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Class Information
Number: 438/690
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.)
Description: Processes wherein the chemical removal is accompanied by the removal, either concurrently or consecutively, of material by nonchemical means.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7611552 |
Semiconductor polishing composition |
Nov. 3, 2009 |
| 7601640 |
Method of manfacturing semiconductor device |
Oct. 13, 2009 |
| 7601643 |
Arrangement and method for fabricating a semiconductor wafer |
Oct. 13, 2009 |
| 7595509 |
Single crystal wafer for semiconductor laser |
Sep. 29, 2009 |
| 7582221 |
Wafer manufacturing method, polishing apparatus, and wafer |
Sep. 1, 2009 |
| 7579279 |
Method to passivate conductive surfaces during semiconductor processing |
Aug. 25, 2009 |
| 7576007 |
Method for electrochemically mechanically polishing a conductive material on a substrate |
Aug. 18, 2009 |
| 7569492 |
Method for post-etch cleans |
Aug. 4, 2009 |
| 7557041 |
Apparatus and method for supplying chemicals |
Jul. 7, 2009 |
| 7556972 |
Detection and characterization of SiCOH-based dielectric materials during device fabrication |
Jul. 7, 2009 |
| 7556916 |
Method for burying resist and method for manufacturing semiconductor device |
Jul. 7, 2009 |
| 7550092 |
Chemical mechanical polishing composition |
Jun. 23, 2009 |
| 7550387 |
Semiconductor wafer processing method |
Jun. 23, 2009 |
| 7540935 |
Plasma oxidation and removal of oxidized material |
Jun. 2, 2009 |
| 7534277 |
Slurry composition for secondary polishing of silicon wafer |
May. 19, 2009 |
| 7510972 |
Method of processing substrate, post-chemical mechanical polishing cleaning method, and method of and program for manufacturing electronic device |
Mar. 31, 2009 |
| 7510959 |
Method of manufacturing a semiconductor device having damascene structures with air gaps |
Mar. 31, 2009 |
| 7504337 |
IC chip uniform delayering methods |
Mar. 17, 2009 |
| 7501312 |
Method of protecting semiconductor wafer and adhesive film for protection of semiconductor wafer |
Mar. 10, 2009 |
| 7491342 |
Bonded semiconductor substrate manufacturing method thereof |
Feb. 17, 2009 |
| 7475368 |
Deflection analysis system and method for circuit design |
Jan. 6, 2009 |
| 7470171 |
Surface polishing method and apparatus thereof |
Dec. 30, 2008 |
| 7470622 |
Fabrication and use of polished silicon micro-mirrors |
Dec. 30, 2008 |
| 7468322 |
Methods of multi-step electrochemical mechanical planarization of Cu |
Dec. 23, 2008 |
| 7465977 |
Method for producing a packaged integrated circuit |
Dec. 16, 2008 |
| 7455785 |
Method of determining a flatness of an electronic device substrate, method of producing the substrate, method of producing a mask blank, method of producing a transfer mask, polishing method, |
Nov. 25, 2008 |
| 7456106 |
Method for producing a silicon wafer |
Nov. 25, 2008 |
| 7452816 |
Semiconductor processing method and chemical mechanical polishing methods |
Nov. 18, 2008 |
| 7449393 |
Method of manufacturing a semiconductor device with a shallow trench isolation structure |
Nov. 11, 2008 |
| 7442645 |
Method of polishing a silicon-containing dielectric |
Oct. 28, 2008 |
| 7435682 |
Method of manufacturing semiconductor device |
Oct. 14, 2008 |
| 7435683 |
Apparatus and method for selectively recessing spacers on multi-gate devices |
Oct. 14, 2008 |
| 7432186 |
Method of surface treating substrates and method of manufacturing III-V compound semiconductors |
Oct. 7, 2008 |
| 7425172 |
Customized polish pads for chemical mechanical planarization |
Sep. 16, 2008 |
| 7419519 |
Engineered non-polymeric organic particles for chemical mechanical planarization |
Sep. 2, 2008 |
| 7419915 |
Laser assisted chemical etching method for release microscale and nanoscale devices |
Sep. 2, 2008 |
| 7419917 |
Ion implanted microscale and nanoscale device method |
Sep. 2, 2008 |
| 7416962 |
Method for processing a semiconductor wafer including back side grinding |
Aug. 26, 2008 |
| 7413986 |
Feedforward and feedback control for conditioning of chemical mechanical polishing pad |
Aug. 19, 2008 |
| 7410814 |
Process and apparatus for cleaning silicon wafers |
Aug. 12, 2008 |
| 7405152 |
Reducing wire erosion during damascene processing |
Jul. 29, 2008 |
| 7402520 |
Edge removal of silicon-on-insulator transfer wafer |
Jul. 22, 2008 |
| 7390747 |
Nitride semiconductor substrate and method of producing same |
Jun. 24, 2008 |
| 7390755 |
Methods for post etch cleans |
Jun. 24, 2008 |
| 7387455 |
Substrate processing device, substrate processing method, and developing device |
Jun. 17, 2008 |
| 7381638 |
Fabrication technique using sputter etch and vacuum transfer |
Jun. 3, 2008 |
| 7381647 |
Methods and systems for planarizing microelectronic devices with Ge-Se-Ag layers |
Jun. 3, 2008 |
| 7377836 |
Versatile wafer refining |
May. 27, 2008 |
| 7378349 |
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method |
May. 27, 2008 |
| 7371685 |
Low stress barrier layer removal |
May. 13, 2008 |
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