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Class Information
Number: 438/691
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) > Combined mechanical and chemical material removal
Description: Processes wherein the nonchemical material removal is a mechanical (e.g., abrading, cutting, etc.) removal method.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615475 |
Method for fabricating landing polysilicon contact structures for semiconductor devices |
Nov. 10, 2009 |
| 7611552 |
Semiconductor polishing composition |
Nov. 3, 2009 |
| 7601642 |
Method of processing silicon wafer |
Oct. 13, 2009 |
| 7597729 |
Polishing composition and polishing method using the same |
Oct. 6, 2009 |
| 7598175 |
Apparatus and method for confined area planarization |
Oct. 6, 2009 |
| 7589022 |
Method of chemical mechanical polishing and method of fabricating semiconductor device using the same |
Sep. 15, 2009 |
| 7589023 |
Method of manufacturing semiconductor wafer |
Sep. 15, 2009 |
| 7585341 |
Polishing material comprising diamond clusters |
Sep. 8, 2009 |
| 7582127 |
Polishing composition for a tungsten-containing substrate |
Sep. 1, 2009 |
| 7582221 |
Wafer manufacturing method, polishing apparatus, and wafer |
Sep. 1, 2009 |
| 7579279 |
Method to passivate conductive surfaces during semiconductor processing |
Aug. 25, 2009 |
| 7575615 |
Process for preparing a polishing composition |
Aug. 18, 2009 |
| 7572693 |
Methods for transistor formation using selective gate implantation |
Aug. 11, 2009 |
| 7563716 |
Polishing method |
Jul. 21, 2009 |
| 7557041 |
Apparatus and method for supplying chemicals |
Jul. 7, 2009 |
| 7556972 |
Detection and characterization of SiCOH-based dielectric materials during device fabrication |
Jul. 7, 2009 |
| 7553430 |
Polishing slurries and methods for chemical mechanical polishing |
Jun. 30, 2009 |
| 7553700 |
Chemical-enhanced package singulation process |
Jun. 30, 2009 |
| 7553768 |
Substrate and a method for polishing a substrate |
Jun. 30, 2009 |
| 7550020 |
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method |
Jun. 23, 2009 |
| 7550092 |
Chemical mechanical polishing composition |
Jun. 23, 2009 |
| 7550387 |
Semiconductor wafer processing method |
Jun. 23, 2009 |
| 7544617 |
Die scale control of chemical mechanical polishing |
Jun. 9, 2009 |
| 7544618 |
Two-step chemical mechanical polishing process |
Jun. 9, 2009 |
| 7544606 |
Method to implement stress free polishing |
Jun. 9, 2009 |
| 7541287 |
Method for machining a semiconductor wafer on both sides in a carrier, carrier, and a semiconductor wafer produced by the method |
Jun. 2, 2009 |
| 7538028 |
Barrier layer, IC via, and IC line forming methods |
May. 26, 2009 |
| 7534719 |
Method for reduction in metal dishing after CMP |
May. 19, 2009 |
| 7534277 |
Slurry composition for secondary polishing of silicon wafer |
May. 19, 2009 |
| 7524347 |
CMP composition comprising surfactant |
Apr. 28, 2009 |
| 7521363 |
MEMS device with non-standard profile |
Apr. 21, 2009 |
| 7514363 |
Chemical-mechanical planarization composition having benzenesulfonic acid and per-compound oxidizing agents, and associated method for use |
Apr. 7, 2009 |
| 7513920 |
Free radical-forming activator attached to solid and used to enhance CMP formulations |
Apr. 7, 2009 |
| 7510973 |
Method for forming fine pattern in semiconductor device |
Mar. 31, 2009 |
| 7510972 |
Method of processing substrate, post-chemical mechanical polishing cleaning method, and method of and program for manufacturing electronic device |
Mar. 31, 2009 |
| 7510970 |
Process for manufacturing semiconductor integrated circuit device |
Mar. 31, 2009 |
| 7504337 |
IC chip uniform delayering methods |
Mar. 17, 2009 |
| 7501035 |
Method of manufacturing replica diffraction grating |
Mar. 10, 2009 |
| 7501051 |
Electropolishing electrolyte and method for planarizing a metal layer using the same |
Mar. 10, 2009 |
| 7498263 |
Method of planarizing an inter-metal insulation film |
Mar. 3, 2009 |
| 7485162 |
Polishing composition |
Feb. 3, 2009 |
| 7476613 |
Method of forming an electrical contact in a semiconductor device using an improved self-aligned contact (SAC) process |
Jan. 13, 2009 |
| 7475368 |
Deflection analysis system and method for circuit design |
Jan. 6, 2009 |
| 7456106 |
Method for producing a silicon wafer |
Nov. 25, 2008 |
| 7452816 |
Semiconductor processing method and chemical mechanical polishing methods |
Nov. 18, 2008 |
| 7452481 |
Polishing slurry and method of reclaiming wafers |
Nov. 18, 2008 |
| 7446020 |
Wafer dividing method and dividing apparatus |
Nov. 4, 2008 |
| 7446039 |
Integrated circuit system with dummy region |
Nov. 4, 2008 |
| 7446045 |
Method of manufacturing nitride substrate for semiconductors |
Nov. 4, 2008 |
| 7442646 |
Slurry, chemical mechanical polishing method using the slurry, and method of forming metal wiring using the slurry |
Oct. 28, 2008 |
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