenizing device parameters through photoresist planarization May. 14, 2002
6387811 Method for detecting scratch of an insulating film May. 14, 2002
6380085 Method of manufacturing semiconductor devices Apr. 30, 2002
6380087 CMP process utilizing dummy plugs in damascene process Apr. 30, 2002
6380092 Gas phase planarization process for semiconductor wafers Apr. 30, 2002
6375754 Processing compositions and methods of using same Apr. 23, 2002
6376335 Semiconductor wafer manufacturing process Apr. 23, 2002
6376377 Post chemical mechanical polish (CMP) planarizing substrate cleaning method employing enhanced substrate hydrophilicity Apr. 23, 2002
6376378 Polishing apparatus and method for forming an integrated circuit Apr. 23, 2002
6372600 Etch stops and alignment marks for bonded wafers Apr. 16, 2002
6368968 Ditch type floating ring for chemical mechanical polishing Apr. 9, 2002
6368969 Chemical-mechanical polishing methods Apr. 9, 2002
6368971 Method of manufacturing bottom electrode of capacitor Apr. 9, 2002
6365520 Small particle size chemical mechanical polishing composition Apr. 2, 2002
6365521 Passivation for tight metal geometry Apr. 2, 2002
6365522 Slurries of abrasive inorganic oxide particles and method for adjusting the abrasiveness of the particles Apr. 2, 2002
6361646 Method and apparatus for endpoint detection for chemical mechanical polishing Mar. 26, 2002
6362101 Chemical mechanical polishing methods using low pH slurry mixtures Mar. 26, 2002
6362103 Method and apparatus for rejuvenating a CMP chemical solution Mar. 26, 2002
6362475 Scanning electron microscope/energy dispersive spectroscopy sample preparation method and sample produced thereby Mar. 26, 2002
6358360 Precision polishing apparatus for polishing a semiconductor substrate Mar. 19, 2002
6358852 Decapsulation techniques for multi-chip (MCP) devices Mar. 19, 2002
6355184 Method of eliminating agglomerate particles in a polishing slurry Mar. 12, 2002
6355565 Chemical-mechanical-polishing slurry and method for polishing metal/oxide layers Mar. 12, 2002
6352927 Semiconductor wafer and method for fabrication thereof Mar. 5, 2002
6350690 Process for achieving full global planarization during CMP of damascene semiconductor structures Feb. 26, 2002
6344415 Method for forming a shallow trench isolation structure Feb. 5, 2002
6338805 Process for fabricating semiconductor wafers with external gettering Jan. 15, 2002

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