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Class Information
Number: 438/691
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal
Description: Processes wherein the nonchemical material removal is a mechanical (e.g., abrading, cutting, etc.) removal method.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7371686 |
Method and apparatus for polishing a semiconductor device |
May. 13, 2008 |
| 7371687 |
Electronic circuit device |
May. 13, 2008 |
| 7368388 |
Cerium oxide abrasives for chemical mechanical polishing |
May. 6, 2008 |
| 7364835 |
Developer-soluble materials and methods of using the same in via-first dual damascene applications |
Apr. 29, 2008 |
| 7361974 |
Manufacturing method for an integrated semiconductor structure |
Apr. 22, 2008 |
| 7361600 |
Semiconductor manufacturing apparatus having a built-in inspection apparatus and a device manufacturing method using said manufacturing apparatus |
Apr. 22, 2008 |
| 7357877 |
Dispersion of nanowires of semiconductor material |
Apr. 15, 2008 |
| 7354530 |
Chemical mechanical polishing systems and methods for their use |
Apr. 8, 2008 |
| 7351662 |
Composition and associated method for catalyzing removal rates of dielectric films during chemical mechanical planarization |
Apr. 1, 2008 |
| 7348276 |
Fabrication process of semiconductor device and polishing method |
Mar. 25, 2008 |
| 7344987 |
Method for CMP with variable down-force adjustment |
Mar. 18, 2008 |
| 7344988 |
Alumina abrasive for chemical mechanical polishing |
Mar. 18, 2008 |
| 7335239 |
Chemical mechanical planarization pad |
Feb. 26, 2008 |
| 7335599 |
Method and apparatus for making coplanar isolated regions of different semiconductor materials on a substrate |
Feb. 26, 2008 |
| 7335600 |
Method for removing photoresist |
Feb. 26, 2008 |
| 7335598 |
Chemical-mechanical polishing method |
Feb. 26, 2008 |
| 7332437 |
Method for processing semiconductor wafer and semiconductor wafer |
Feb. 19, 2008 |
| 7323415 |
Polishing pad for semiconductor wafer, polishing multilayered body for semiconductor wafer having same, and method for polishing semiconductor wafer |
Jan. 29, 2008 |
| 7323413 |
Method for stripping silicon nitride |
Jan. 29, 2008 |
| 7323414 |
Method for polishing a substrate surface |
Jan. 29, 2008 |
| 7319072 |
Polishing medium for chemical-mechanical polishing, and method of polishing substrate member |
Jan. 15, 2008 |
| 7318870 |
Method of cleaning semiconductor substrate |
Jan. 15, 2008 |
| 7316976 |
Polishing method to reduce dishing of tungsten on a dielectric |
Jan. 8, 2008 |
| 7312154 |
Method of polishing a semiconductor-on-insulator structure |
Dec. 25, 2007 |
| 7309653 |
Method of forming damascene filament wires and the structure so formed |
Dec. 18, 2007 |
| 7307021 |
Method for planarizing a thin film |
Dec. 11, 2007 |
| 7300874 |
Chemical mechanical polishing compositions and methods relating thereto |
Nov. 27, 2007 |
| 7297632 |
Scratch reduction for chemical mechanical polishing |
Nov. 20, 2007 |
| 7294569 |
Semiconductor device fabrication method and semiconductor device fabrication system for minimizing film-thickness variations |
Nov. 13, 2007 |
| 7294575 |
Chemical mechanical polishing process for forming shallow trench isolation structure |
Nov. 13, 2007 |
| 7291561 |
MEMS device integrated chip package, and method of making same |
Nov. 6, 2007 |
| 7288206 |
High-purity alkali etching solution for silicon wafers and use thereof |
Oct. 30, 2007 |
| 7287314 |
One step copper damascene CMP process and slurry |
Oct. 30, 2007 |
| 7285145 |
Electro chemical mechanical polishing method and device for planarizing semiconductor surfaces |
Oct. 23, 2007 |
| 7285496 |
Hardening of copper to improve copper CMP performance |
Oct. 23, 2007 |
| 7276446 |
Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
Oct. 2, 2007 |
| 7276445 |
Method for forming pattern using printing method |
Oct. 2, 2007 |
| 7271100 |
Slurry composition, polishing method using the slurry composition and method of forming a gate pattern using the slurry composition |
Sep. 18, 2007 |
| 7265054 |
Chemical mechanical polishing method for manufacturing semiconductor device |
Sep. 4, 2007 |
| 7253111 |
Barrier polishing solution |
Aug. 7, 2007 |
| 7247566 |
CMP method for copper, tungsten, titanium, polysilicon, and other substrates using organosulfonic acids as oxidizers |
Jul. 24, 2007 |
| 7247558 |
Method and system for electroprocessing conductive layers |
Jul. 24, 2007 |
| 7244678 |
Methods for planarization of Group VIII metal-containing surfaces using complexing agents |
Jul. 17, 2007 |
| 7238606 |
Semiconductor devices and method for fabricating the same |
Jul. 3, 2007 |
| 7235488 |
In-situ chemical-mechanical planarization pad metrology using ultrasonic imaging |
Jun. 26, 2007 |
| 7230335 |
Inspection methods and structures for visualizing and/or detecting specific chip structures |
Jun. 12, 2007 |
| 7229926 |
Method of manufacturing nitride substrate for semiconductors, and nitride semiconductor substrate |
Jun. 12, 2007 |
| 7226864 |
Method for producing a silicon wafer |
Jun. 5, 2007 |
| 7223685 |
Damascene fabrication with electrochemical layer removal |
May. 29, 2007 |
| 7217650 |
Metallic nanowire interconnections for integrated circuit fabrication |
May. 15, 2007 |
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