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Class Information
Number: 438/690
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.)
Description: Processes wherein the chemical removal is accompanied by the removal, either concurrently or consecutively, of material by nonchemical means.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6884709 |
Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate |
Apr. 26, 2005 |
| 6884721 |
Silicon wafer storage water and silicon wafer storage method |
Apr. 26, 2005 |
| 6869889 |
Etching metal carbide films |
Mar. 22, 2005 |
| 6858482 |
Method of manufacture of programmable switching circuits and memory cells employing a glass layer |
Feb. 22, 2005 |
| 6855567 |
Etch endpoint detection |
Feb. 15, 2005 |
| 6855035 |
Apparatus and method for producing substrate with electrical wire thereon |
Feb. 15, 2005 |
| 6852629 |
Backside integrated circuit die surface finishing technique and tool |
Feb. 8, 2005 |
| 6852633 |
Method for operating chemical mechanical polishing ("CMP") tool for the manufacture of semiconductor devices |
Feb. 8, 2005 |
| 6847092 |
Microelectronic capacitor structure with radial current flow |
Jan. 25, 2005 |
| 6841479 |
Method of reducing in-trench smearing during polishing |
Jan. 11, 2005 |
| 6835118 |
Rigid plate assembly with polishing pad and method of using |
Dec. 28, 2004 |
| 6833109 |
Method and apparatus for storing a semiconductor wafer after its CMP polishing |
Dec. 21, 2004 |
| 6827866 |
Deep-well lithography process for forming micro-electro-mechanical structures |
Dec. 7, 2004 |
| 6821794 |
Flexible snapshot in endpoint detection |
Nov. 23, 2004 |
| 6821893 |
Method of manufacturing a substrate for information recording media |
Nov. 23, 2004 |
| 6815309 |
Support-integrated donor wafers for repeated thin donor layer separation |
Nov. 9, 2004 |
| 6812147 |
GCIB processing to improve interconnection vias and improved interconnection via |
Nov. 2, 2004 |
| 6809031 |
Method for manufacturing a reclaimable test pattern wafer for CMP applications |
Oct. 26, 2004 |
| 6808645 |
Susceptor and surface processing method |
Oct. 26, 2004 |
| 6800495 |
Lot-optimized wafer level burn-in |
Oct. 5, 2004 |
| 6796883 |
Controlled lubricated finishing |
Sep. 28, 2004 |
| 6797625 |
Method of forming a protective step on the edge of a semiconductor wafer |
Sep. 28, 2004 |
| 6797624 |
Solution for ruthenium chemical mechanical planarization |
Sep. 28, 2004 |
| 6793830 |
Method for forming a microstructure from a monocrystalline substrate |
Sep. 21, 2004 |
| 6790747 |
Method and device for controlled cleaving process |
Sep. 14, 2004 |
| 6790779 |
Anisotropic dry etching technique for deep bulk silicon etching |
Sep. 14, 2004 |
| 6787470 |
Sacrificial feature for corrosion prevention during CMP |
Sep. 7, 2004 |
| 6780772 |
Method and system to provide electroplanarization of a workpiece with a conducting material layer |
Aug. 24, 2004 |
| 6780756 |
Etch back of interconnect dielectrics |
Aug. 24, 2004 |
| 6780771 |
Forming a substantially planar upper surface at the outer edge of a semiconductor topography |
Aug. 24, 2004 |
| 6776852 |
Process of removing holefill residue from a metallic surface of an electronic substrate |
Aug. 17, 2004 |
| 6776696 |
Continuous chemical mechanical polishing process for polishing multiple conductive and non-conductive layers on semiconductor wafers |
Aug. 17, 2004 |
| 6773933 |
Method of boosting wafer cleaning efficiency and increasing process yield |
Aug. 10, 2004 |
| 6762124 |
Method for patterning a multilayered conductor/substrate structure |
Jul. 13, 2004 |
| 6762116 |
System and method for fabricating microcomponent parts on a substrate having pre-fabricated electronic circuitry thereon |
Jul. 13, 2004 |
| 6753256 |
Method of manufacturing semiconductor wafer |
Jun. 22, 2004 |
| 6743698 |
Semiconductor wafer, method for producing the same, and wafer chuck |
Jun. 1, 2004 |
| 6743722 |
Method of spin etching wafers with an alkali solution |
Jun. 1, 2004 |
| 6740588 |
Smooth metal semiconductor surface and method for making the same |
May. 25, 2004 |
| 6740569 |
Method of fabricating polysilicon film by excimer laser annealing process |
May. 25, 2004 |
| 6730602 |
Method for forming aluminum bumps by sputtering and chemical mechanical polishing |
May. 4, 2004 |
| 6720263 |
Planarization of metal layers on a semiconductor wafer through non-contact de-plating and control with endpoint detection |
Apr. 13, 2004 |
| 6719916 |
Multilayer microstructures and laser based method for precision and reduced damage patterning of such structures |
Apr. 13, 2004 |
| 6716754 |
Methods of forming patterns and molds for semiconductor constructions |
Apr. 6, 2004 |
| 6716755 |
Composition and method for planarizing surfaces |
Apr. 6, 2004 |
| 6706632 |
Methods for forming capacitor structures; and methods for removal of organic materials |
Mar. 16, 2004 |
| 6703286 |
Metal bond pad for low-k inter metal dielectric |
Mar. 9, 2004 |
| 6692978 |
Methods for marking a bare semiconductor die |
Feb. 17, 2004 |
| 6693033 |
Method of removing an amorphous oxide from a monocrystalline surface |
Feb. 17, 2004 |
| 6692580 |
Method of cleaning a dual damascene structure |
Feb. 17, 2004 |
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