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Class Information
Number: 438/691
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal
Description: Processes wherein the nonchemical material removal is a mechanical (e.g., abrading, cutting, etc.) removal method.










Sub-classes under this class:

Class Number Class Name Patents
438/692 Simultaneous (e.g., chemical-mechanical polishing, etc.) 2,959


Patents under this class:
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Patent Number Title Of Patent Date Issued
6914002 Differential planarization Jul. 5, 2005
6908860 Method for manufacturing semiconductor device and apparatus for manufacturing thereof Jun. 21, 2005
6909193 High pH slurry for chemical mechanical polishing of copper Jun. 21, 2005
6909935 Methods with resolution enhancement feature for improving accuracy of conversion of required chemical mechanical polishing pressure to force to be applied by polishing head to wafer Jun. 21, 2005
6905967 Method for improving planarity of shallow trench isolation using multiple simultaneous tiling systems Jun. 14, 2005
6903018 Methods and apparatuses for planarizing microelectronic substrate assemblies Jun. 7, 2005
6900112 Process for forming shallow trench isolation region with corner protection layer May. 31, 2005
6893907 Fabrication of silicon-on-insulator structure using plasma immersion ion implantation May. 17, 2005
6893911 Process integration for integrated circuits May. 17, 2005
6893967 L-shaped spacer incorporating or patterned using amorphous carbon or CVD organic materials May. 17, 2005
6889425 Method for producing a resistive heating element May. 10, 2005
6890858 Methods of forming materials over uneven surface topologies, and methods of forming insulative materials over and between conductive lines May. 10, 2005
6887793 Method for plasma etching a wafer after backside grinding May. 3, 2005
6884723 Methods for planarization of group VIII metal-containing surfaces using complexing agents Apr. 26, 2005
6881674 Abrasives for chemical mechanical polishing Apr. 19, 2005
6881675 Method and system for reducing wafer edge tungsten residue utilizing a spin etch Apr. 19, 2005
6875704 Method for forming pattern using printing process Apr. 5, 2005
6872328 Method of polishing or planarizing a substrate Mar. 29, 2005
6867122 Redistribution process Mar. 15, 2005
6867138 Method of chemical/mechanical polishing of the surface of semiconductor device Mar. 15, 2005
6864175 Method for fabricating integrated circuit arrangements, and associated circuit arrangements, in particular tunnel contact elements Mar. 8, 2005
6864176 Fabrication process for bonded wafer precision layer thickness control and its non-destructive measurement method Mar. 8, 2005
6855633 Method for fabricating semiconductor device Feb. 15, 2005
6855647 Custom electrodes for molecular memory and logic devices Feb. 15, 2005
6852617 Semiconductor device fabrication method Feb. 8, 2005
6852630 Electroetching process and system Feb. 8, 2005
6852633 Method for operating chemical mechanical polishing ("CMP") tool for the manufacture of semiconductor devices Feb. 8, 2005
6849547 Apparatus and process for polishing a workpiece Feb. 1, 2005
6849946 Planarized semiconductor interconnect topography and method for polishing a metal layer to form interconnect Feb. 1, 2005
6840971 Chemical mechanical polishing systems and methods for their use Jan. 11, 2005
6841480 Polyelectrolyte dispensing polishing pad, production thereof and method of polishing a substrate Jan. 11, 2005
6838382 Method and apparatus for forming a planarizing pad having a film and texture elements for planarization of microelectronic substrates Jan. 4, 2005
6833109 Method and apparatus for storing a semiconductor wafer after its CMP polishing Dec. 21, 2004
6833323 Method for forming patterned features at a semiconductor wafer periphery to prevent metal peeling Dec. 21, 2004
6833324 Process and device for cleaning a semiconductor wafer Dec. 21, 2004
6831014 Method of manufacturing a semiconductor apparatus using chemical mechanical polishing Dec. 14, 2004
6828210 Method of forming a device isolation trench in an integrated circuit device Dec. 7, 2004
6825116 Method for removing structures Nov. 30, 2004
6821187 Method for chemical-mechanical polishing of a layer which is a substrate and is a metal selected from a platinum group Nov. 23, 2004
6821794 Flexible snapshot in endpoint detection Nov. 23, 2004
6821894 CMP process Nov. 23, 2004
6821895 Dynamically adjustable slurry feed arm for wafer edge profile improvement in CMP Nov. 23, 2004
6821897 Method for copper CMP using polymeric complexing agents Nov. 23, 2004
6818548 Fast ramp anneal for hillock suppression in copper-containing structures Nov. 16, 2004
6815352 Silicon focus ring and method for producing the same Nov. 9, 2004
6815353 Multi-layer film stack polish stop Nov. 9, 2004
6813077 Method for fabricating an integrated optical isolator and a novel wire grid structure Nov. 2, 2004
6808944 Structure and method for monitoring a semiconductor process, and method of making such a structure Oct. 26, 2004
6809031 Method for manufacturing a reclaimable test pattern wafer for CMP applications Oct. 26, 2004
6800546 Film forming method by radiating a plasma on a surface of a low dielectric constant film Oct. 5, 2004

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