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Class Information
Number: 438/690
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.)
Description: Processes wherein the chemical removal is accompanied by the removal, either concurrently or consecutively, of material by nonchemical means.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6265314 |
Wafer edge polish |
Jul. 24, 2001 |
| 6265757 |
Forming attached features on a semiconductor substrate |
Jul. 24, 2001 |
| 6251788 |
Method of integrated circuit polishing without dishing effects |
Jun. 26, 2001 |
| 6248667 |
Chemical mechanical polishing method using double polishing stop layer |
Jun. 19, 2001 |
| 6245677 |
Backside chemical etching and polishing |
Jun. 12, 2001 |
| 6242351 |
Diamond slurry for chemical-mechanical planarization of semiconductor wafers |
Jun. 5, 2001 |
| 6242805 |
Method of using a polish stop film to control dishing during copper chemical mechanical polishing |
Jun. 5, 2001 |
| 6242350 |
Post gate etch cleaning process for self-aligned gate mosfets |
Jun. 5, 2001 |
| 6235636 |
Resist removal by polishing |
May. 22, 2001 |
| 6227955 |
Carrier heads, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
May. 8, 2001 |
| 6221774 |
Method for surface treatment of substrates |
Apr. 24, 2001 |
| 6221773 |
Method for working semiconductor wafer |
Apr. 24, 2001 |
| 6214704 |
Method of processing semiconductor wafers to build in back surface damage |
Apr. 10, 2001 |
| 6214732 |
Chemical mechanical polishing endpoint detection by monitoring component activity in effluent slurry |
Apr. 10, 2001 |
| 6211089 |
Method for fabricating GaN substrate |
Apr. 3, 2001 |
| 6207471 |
Method of producing solar cell device |
Mar. 27, 2001 |
| 6204190 |
Method for producing an electronic device |
Mar. 20, 2001 |
| 6204169 |
Processing for polishing dissimilar conductive layers in a semiconductor device |
Mar. 20, 2001 |
| 6197697 |
Method of patterning semiconductor materials and other brittle materials |
Mar. 6, 2001 |
| 6197690 |
Chemically preventing Cu dendrite formation and growth by double sided scrubbing |
Mar. 6, 2001 |
| 6194720 |
Preparation of transmission electron microscope samples |
Feb. 27, 2001 |
| 6191037 |
Methods, apparatuses and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes |
Feb. 20, 2001 |
| 6180527 |
Method and apparatus for thinning article, and article |
Jan. 30, 2001 |
| 6165891 |
Damascene structure with reduced capacitance using a carbon nitride, boron nitride, or boron carbon nitride passivation layer, etch stop layer, and/or cap layer |
Dec. 26, 2000 |
| 6162301 |
Methods and apparatus for cleaning semiconductor substrates after polishing of copper film |
Dec. 19, 2000 |
| 6162730 |
Method for fabricating semiconductor wafers |
Dec. 19, 2000 |
| 6159077 |
Colloidal silica polishing abrasive |
Dec. 12, 2000 |
| 6159754 |
Method of making a circuit edit interconnect structure through the backside of an integrated circuit die |
Dec. 12, 2000 |
| 6153524 |
Cluster tool method using plasma immersion ion implantation |
Nov. 28, 2000 |
| 6150271 |
Differential temperature control in chemical mechanical polishing processes |
Nov. 21, 2000 |
| 6143662 |
Chemical mechanical polishing composition and method of polishing a substrate |
Nov. 7, 2000 |
| 6127271 |
Process for dry etching and vacuum treatment reactor |
Oct. 3, 2000 |
| 6117775 |
Polishing method |
Sep. 12, 2000 |
| 6114245 |
Method of processing semiconductor wafers |
Sep. 5, 2000 |
| 6110391 |
Method of manufacturing a bonding substrate |
Aug. 29, 2000 |
| 6107202 |
Passivation photoresist stripping method to eliminate photoresist extrusion after alloy |
Aug. 22, 2000 |
| 6103571 |
Method for forming a DRAM capacitor having improved capacitance and device formed |
Aug. 15, 2000 |
| 6096635 |
Method for creating via hole in chip |
Aug. 1, 2000 |
| 6096568 |
Process for preparing a semiconductor device package for analysis of a die |
Aug. 1, 2000 |
| 6093648 |
Production method for a discrete structure substrate |
Jul. 25, 2000 |
| 6090688 |
Method for fabricating an SOI substrate |
Jul. 18, 2000 |
| 6091130 |
Semiconductor device having structure suitable for CMP process |
Jul. 18, 2000 |
| 6083836 |
Transistors with substitutionally formed gate structures and method |
Jul. 4, 2000 |
| 6080673 |
Chemical mechanical polishing methods utilizing pH-adjusted polishing solutions |
Jun. 27, 2000 |
| 6069079 |
Exposure of desired node in a multi-layer integrated circuit using FIB and RIE |
May. 30, 2000 |
| 6066565 |
Method of manufacturing a semiconductor wafer |
May. 23, 2000 |
| 6060393 |
Deposition control of stop layer and dielectric layer for use in the formation of local interconnects |
May. 9, 2000 |
| 6057245 |
Gas phase planarization process for semiconductor wafers |
May. 2, 2000 |
| 6051497 |
Formation of sub-groundrule features |
Apr. 18, 2000 |
| 6049137 |
Readable alignment mark structure formed using enhanced chemical mechanical polishing |
Apr. 11, 2000 |
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