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Class Information
Number: 438/691
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal
Description: Processes wherein the nonchemical material removal is a mechanical (e.g., abrading, cutting, etc.) removal method.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6242343 |
Process for fabricating semiconductor device and apparatus for fabricating semiconductor device |
Jun. 5, 2001 |
| 6242352 |
Method of preventing micro-scratches on the surface of a semiconductor wafer when performing a CMP process |
Jun. 5, 2001 |
| 6242805 |
Method of using a polish stop film to control dishing during copper chemical mechanical polishing |
Jun. 5, 2001 |
| 6238592 |
Working liquids and methods for modifying structured wafers suited for semiconductor fabrication |
May. 29, 2001 |
| 6238590 |
Tribochemical polishing of ceramics and metals |
May. 29, 2001 |
| 6235635 |
Linear CMP tool design using in-situ slurry distribution and concurrent pad conditioning |
May. 22, 2001 |
| 6235636 |
Resist removal by polishing |
May. 22, 2001 |
| 6232043 |
Rule to determine CMP polish time |
May. 15, 2001 |
| 6232231 |
Planarized semiconductor interconnect topography and method for polishing a metal layer to form interconnect |
May. 15, 2001 |
| 6228754 |
Method for forming semiconductor seed layers by inert gas sputter etching |
May. 8, 2001 |
| 6228768 |
Storage-annealing plated CU interconnects |
May. 8, 2001 |
| 6228769 |
Endpoint detection by chemical reaction and photoionization |
May. 8, 2001 |
| 6227955 |
Carrier heads, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
May. 8, 2001 |
| 6225224 |
System for dispensing polishing liquid during chemical mechanical polishing of a semiconductor wafer |
May. 1, 2001 |
| 6221774 |
Method for surface treatment of substrates |
Apr. 24, 2001 |
| 6221773 |
Method for working semiconductor wafer |
Apr. 24, 2001 |
| 6221772 |
Method of cleaning the polymer from within holes on a semiconductor wafer |
Apr. 24, 2001 |
| 6221775 |
Combined chemical mechanical polishing and reactive ion etching process |
Apr. 24, 2001 |
| 6218305 |
Composition and method for polishing a composite of silica and silicon nitride |
Apr. 17, 2001 |
| 6218285 |
Method for forming inter-metal dielectric layers in metallization process |
Apr. 17, 2001 |
| 6214732 |
Chemical mechanical polishing endpoint detection by monitoring component activity in effluent slurry |
Apr. 10, 2001 |
| 6214733 |
Process for lift off and handling of thin film materials |
Apr. 10, 2001 |
| 6214717 |
Method for adding plasma treatment on bond pad to prevent bond pad staining problems |
Apr. 10, 2001 |
| 6211088 |
Manufacturing method for semiconductor gas-phase epitaxial wafer |
Apr. 3, 2001 |
| 6211087 |
Chemical wet etch removal of underlayer material after performing chemical mechanical polishing on a primary layer |
Apr. 3, 2001 |
| 6211067 |
Method for manufacturing metal plug |
Apr. 3, 2001 |
| 6210525 |
Apparatus and methods for chemical-mechanical polishing of semiconductor wafers |
Apr. 3, 2001 |
| 6211089 |
Method for fabricating GaN substrate |
Apr. 3, 2001 |
| 6204182 |
In-situ fluid jet orifice |
Mar. 20, 2001 |
| 6204169 |
Processing for polishing dissimilar conductive layers in a semiconductor device |
Mar. 20, 2001 |
| 6200896 |
Employing an acidic liquid and an abrasive surface to polish a semiconductor topography |
Mar. 13, 2001 |
| 6197691 |
Shallow trench isolation process |
Mar. 6, 2001 |
| 6197690 |
Chemically preventing Cu dendrite formation and growth by double sided scrubbing |
Mar. 6, 2001 |
| 6194720 |
Preparation of transmission electron microscope samples |
Feb. 27, 2001 |
| 6191038 |
Apparatus and method for chemical/mechanical polishing |
Feb. 20, 2001 |
| 6191037 |
Methods, apparatuses and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes |
Feb. 20, 2001 |
| 6191050 |
Interlayer dielectric with a composite dielectric stack |
Feb. 20, 2001 |
| 6187681 |
Method and apparatus for planarization of a substrate |
Feb. 13, 2001 |
| 6184159 |
Interlayer dielectric planarization process |
Feb. 6, 2001 |
| 6184139 |
Oscillating orbital polisher and method |
Feb. 6, 2001 |
| 6184140 |
Methods of making microelectronic packages utilizing coining |
Feb. 6, 2001 |
| 6180020 |
Polishing method and apparatus |
Jan. 30, 2001 |
| 6180527 |
Method and apparatus for thinning article, and article |
Jan. 30, 2001 |
| 6171976 |
Method of chemical-mechanical polishing |
Jan. 9, 2001 |
| 6162727 |
Chemical treatment for preventing copper dendrite formation and growth |
Dec. 19, 2000 |
| 6162301 |
Methods and apparatus for cleaning semiconductor substrates after polishing of copper film |
Dec. 19, 2000 |
| 6159770 |
Method and apparatus for fabricating semiconductor device |
Dec. 12, 2000 |
| 6160314 |
Polishing stop structure |
Dec. 12, 2000 |
| 6156660 |
Method of planarization using dummy leads |
Dec. 5, 2000 |
| 6153528 |
Method of fabricating a dual damascene structure |
Nov. 28, 2000 |
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