| |
 |
|
Class Information
Number: 438/690
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.)
Description: Processes wherein the chemical removal is accompanied by the removal, either concurrently or consecutively, of material by nonchemical means.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6043507 |
Thin film transistors and methods of making |
Mar. 28, 2000 |
| 6022807 |
Method for fabricating an integrated circuit |
Feb. 8, 2000 |
| 6010963 |
Global planarization using SOG and CMP |
Jan. 4, 2000 |
| 6010956 |
Process for producing multilayer wiring boards |
Jan. 4, 2000 |
| 6004653 |
Planarization process by applying a polish-differentiating technique utilizing an ultraviolet-light sensitive organic oxide layer |
Dec. 21, 1999 |
| 6004396 |
Spherical shaped semiconductor integrated circuit |
Dec. 21, 1999 |
| 5998301 |
Method and system for providing tapered shallow trench isolation structure profile |
Dec. 7, 1999 |
| 5998298 |
Use of chemical-mechanical polishing for fabricating photonic bandgap structures |
Dec. 7, 1999 |
| 5980979 |
Method for consistently forming low resistance contact structures involving the removal of adhesion layer particles blocking via openings |
Nov. 9, 1999 |
| 5981391 |
Fabrication process of a semiconductor device including grinding of a semiconductor wafer |
Nov. 9, 1999 |
| 5976978 |
Process for repairing data transmission lines of imagers |
Nov. 2, 1999 |
| 5966633 |
Method for providing a metallization layer on an insulating layer and for opening through holes in the said insulating layer using the same mask |
Oct. 12, 1999 |
| 5963821 |
Method of making semiconductor wafers |
Oct. 5, 1999 |
| 5953578 |
Global planarization method using plasma etching |
Sep. 14, 1999 |
| 5948697 |
Catalytic acceleration and electrical bias control of CMP processing |
Sep. 7, 1999 |
| 5948204 |
Wafer carrier ring method and apparatus for chemical-mechanical planarization |
Sep. 7, 1999 |
| 5942131 |
Treatment of a surface having an expose silicon/silica interface |
Aug. 24, 1999 |
| 5932485 |
Method of laser ablation of semiconductor structures |
Aug. 3, 1999 |
| 5922620 |
Chemical-mechanical polishing (CMP) method for controlling polishing rate using ionized water, and CMP apparatus |
Jul. 13, 1999 |
| 5914274 |
Substrate on which bumps are formed and method of forming the same |
Jun. 22, 1999 |
| 5906753 |
Method of making optical semi-conductor device |
May. 25, 1999 |
| 5904568 |
Method of manufacturing a semiconductor wafer |
May. 18, 1999 |
| 5899743 |
Method for fabricating semiconductor wafers |
May. 4, 1999 |
| 5899744 |
Method of manufacturing semiconductor wafers |
May. 4, 1999 |
| 5895222 |
Encapsulant dam standoff for shell-enclosed die assemblies |
Apr. 20, 1999 |
| 5882539 |
Wafer processing method and equipment therefor |
Mar. 16, 1999 |
| 5880027 |
Process for fabricating semiconductor wafer |
Mar. 9, 1999 |
| 5863829 |
Process for fabricating SOI substrate |
Jan. 26, 1999 |
| 5851894 |
Method of vertically integrating microelectronic systems |
Dec. 22, 1998 |
| 5843250 |
Method of forming an image pattern on a die plate |
Dec. 1, 1998 |
| 5840614 |
Method of producing a semiconductor wafer using ultraviolet sensitive tape |
Nov. 24, 1998 |
| 5837610 |
Chemical mechanical polishing (CMP) apparatus and CMP method using the same |
Nov. 17, 1998 |
| 5837607 |
Method of making a laser synthesized ceramic electronic devices and circuits |
Nov. 17, 1998 |
| 5834321 |
Low noise address line repair method for thin film imager devices |
Nov. 10, 1998 |
| 5830806 |
Wafer backing member for mechanical and chemical-mechanical planarization of substrates |
Nov. 3, 1998 |
| 5827395 |
Polishing pad used for polishing silicon wafers and polishing method using the same |
Oct. 27, 1998 |
| 5795825 |
Connection layer forming method |
Aug. 18, 1998 |
| 5773360 |
Reduction of surface contamination in post-CMP cleaning |
Jun. 30, 1998 |
| 5767013 |
Method for forming interconnection in semiconductor pattern device |
Jun. 16, 1998 |
| 5766497 |
Ablation pattering of multilayered structures |
Jun. 16, 1998 |
| 5759880 |
Resistless methods of fabricating FETs |
Jun. 2, 1998 |
| 5759917 |
Composition for oxide CMP |
Jun. 2, 1998 |
| 5750434 |
Surface polishing of silicon carbide electronic device substrate using CEO.sub.2 |
May. 12, 1998 |
| 5747385 |
Method of planarizing interlayer dielectric |
May. 5, 1998 |
| 5710077 |
Method for the generation of stacking-fault-induced damage on the back of semiconductor wafers |
Jan. 20, 1998 |
| 5616524 |
Repair method for low noise metal lines in thin film imager devices |
Apr. 1, 1997 |
| 5540811 |
Method of manufacturing semiconductor device |
Jul. 30, 1996 |
| 5514620 |
Method of producing PN junction device |
May. 7, 1996 |
| 5514618 |
Process for manufacture of flat panel liquid crystal display using direct laser etch |
May. 7, 1996 |
| 5462635 |
Surface processing method and an apparatus for carrying out the same |
Oct. 31, 1995 |
|
|
|
