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Class Information
Number: 438/689
Name: Semiconductor device manufacturing: process > Chemical etching
Description: Processes having a step of removing material from a semiconductor substrate through the action of a chemical agent, wherein the intent is to use the electrical properties of the semiconductor for at least one of the purposes outlined in section I, C, of the class definition for this class (438).
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6849486 |
Method of manufacturing a thinned gate electrode utilizing protective films and etching |
Feb. 1, 2005 |
| 6846748 |
Method for removing photoresist |
Jan. 25, 2005 |
| 6841485 |
Method of manufacturing semiconductor device and manufacturing line thereof |
Jan. 11, 2005 |
| 6838015 |
Liquid or supercritical carbon dioxide composition |
Jan. 4, 2005 |
| 6835662 |
Partially de-coupled core and periphery gate module process |
Dec. 28, 2004 |
| 6835667 |
Method for etching high-k films in solutions comprising dilute fluoride species |
Dec. 28, 2004 |
| 6835661 |
Method for manufacturing optical element |
Dec. 28, 2004 |
| 6828246 |
Gas delivering device |
Dec. 7, 2004 |
| 6828182 |
Epitaxial thin film forming method |
Dec. 7, 2004 |
| 6828237 |
Sidewall polymer deposition method for forming a patterned microelectronic layer |
Dec. 7, 2004 |
| 6825050 |
Integrated stepwise statistical process control in a plasma processing system |
Nov. 30, 2004 |
| 6825122 |
Method for fabricating a patterned thin film and a micro device |
Nov. 30, 2004 |
| 6821450 |
Substrate and method of forming substrate for fluid ejection device |
Nov. 23, 2004 |
| 6821892 |
Intelligent wet etching tool as a function of chemical concentration, temperature and film loss |
Nov. 23, 2004 |
| 6818559 |
Method of fabrication to sharpen corners of Y-branches in integrated optical components and other micro-devices |
Nov. 16, 2004 |
| 6814837 |
Controlled gas supply line apparatus and process for infilm and onfilm defect reduction |
Nov. 9, 2004 |
| 6815283 |
Method of manufacturing semiconductor devices |
Nov. 9, 2004 |
| 6812544 |
Integrated circuit having oversized components |
Nov. 2, 2004 |
| 6806108 |
Method of manufacturing monolithic ink-jet printhead |
Oct. 19, 2004 |
| 6806206 |
Etching method and etching liquid |
Oct. 19, 2004 |
| 6806529 |
Memory cell with a capacitive structure as a control gate and method of forming the memory cell |
Oct. 19, 2004 |
| 6803240 |
Method of measuring crystal defects in thin Si/SiGe bilayers |
Oct. 12, 2004 |
| 6803314 |
Double-layered low dielectric constant dielectric dual damascene method |
Oct. 12, 2004 |
| 6803248 |
Chemistry for etching quaternary interface layers on InGaAsP mostly formed between GaAs and InxGa(1-x)P layers |
Oct. 12, 2004 |
| 6800560 |
Gas assisted method for applying resist stripper and gas-resist stripper combinations |
Oct. 5, 2004 |
| 6798015 |
Semiconductor device and method of manufacturing the same |
Sep. 28, 2004 |
| 6797194 |
Surface treating for micromachining and method for surface treatment |
Sep. 28, 2004 |
| 6797590 |
DRAM cell structure capable of high integration and fabrication method thereof |
Sep. 28, 2004 |
| 6797617 |
Reduced cross-contamination between chambers in a semiconductor processing tool |
Sep. 28, 2004 |
| 6797621 |
Etchant composition for molybdenum and method of using same |
Sep. 28, 2004 |
| 6797622 |
Selective etching of polysilicon |
Sep. 28, 2004 |
| 6794303 |
Two stage etching of silicon nitride to form a nitride spacer |
Sep. 21, 2004 |
| 6794298 |
CF4+H2O plasma ashing for reduction of contact/via resistance |
Sep. 21, 2004 |
| 6790786 |
Etching processes for integrated circuit manufacturing including methods of forming capacitors |
Sep. 14, 2004 |
| 6790336 |
Method of fabricating damascene structures in mechanically weak interlayer dielectrics |
Sep. 14, 2004 |
| 6790788 |
Method of improving stability in low k barrier layers |
Sep. 14, 2004 |
| 6786998 |
Wafer temperature control apparatus and method |
Sep. 7, 2004 |
| 6787469 |
Double pattern and etch of poly with hard mask |
Sep. 7, 2004 |
| 6787877 |
Method for filling structural gaps and integrated circuitry |
Sep. 7, 2004 |
| 6784111 |
Etching methods and apparatus and substrate assemblies produced therewith |
Aug. 31, 2004 |
| 6784107 |
Method for planarizing a copper interconnect structure |
Aug. 31, 2004 |
| 6784106 |
Wafer drying method |
Aug. 31, 2004 |
| 6780768 |
Bonding pad for optical semiconductor device and fabrication method thereof |
Aug. 24, 2004 |
| 6780770 |
Method for stacking semiconductor die within an implanted medical device |
Aug. 24, 2004 |
| 6777334 |
Method for protecting a wafer backside from etching damage |
Aug. 17, 2004 |
| 6773617 |
Method and apparatus for restricting process fluid flow within a showerhead assembly |
Aug. 10, 2004 |
| 6774040 |
Apparatus and method for surface finishing a silicon film |
Aug. 10, 2004 |
| 6773616 |
Formation of nanoscale wires |
Aug. 10, 2004 |
| 6767832 |
In situ liner barrier |
Jul. 27, 2004 |
| 6768197 |
Hardening flux, soldering resist, semiconductor package reinforced by hardening flux, semiconductor device and method of producing semiconductor package and semiconductor device |
Jul. 27, 2004 |
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