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Class Information
Number: 438/691
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal
Description: Processes wherein the nonchemical material removal is a mechanical (e.g., abrading, cutting, etc.) removal method.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6153528 |
Method of fabricating a dual damascene structure |
Nov. 28, 2000 |
| 6153524 |
Cluster tool method using plasma immersion ion implantation |
Nov. 28, 2000 |
| 6153460 |
Method of fabricating semiconductor memory device |
Nov. 28, 2000 |
| 6150271 |
Differential temperature control in chemical mechanical polishing processes |
Nov. 21, 2000 |
| 6150270 |
Method for forming barrier layer for copper metallization |
Nov. 21, 2000 |
| 6143663 |
Employing deionized water and an abrasive surface to polish a semiconductor topography |
Nov. 7, 2000 |
| 6143662 |
Chemical mechanical polishing composition and method of polishing a substrate |
Nov. 7, 2000 |
| 6143656 |
Slurry for chemical mechanical polishing of copper |
Nov. 7, 2000 |
| 6140211 |
Method for recycling wafers used for quality assurance testing of integrated circuit fabrication equipment |
Oct. 31, 2000 |
| 6136710 |
Chemical mechanical polishing apparatus with improved substrate carrier head and method of use |
Oct. 24, 2000 |
| 6127194 |
Package removal for FBGA devices |
Oct. 3, 2000 |
| 6121142 |
Magnetic frictionless gimbal for a polishing apparatus |
Sep. 19, 2000 |
| 6117775 |
Polishing method |
Sep. 12, 2000 |
| 6117776 |
Wafer holder and method of producing a semiconductor wafer |
Sep. 12, 2000 |
| 6114249 |
Chemical mechanical polishing of multiple material substrates and slurry having improved selectivity |
Sep. 5, 2000 |
| 6114246 |
Method of using a polish stop film to control dishing during copper chemical mechanical polishing |
Sep. 5, 2000 |
| 6114209 |
Method of fabricating semiconductor devices with raised doped region structures |
Sep. 5, 2000 |
| 6114245 |
Method of processing semiconductor wafers |
Sep. 5, 2000 |
| 6106661 |
Polishing pad having a wear level indicator and system using the same |
Aug. 22, 2000 |
| 6103627 |
Treatment of a surface having an exposed silicon/silica interface |
Aug. 15, 2000 |
| 6103625 |
Use of a polish stop layer in the formation of metal structures |
Aug. 15, 2000 |
| 6103626 |
Method for forming dummy pattern areas in a semiconductor device |
Aug. 15, 2000 |
| 6100147 |
Method for manufacturing a high performance transistor with self-aligned dopant profile |
Aug. 8, 2000 |
| 6096635 |
Method for creating via hole in chip |
Aug. 1, 2000 |
| 6096651 |
Key-hole reduction during tungsten plug formation |
Aug. 1, 2000 |
| 6093649 |
Polishing slurry compositions capable of providing multi-modal particle packing and methods relating thereto |
Jul. 25, 2000 |
| 6091130 |
Semiconductor device having structure suitable for CMP process |
Jul. 18, 2000 |
| 6090712 |
Shallow trench isolation formation with no polish stop |
Jul. 18, 2000 |
| 6090713 |
Shallow trench isolation formation with simplified reverse planarization mask |
Jul. 18, 2000 |
| 6083838 |
Method of planarizing a surface on a semiconductor wafer |
Jul. 4, 2000 |
| 6083837 |
Fabrication of components by coining |
Jul. 4, 2000 |
| 6083836 |
Transistors with substitutionally formed gate structures and method |
Jul. 4, 2000 |
| 6080671 |
Process of chemical-mechanical polishing and manufacturing an integrated circuit |
Jun. 27, 2000 |
| 6080673 |
Chemical mechanical polishing methods utilizing pH-adjusted polishing solutions |
Jun. 27, 2000 |
| 6080670 |
Method of detecting a polishing endpoint layer of a semiconductor wafer which includes a non-reactive reporting specie |
Jun. 27, 2000 |
| 6080641 |
Method of manufacturing semiconductor wafer |
Jun. 27, 2000 |
| 6077784 |
Chemical-mechanical polishing method |
Jun. 20, 2000 |
| 6077783 |
Method and apparatus for detecting a polishing endpoint based upon heat conducted through a semiconductor wafer |
Jun. 20, 2000 |
| 6077721 |
Method of producing an anodic bonded semiconductor sensor element |
Jun. 20, 2000 |
| 6074929 |
Box isolation technique for integrated circuit structures |
Jun. 13, 2000 |
| 6069080 |
Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like |
May. 30, 2000 |
| 6066565 |
Method of manufacturing a semiconductor wafer |
May. 23, 2000 |
| 6066562 |
Method for fabricating silicon semiconductor discrete wafer |
May. 23, 2000 |
| 6060387 |
Transistor fabrication process in which a contact metallization is formed with different silicide thickness over gate interconnect material and transistor source/drain regions |
May. 9, 2000 |
| 6059637 |
Process for abrasive removal of copper from the back surface of a silicon substrate |
May. 9, 2000 |
| 6057224 |
Methods for making semiconductor devices having air dielectric interconnect structures |
May. 2, 2000 |
| 6051498 |
Method for manufacturing a semiconductor wafer which is coated on one side and provided with a finish |
Apr. 18, 2000 |
| 6051499 |
Apparatus and method for distribution of slurry in a chemical mechanical polishing system |
Apr. 18, 2000 |
| 6049137 |
Readable alignment mark structure formed using enhanced chemical mechanical polishing |
Apr. 11, 2000 |
| 6048745 |
Method for mapping scratches in an oxide film |
Apr. 11, 2000 |
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