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Class Information
Number: 438/691
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal
Description: Processes wherein the nonchemical material removal is a mechanical (e.g., abrading, cutting, etc.) removal method.










Sub-classes under this class:

Class Number Class Name Patents
438/692 Simultaneous (e.g., chemical-mechanical polishing, etc.) 2,959


Patents under this class:
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Patent Number Title Of Patent Date Issued
6498101 Planarizing pads, planarizing machines and methods for making and using planarizing pads in mechanical and chemical-mechanical planarization of microelectronic device substrate assemblies Dec. 24, 2002
6498102 Method for planarizing a semiconductor device using ceria-based slurry Dec. 24, 2002
6495463 Method for chemical mechanical polishing Dec. 17, 2002
6495464 Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool Dec. 17, 2002
6495465 Method for appraising the condition of a semiconductor polishing cloth Dec. 17, 2002
6491836 Semiconductor wafer and production method therefor Dec. 10, 2002
6490497 Working process end point real time determination method Dec. 3, 2002
6489242 Process for planarization of integrated circuit structure which inhibits cracking of low dielectric constant dielectric material adjacent underlying raised structures Dec. 3, 2002
6489243 Method for polishing semiconductor device Dec. 3, 2002
6482743 Method of forming a semiconductor device using CMP to polish a metal film Nov. 19, 2002
6479385 Interlevel dielectric composite layer for insulation of polysilicon and metal structures Nov. 12, 2002
6479387 Method for reducing micro-particle adsorption effects Nov. 12, 2002
6479389 Method of doping copper metallization Nov. 12, 2002
6479443 Cleaning solution and method for cleaning semiconductor substrates after polishing of copper film Nov. 12, 2002
6475398 Semiconductor device incorporating hemispherical solid immersion lens, apparatus and method for manufacturing same Nov. 5, 2002
6475914 Method of manufacturing semiconductor device for protecting Cu layer from post chemical mechanical polishing-corrosion Nov. 5, 2002
6468897 Method of forming damascene structure Oct. 22, 2002
6468909 Isolation and/or removal of ionic contaminants from planarization fluid compositions using macrocyclic polyethers and methods of using such compositions Oct. 22, 2002
6465327 Method for producing a thin membrane and resulting structure with membrane Oct. 15, 2002
6461965 Method for effecting a finishing operation on a semiconductor workpiece Oct. 8, 2002
6462409 Semiconductor wafer polishing apparatus Oct. 8, 2002
6458289 CMP slurry for polishing semiconductor wafers and related methods Oct. 1, 2002
6458688 Semiconductor wafer with improved flatness, and process for producing the semiconductor wafer Oct. 1, 2002
6455428 Method of forming a metal silicide layer Sep. 24, 2002
6455430 Method of embedding contact hole by damascene method Sep. 24, 2002
6455431 NH3 plasma descumming and resist stripping in semiconductor applications Sep. 24, 2002
6455432 Method for removing carbon-rich particles adhered on a copper surface Sep. 24, 2002
6451696 Method for reclaiming wafer substrate and polishing solution compositions therefor Sep. 17, 2002
6451697 Method for abrasive-free metal CMP in passivation domain Sep. 17, 2002
6451700 Method and apparatus for measuring planarity of a polished layer Sep. 17, 2002
6448164 Dark field image reversal for gate or line patterning Sep. 10, 2002
6444491 Composite semiconductor devices and method for manufacture thereof Sep. 3, 2002
6444582 Methods for removing silicon-oxy-nitride layer and wafer surface cleaning Sep. 3, 2002
6440855 Method of processing surface of workpiece and method of forming semiconductor thin layer Aug. 27, 2002
6440856 Cleaning agent for semiconductor parts and method for cleaning semiconductor parts Aug. 27, 2002
6436228 Substrate retainer Aug. 20, 2002
6436828 Chemical mechanical polishing using magnetic force Aug. 20, 2002
6436829 Two phase chemical/mechanical polishing process for tungsten layers Aug. 20, 2002
6432806 Method of forming bumps and template used for forming bumps Aug. 13, 2002
6432823 Off-concentric polishing system design Aug. 13, 2002
6432824 Method for manufacturing a semiconductor wafer Aug. 13, 2002
6428721 Polishing composition and polishing method employing it Aug. 6, 2002
6429130 Method and apparatus for end point detection in a chemical mechanical polishing process using two laser beams Aug. 6, 2002
6429131 CMP uniformity Aug. 6, 2002
6429132 Combination CMP-etch method for forming a thin planar layer over the surface of a device Aug. 6, 2002
6429146 Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing Aug. 6, 2002
6425956 Process for removing chemical mechanical polishing residual slurry Jul. 30, 2002
6426232 Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment Jul. 30, 2002
6426288 Method for removing an upper layer of material from a semiconductor wafer Jul. 30, 2002
6423638 Filter apparatus and method therefor Jul. 23, 2002

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