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Class Information
Number: 438/690
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.)
Description: Processes wherein the chemical removal is accompanied by the removal, either concurrently or consecutively, of material by nonchemical means.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6413871 |
Nitrogen treatment of polished halogen-doped silicon glass |
Jul. 2, 2002 |
| 6413869 |
Dielectric protected chemical-mechanical polishing in integrated circuit interconnects |
Jul. 2, 2002 |
| 6409936 |
Composition and method of formation and use therefor in chemical-mechanical polishing |
Jun. 25, 2002 |
| 6410440 |
Method and apparatus for a gaseous environment providing improved control of CMP process |
Jun. 25, 2002 |
| 6410438 |
Method and device for polishing work edge |
Jun. 25, 2002 |
| 6407000 |
Method and apparatuses for making and using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies |
Jun. 18, 2002 |
| 6399498 |
Method and apparatus for polishing work |
Jun. 4, 2002 |
| 6399506 |
Method for planarizing an oxide layer |
Jun. 4, 2002 |
| 6399501 |
Method and apparatus for detecting polishing endpoint with optical monitoring |
Jun. 4, 2002 |
| 6395634 |
Glass substrate for magnetic recording medium, magnetic recording medium, and method of manufacturing the same |
May. 28, 2002 |
| 6392787 |
Process for fabricating article comprising photonic band gap material |
May. 21, 2002 |
| 6387808 |
Method of correcting topographical effects on a micro-electronic substrate |
May. 14, 2002 |
| 6383931 |
Convertible hot edge ring to improve low-K dielectric etch |
May. 7, 2002 |
| 6379996 |
Package for semiconductor chip having thin recess portion and thick plane portion |
Apr. 30, 2002 |
| 6380085 |
Method of manufacturing semiconductor devices |
Apr. 30, 2002 |
| 6380092 |
Gas phase planarization process for semiconductor wafers |
Apr. 30, 2002 |
| 6379998 |
Semiconductor device and method for fabricating the same |
Apr. 30, 2002 |
| 6376395 |
Semiconductor wafer manufacturing process |
Apr. 23, 2002 |
| 6372632 |
Method to eliminate dishing of copper interconnects by the use of a sacrificial oxide layer |
Apr. 16, 2002 |
| 6368969 |
Chemical-mechanical polishing methods |
Apr. 9, 2002 |
| 6368970 |
Semiconductor configuration and corresponding production process |
Apr. 9, 2002 |
| 6365520 |
Small particle size chemical mechanical polishing composition |
Apr. 2, 2002 |
| 6362475 |
Scanning electron microscope/energy dispersive spectroscopy sample preparation method and sample produced thereby |
Mar. 26, 2002 |
| 6362101 |
Chemical mechanical polishing methods using low pH slurry mixtures |
Mar. 26, 2002 |
| 6362107 |
Polishing pad and polishing device |
Mar. 26, 2002 |
| 6361646 |
Method and apparatus for endpoint detection for chemical mechanical polishing |
Mar. 26, 2002 |
| 6358840 |
Forming and filling a recess in interconnect with alloy to minimize electromigration |
Mar. 19, 2002 |
| 6358852 |
Decapsulation techniques for multi-chip (MCP) devices |
Mar. 19, 2002 |
| 6358360 |
Precision polishing apparatus for polishing a semiconductor substrate |
Mar. 19, 2002 |
| 6358851 |
Sputter PM procedures with polish tool to effectively remove metal defects from target surface nodules (residue) |
Mar. 19, 2002 |
| 6352817 |
Methodology for mitigating formation of t-tops in photoresist |
Mar. 5, 2002 |
| 6352927 |
Semiconductor wafer and method for fabrication thereof |
Mar. 5, 2002 |
| 6350690 |
Process for achieving full global planarization during CMP of damascene semiconductor structures |
Feb. 26, 2002 |
| 6350678 |
Chemical-mechanical polishing of semiconductors |
Feb. 26, 2002 |
| 6344415 |
Method for forming a shallow trench isolation structure |
Feb. 5, 2002 |
| 6338804 |
Method for removing conductive portions |
Jan. 15, 2002 |
| 6337288 |
Process for the production of electronic parts |
Jan. 8, 2002 |
| 6336970 |
Surface preparation method and semiconductor device |
Jan. 8, 2002 |
| 6329288 |
Semiconductor device and manufacturing method thereof |
Dec. 11, 2001 |
| 6315913 |
Structuring method |
Nov. 13, 2001 |
| 6300246 |
Method for chemical mechanical polishing of semiconductor wafer |
Oct. 9, 2001 |
| 6296717 |
Regeneration of chemical mechanical polishing pads in-situ |
Oct. 2, 2001 |
| 6294019 |
Method of making group III-V compound semiconductor wafer |
Sep. 25, 2001 |
| 6291349 |
Abrasive finishing with partial organic boundary layer |
Sep. 18, 2001 |
| 6284659 |
Method of minimizing defect sources inside high density plasma reactor |
Sep. 4, 2001 |
| 6284658 |
Manufacturing process for semiconductor wafer |
Sep. 4, 2001 |
| 6281589 |
System of selectively cleaning copper substrate surfaces, in-situ, to remove copper oxides |
Aug. 28, 2001 |
| 6276997 |
Use of chemical mechanical polishing and/or poly-vinyl-acetate scrubbing to restore quality of used semiconductor wafers |
Aug. 21, 2001 |
| 6267076 |
Gas phase planarization process for semiconductor wafers |
Jul. 31, 2001 |
| 6265314 |
Wafer edge polish |
Jul. 24, 2001 |
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