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Class Information
Number: 438/690
Name: Semiconductor device manufacturing: process > Chemical etching > Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.)
Description: Processes wherein the chemical removal is accompanied by the removal, either concurrently or consecutively, of material by nonchemical means.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7371685 |
Low stress barrier layer removal |
May. 13, 2008 |
| 7368066 |
Gold CMP composition and method |
May. 6, 2008 |
| 7364985 |
Method for creating electrical pathways for semiconductor device structures using laser machining processes |
Apr. 29, 2008 |
| 7364835 |
Developer-soluble materials and methods of using the same in via-first dual damascene applications |
Apr. 29, 2008 |
| 7365012 |
Etching method, a method of forming a trench isolation structure, a semiconductor substrate and a semiconductor apparatus |
Apr. 29, 2008 |
| 7361600 |
Semiconductor manufacturing apparatus having a built-in inspection apparatus and a device manufacturing method using said manufacturing apparatus |
Apr. 22, 2008 |
| 7361974 |
Manufacturing method for an integrated semiconductor structure |
Apr. 22, 2008 |
| 7354530 |
Chemical mechanical polishing systems and methods for their use |
Apr. 8, 2008 |
| 7351643 |
Method of manufacturing a semiconductor device |
Apr. 1, 2008 |
| 7351661 |
Semiconductor device having trench isolation layer and a method of forming the same |
Apr. 1, 2008 |
| 7351662 |
Composition and associated method for catalyzing removal rates of dielectric films during chemical mechanical planarization |
Apr. 1, 2008 |
| 7348275 |
Processing method for semiconductor wafer |
Mar. 25, 2008 |
| 7348261 |
Wafer scale thin film package |
Mar. 25, 2008 |
| 7344988 |
Alumina abrasive for chemical mechanical polishing |
Mar. 18, 2008 |
| 7338610 |
Etching method for manufacturing semiconductor device |
Mar. 4, 2008 |
| 7335239 |
Chemical mechanical planarization pad |
Feb. 26, 2008 |
| 7335605 |
Protective tape applying and separating method |
Feb. 26, 2008 |
| 7332262 |
Photolithography scheme using a silicon containing resist |
Feb. 19, 2008 |
| 7332441 |
Passivation of porous semiconductors |
Feb. 19, 2008 |
| 7329619 |
Method for patterning thin film, method and apparatus for fabricating flat panel display |
Feb. 12, 2008 |
| 7329598 |
Method of manufacturing a semiconductor device |
Feb. 12, 2008 |
| 7322287 |
Apparatus for fluid pressure imprint lithography |
Jan. 29, 2008 |
| 7323414 |
Method for polishing a substrate surface |
Jan. 29, 2008 |
| 7319072 |
Polishing medium for chemical-mechanical polishing, and method of polishing substrate member |
Jan. 15, 2008 |
| 7316977 |
Chemical-mechanical planarization composition having ketooxime compounds and associated method for use |
Jan. 8, 2008 |
| 7312017 |
Method for burying resist and method for manufacturing semiconductor device |
Dec. 25, 2007 |
| 7312153 |
Treatment of semiconductor wafers |
Dec. 25, 2007 |
| 7301159 |
Charged particle beam apparatus and method of forming electrodes having narrow gap therebetween by using the same |
Nov. 27, 2007 |
| 7300882 |
Etching method and semiconductor device fabricating method |
Nov. 27, 2007 |
| 7300874 |
Chemical mechanical polishing compositions and methods relating thereto |
Nov. 27, 2007 |
| 7294575 |
Chemical mechanical polishing process for forming shallow trench isolation structure |
Nov. 13, 2007 |
| 7291543 |
Thin flip-chip method |
Nov. 6, 2007 |
| 7288489 |
Process for thinning a semiconductor workpiece |
Oct. 30, 2007 |
| 7285496 |
Hardening of copper to improve copper CMP performance |
Oct. 23, 2007 |
| 7282447 |
Method for an integrated circuit contact |
Oct. 16, 2007 |
| 7276446 |
Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
Oct. 2, 2007 |
| 7273816 |
Methods for removal of organic materials |
Sep. 25, 2007 |
| 7271105 |
Method for making a micro-fluid ejection device |
Sep. 18, 2007 |
| 7271012 |
Failure analysis methods and systems |
Sep. 18, 2007 |
| 7265054 |
Chemical mechanical polishing method for manufacturing semiconductor device |
Sep. 4, 2007 |
| 7259099 |
Strongly textured atomic ridge nanowindows |
Aug. 21, 2007 |
| 7256131 |
Method of controlling the critical dimension of structures formed on a substrate |
Aug. 14, 2007 |
| 7250368 |
Semiconductor wafer manufacturing method and wafer |
Jul. 31, 2007 |
| 7250370 |
Two step post-deposition treatment of ILD layer for a lower dielectric constant and improved mechanical properties |
Jul. 31, 2007 |
| 7247082 |
Polishing composition |
Jul. 24, 2007 |
| 7247571 |
Method for planarizing semiconductor structures |
Jul. 24, 2007 |
| 7238606 |
Semiconductor devices and method for fabricating the same |
Jul. 3, 2007 |
| 7235488 |
In-situ chemical-mechanical planarization pad metrology using ultrasonic imaging |
Jun. 26, 2007 |
| 7232761 |
Method of chemical mechanical polishing with high throughput and low dishing |
Jun. 19, 2007 |
| 7232759 |
Ammonium hydroxide treatments for semiconductor substrates |
Jun. 19, 2007 |
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