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Class Information
Number: 438/691
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal
Description: Processes wherein the nonchemical material removal is a mechanical (e.g., abrading, cutting, etc.) removal method.










Sub-classes under this class:

Class Number Class Name Patents
438/692 Simultaneous (e.g., chemical-mechanical polishing, etc.) 2,959


Patents under this class:
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Patent Number Title Of Patent Date Issued
6586326 Metal planarization system Jul. 1, 2003
6579407 Method and apparatus for aligning and setting the axis of rotation of spindles of a multi-body system Jun. 17, 2003
6579797 Cleaning brush conditioning apparatus Jun. 17, 2003
6576539 Semiconductor chip assembly with interlocked conductive trace Jun. 10, 2003
6576551 Chemical mechanical polish planarizing method with pressure compensating layer Jun. 10, 2003
6576552 Method for polishing semiconductor device Jun. 10, 2003
6576553 Chemical mechanical planarization of conductive material Jun. 10, 2003
6573177 Protection layer to prevent under-layer damage during deposition Jun. 3, 2003
6573186 Method for forming plug of semiconductor device Jun. 3, 2003
6569343 Method for producing liquid discharge head, liquid discharge head, head cartridge, liquid discharging recording apparatus, method for producing silicon plate and silicon plate May. 27, 2003
6569769 Slurry-less chemical-mechanical polishing May. 27, 2003
6566266 Method of polishing a layer comprising copper using an oxide inhibitor slurry May. 20, 2003
6566268 Method and apparatus for planarizing a wafer surface of a semiconductor wafer having an elevated portion extending therefrom May. 20, 2003
6561883 Method of polishing May. 13, 2003
6562184 Planarization system with multiple polishing pads May. 13, 2003
6562719 Methods of polishing, interconnect-fabrication, and producing semiconductor devices May. 13, 2003
6559054 Methods of treating surfaces of substrates May. 6, 2003
6555916 Integrated circuit prepared by selectively cleaning copper substrates, in-situ, to remove copper oxides Apr. 29, 2003
6551922 Method for making a semiconductor device by variable chemical mechanical polish downforce Apr. 22, 2003
6551933 Abrasive finishing with lubricant and tracking Apr. 22, 2003
6552360 Method and circuit layout for reducing post chemical mechanical polishing defect count Apr. 22, 2003
6548388 Semiconductor device including gate electrode having damascene structure and method of fabricating the same Apr. 15, 2003
6544893 Method of manufacturing a glass substrate for an information recording medium, and method of manufacturing an information recording medium Apr. 8, 2003
6541381 Finishing method for semiconductor wafers using a lubricating boundary layer Apr. 1, 2003
6537137 Methods for chemical-mechanical polishing of semiconductor wafers Mar. 25, 2003
6534380 Semiconductor substrate and method of manufacturing the same Mar. 18, 2003
6530826 Process for the surface polishing of silicon wafers Mar. 11, 2003
6531080 Method for producing and magazining micro-components Mar. 11, 2003
6531400 Process for manufacturing semiconductor integrated circuit device Mar. 11, 2003
6527870 Wafer cleaning module and method for cleaning the surface of a substrate Mar. 4, 2003
6528423 PROCESS FOR FORMING COMPOSITE OF BARRIER LAYERS OF DIELECTRIC MATERIAL TO INHIBIT MIGRATION OF COPPER FROM COPPER METAL INTERCONNECT OF INTEGRATED CIRCUIT STRUCTURE INTO ADJACENT LAYER OF LOW Mar. 4, 2003
6524959 Chemical mechanical polish (CMP) planarizing method employing derivative signal end-point monitoring and control Feb. 25, 2003
6524961 Semiconductor device fabricating method Feb. 25, 2003
6521534 Treatment of exposed silicon and silicon dioxide surfaces Feb. 18, 2003
6521535 Insitu oxidation for polishing non-oxide ceramics Feb. 18, 2003
6514673 Rule to determine CMP polish time Feb. 4, 2003
6514815 Method for fabricating polysilicon capacitor Feb. 4, 2003
6514862 Wafer polishing slurry and chemical mechanical polishing (CMP) method using the same Feb. 4, 2003
6514864 Fabrication method for semiconductor integrated circuit device Feb. 4, 2003
6511859 IC-compatible parylene MEMS technology and its application in integrated sensors Jan. 28, 2003
6511914 Reactor for processing a workpiece using sonic energy Jan. 28, 2003
6509269 Elimination of pad glazing for Al CMP Jan. 21, 2003
6509270 Method for polishing a semiconductor topography Jan. 21, 2003
6509273 Method for manufacturing a semiconductor device Jan. 21, 2003
6506660 Semiconductor with nanoscale features Jan. 14, 2003
6506679 Deadhesion method and mechanism for wafer processing Jan. 14, 2003
6503836 Method and apparatus for manufacturing semiconductor device Jan. 7, 2003
6503837 Method of rinsing residual etching reactants/products on a semiconductor wafer Jan. 7, 2003
6503839 Endpoint stabilization for polishing process Jan. 7, 2003
6498100 Method of manufacturing semiconductor devices Dec. 24, 2002

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