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Class Information
Number: 438/691
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal
Description: Processes wherein the nonchemical material removal is a mechanical (e.g., abrading, cutting, etc.) removal method.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6046110 |
Copper-based metal polishing solution and method for manufacturing a semiconductor device |
Apr. 4, 2000 |
| 6042736 |
Method for preparing samples for microscopic examination |
Mar. 28, 2000 |
| 6043155 |
Polishing agent and polishing method |
Mar. 28, 2000 |
| 6040244 |
Polishing pad control method and apparatus |
Mar. 21, 2000 |
| 6030897 |
Method of forming an alignment mark without a specific photolithographic step |
Feb. 29, 2000 |
| 6030899 |
Apparatus and methods for recirculating chemical-mechanical polishing of semiconductor wafers |
Feb. 29, 2000 |
| 6027659 |
Polishing pad conditioning surface having integral conditioning points |
Feb. 22, 2000 |
| 6020262 |
Methods and apparatus for chemical mechanical planarization (CMP) of a semiconductor wafer |
Feb. 1, 2000 |
| 6010963 |
Global planarization using SOG and CMP |
Jan. 4, 2000 |
| 6004653 |
Planarization process by applying a polish-differentiating technique utilizing an ultraviolet-light sensitive organic oxide layer |
Dec. 21, 1999 |
| 5998295 |
Method of forming a rough region on a substrate |
Dec. 7, 1999 |
| 5998298 |
Use of chemical-mechanical polishing for fabricating photonic bandgap structures |
Dec. 7, 1999 |
| 5998301 |
Method and system for providing tapered shallow trench isolation structure profile |
Dec. 7, 1999 |
| 5994230 |
Method for cold cleaving of laser wafers into bars |
Nov. 30, 1999 |
| 5993677 |
Process for transferring a thin film from an initial substrate onto a final substrate |
Nov. 30, 1999 |
| 5990010 |
Pre-conditioning polishing pads for chemical-mechanical polishing |
Nov. 23, 1999 |
| 5985748 |
Method of making a semiconductor device using chemical-mechanical polishing having a combination-step process |
Nov. 16, 1999 |
| 5981393 |
Method of forming electrodes at the end surfaces of chip array resistors |
Nov. 9, 1999 |
| 5980633 |
Process for producing a semiconductor substrate |
Nov. 9, 1999 |
| 5981392 |
Method of manufacturing semiconductor monocrystalline mirror-surface wafers which includes a gas phase etching process, and semiconductor monocrystalline mirror-surface wafers manufactured by |
Nov. 9, 1999 |
| 5980979 |
Method for consistently forming low resistance contact structures involving the removal of adhesion layer particles blocking via openings |
Nov. 9, 1999 |
| 5976981 |
Method for manufacturing a reverse crown capacitor for DRAM memory cell |
Nov. 2, 1999 |
| 5976980 |
Method and apparatus providing a mechanical probe structure in an integrated circuit die |
Nov. 2, 1999 |
| 5976979 |
Sequential oxygen plasma treatment and chemical mechanical polish (CMP) planarizing method for forming planarized low dielectric constant dielectric layer |
Nov. 2, 1999 |
| 5972798 |
Prevention of die loss to chemical mechanical polishing |
Oct. 26, 1999 |
| 5972792 |
Method for chemical-mechanical planarization of a substrate on a fixed-abrasive polishing pad |
Oct. 26, 1999 |
| 5972787 |
CMP process using indicator areas to determine endpoint |
Oct. 26, 1999 |
| 5968842 |
Techniques for reduced dishing in chemical mechanical polishing |
Oct. 19, 1999 |
| 5964953 |
Post-etching alkaline treatment process |
Oct. 12, 1999 |
| 5963821 |
Method of making semiconductor wafers |
Oct. 5, 1999 |
| 5962343 |
Process for producing crystalline ceric oxide particles and abrasive |
Oct. 5, 1999 |
| 5958795 |
Chemical-mechanical polishing for shallow trench isolation |
Sep. 28, 1999 |
| 5960254 |
Methods for the preparation of a semiconductor structure having multiple levels of self-aligned interconnection metallization |
Sep. 28, 1999 |
| 5956618 |
Process for producing multi-level metallization in an integrated circuit |
Sep. 21, 1999 |
| 5954975 |
Slurries for chemical mechanical polishing tungsten films |
Sep. 21, 1999 |
| 5954888 |
Post-CMP wet-HF cleaning station |
Sep. 21, 1999 |
| 5952241 |
Method and apparatus for improving alignment for metal masking in conjuction with oxide and tungsten CMP |
Sep. 14, 1999 |
| 5948698 |
Manufacturing method of semiconductor device using chemical mechanical polishing |
Sep. 7, 1999 |
| 5948697 |
Catalytic acceleration and electrical bias control of CMP processing |
Sep. 7, 1999 |
| 5948206 |
Apparatus for determining removed amount of wafer |
Sep. 7, 1999 |
| 5948204 |
Wafer carrier ring method and apparatus for chemical-mechanical planarization |
Sep. 7, 1999 |
| 5944941 |
Turning-over machine and polishing apparatus |
Aug. 31, 1999 |
| 5945346 |
Chemical mechanical planarization system and method therefor |
Aug. 31, 1999 |
| 5942131 |
Treatment of a surface having an expose silicon/silica interface |
Aug. 24, 1999 |
| 5942445 |
Method of manufacturing semiconductor wafers |
Aug. 24, 1999 |
| 5928961 |
Dishing inhibited shallow trench isolation |
Jul. 27, 1999 |
| 5928959 |
Dishing resistance |
Jul. 27, 1999 |
| 5930644 |
Method of forming a shallow trench isolation using oxide slope etching |
Jul. 27, 1999 |
| 5926723 |
Generation of a loose planarization mask having relaxed boundary conditions for use in shallow trench isolation processes |
Jul. 20, 1999 |
| 5919548 |
Chemical-mechanical polishing of recessed microelectromechanical devices |
Jul. 6, 1999 |
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