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Class Information
Number: 438/691
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal
Description: Processes wherein the nonchemical material removal is a mechanical (e.g., abrading, cutting, etc.) removal method.










Sub-classes under this class:

Class Number Class Name Patents
438/692 Simultaneous (e.g., chemical-mechanical polishing, etc.) 2,959


Patents under this class:
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Patent Number Title Of Patent Date Issued
6723655 Methods for fabricating a semiconductor device Apr. 20, 2004
6725120 Apparatus and methods with resolution enhancement feature for improving accuracy of conversion of required chemical mechanical polishing pressure to force to be applied by polishing head to wa Apr. 20, 2004
6713394 Process for planarization of integrated circuit structure which inhibits cracking of low dielectric constant dielectric material adjacent underlying raised structures Mar. 30, 2004
6706608 Memory cell capacitors having an over/under configuration Mar. 16, 2004
6706633 Method of forming a self-aligned contact pad for use in a semiconductor device Mar. 16, 2004
6699299 Composition and method for polishing in metal CMP Mar. 2, 2004
6699402 Chemical mechanical polishing compositions for CMP removal of iridium thin films Mar. 2, 2004
6699795 Gate etch process Mar. 2, 2004
6693002 Semiconductor device and its manufacture Feb. 17, 2004
6693034 Deadhesion method and mechanism for wafer processing Feb. 17, 2004
6689627 Process for manufacturing micromechanical components in a semiconductor material wafer with reduction in the starting wafer thickness Feb. 10, 2004
6689691 Method of simultaneously polishing a plurality of objects of a similar type, in particular silicon wafers, on a polishing installation Feb. 10, 2004
6689692 Composition for oxide CMP Feb. 10, 2004
6685543 Compensating chemical mechanical wafer polishing apparatus and method Feb. 3, 2004
6686250 Method of forming self-aligned bipolar transistor Feb. 3, 2004
6686283 Shallow trench isolation planarization using self aligned isotropic etch Feb. 3, 2004
6686600 TEM sample slicing process Feb. 3, 2004
6683003 Global planarization method and apparatus Jan. 27, 2004
6679761 Polishing compound for semiconductor containing peptide Jan. 20, 2004
6680252 Method for planarizing barc layer in dual damascene process Jan. 20, 2004
6676484 COPPER CHEMICAL-MECHANICAL POLISHING PROCESS USING A FIXED ABRASIVE POLISHING PAD AND A COPPER LAYER CHEMICAL-MECHANICAL POLISHING SOLUTION SPECIFICALLY ADAPTED FOR CHEMICAL-MECHANICAL POLISHI Jan. 13, 2004
6677250 CVD apparatuses and methods of forming a layer over a semiconductor substrate Jan. 13, 2004
6670272 Method for reducing dishing in chemical mechanical polishing Dec. 30, 2003
6670274 Method of forming a copper damascene structure comprising a recessed copper-oxide-free initial copper structure Dec. 30, 2003
6667239 Chemical mechanical polishing of copper-oxide damascene structures Dec. 23, 2003
6660636 Highly selective and complete interconnect metal line and via/contact hole filling by electroless plating Dec. 9, 2003
6660637 Process for chemical mechanical polishing Dec. 9, 2003
6656842 Barrier layer buffing after Cu CMP Dec. 2, 2003
6645862 Double-side polishing process with reduced scratch rate and device for carrying out the process Nov. 11, 2003
6642147 Method of making thermally stable planarizing films Nov. 4, 2003
6635574 Method of removing material from a semiconductor substrate Oct. 21, 2003
6627546 Process for removing contaminant from a surface and composition useful therefor Sep. 30, 2003
6627550 Post-planarization clean-up Sep. 30, 2003
6623993 Method of determining the time for polishing the surface of an integrated circuit wafer Sep. 23, 2003
6620735 Method for processing substrates Sep. 16, 2003
6616514 High selectivity CMP slurry Sep. 9, 2003
6617251 Method of shallow trench isolation formation and planarization Sep. 9, 2003
6613675 Methods, apparatuses, and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes Sep. 2, 2003
6613676 Process of reclamation of SOI substrate and reproduced substrate Sep. 2, 2003
6610596 Method of forming metal interconnection using plating and semiconductor device manufactured by the method Aug. 26, 2003
6607983 Method of processing a defect source at a wafer edge region in a semiconductor manufacturing Aug. 19, 2003
6605537 Polishing of metal substrates Aug. 12, 2003
6605539 Electro-mechanical polishing of platinum container structure Aug. 12, 2003
6602380 Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine Aug. 5, 2003
6599836 Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies Jul. 29, 2003
6596637 Chemically preventing Cu dendrite formation and growth by immersion Jul. 22, 2003
6596638 Polishing method Jul. 22, 2003
6593226 Method for adding features to a design layout and process for designing a mask Jul. 15, 2003
6593238 Method for determining an endpoint and semiconductor wafer Jul. 15, 2003
6589871 Processing method, measuring method and producing method of semiconductor devices Jul. 8, 2003

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