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Class Information
Number: 438/689
Name: Semiconductor device manufacturing: process > Chemical etching
Description: Processes having a step of removing material from a semiconductor substrate through the action of a chemical agent, wherein the intent is to use the electrical properties of the semiconductor for at least one of the purposes outlined in section I, C, of the class definition for this class (438).
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6929713 |
In-situ photoresist removal by an attachable chamber with light source |
Aug. 16, 2005 |
| 6927168 |
Method for manufacturing semiconductor device |
Aug. 9, 2005 |
| 6927167 |
Method for manufacturing semiconductor device having controlled surface roughness |
Aug. 9, 2005 |
| 6927174 |
Site-specific method for large area uniform thickness plan view transmission electron microscopy sample preparation |
Aug. 9, 2005 |
| 6924235 |
Sidewall smoothing in high aspect ratio/deep etching using a discrete gas switching method |
Aug. 2, 2005 |
| 6924230 |
Method for forming a conductive layer |
Aug. 2, 2005 |
| 6924234 |
Method and apparatus for polishing a copper layer and method for forming a wiring structure using copper |
Aug. 2, 2005 |
| 6919284 |
Protective tape applying method and apparatus, and protective tape separating method |
Jul. 19, 2005 |
| 6914007 |
In-situ discharge to avoid arcing during plasma etch processes |
Jul. 5, 2005 |
| 6911346 |
Method of etching a magnetic material |
Jun. 28, 2005 |
| 6911395 |
Method of making borderless contacts in an integrated circuit |
Jun. 28, 2005 |
| 6908860 |
Method for manufacturing semiconductor device and apparatus for manufacturing thereof |
Jun. 21, 2005 |
| 6908859 |
Low leakage power transistor and method of forming |
Jun. 21, 2005 |
| 6908813 |
Method of forming tiny silicon nitride spacer for flash EPROM by fully wet etching technology |
Jun. 21, 2005 |
| 6908311 |
Connection terminal and a semiconductor device including at least one connection terminal |
Jun. 21, 2005 |
| 6905971 |
Treatment of dielectric material to enhance etch rate |
Jun. 14, 2005 |
| 6902681 |
Method for plasma etching of high-K dielectric materials |
Jun. 7, 2005 |
| 6893966 |
Method of patterning the surface of an article using positive microcontact printing |
May. 17, 2005 |
| 6890856 |
Method for eliminating process byproduct during fabrication of liquid crystal display |
May. 10, 2005 |
| 6890855 |
Process of removing residue material from a precision surface |
May. 10, 2005 |
| 6887791 |
Optimization methods for on-chip interconnect geometries suitable for ultra deep sub-micron processes |
May. 3, 2005 |
| 6884677 |
Recessed gate electrode MOS transistors having a substantially uniform channel length across a width of the recessed gate electrode and methods of forming same |
Apr. 26, 2005 |
| 6881679 |
Etching solution for etching Cu and Cu/Ti metal layer of liquid crystal display device and method of fabricating the same |
Apr. 19, 2005 |
| 6881677 |
Method for making a micro-fluid ejection device |
Apr. 19, 2005 |
| 6881127 |
Method and apparatuses for planarizing microelectronic substrate assemblies |
Apr. 19, 2005 |
| 6878608 |
Method of manufacture of silicon based package |
Apr. 12, 2005 |
| 6875260 |
Copper activator solution and method for semiconductor seed layer enhancement |
Apr. 5, 2005 |
| 6875695 |
System and method for analog replication of microdevices having a desired surface contour |
Apr. 5, 2005 |
| 6872655 |
Method of forming an integrated circuit thin film resistor |
Mar. 29, 2005 |
| 6872661 |
Leadless plastic chip carrier with etch back pad singulation and die attach pad array |
Mar. 29, 2005 |
| 6873006 |
Semiconductor memory array of floating gate memory cells with burried floating gate and pointed channel region |
Mar. 29, 2005 |
| 6872603 |
Method for forming interconnections including multi-layer metal film stack for improving corrosion and heat resistances |
Mar. 29, 2005 |
| 6869891 |
Semiconductor device having groove and method of fabricating the same |
Mar. 22, 2005 |
| 6869881 |
Method for forming passive optical coupling device |
Mar. 22, 2005 |
| 6869880 |
In situ application of etch back for improved deposition into high-aspect-ratio features |
Mar. 22, 2005 |
| 6869737 |
Method for exposing a photosensitive resist layer with near-field light |
Mar. 22, 2005 |
| 6869879 |
Method for forming conductive interconnects |
Mar. 22, 2005 |
| 6867137 |
Fabrication method for a semiconductor structure having a partly filled trench |
Mar. 15, 2005 |
| 6863836 |
Method for removal of photoresist using sparger |
Mar. 8, 2005 |
| 6864181 |
Method and apparatus to form a planarized Cu interconnect layer using electroless membrane deposition |
Mar. 8, 2005 |
| 6864563 |
Grounding mechanism for semiconductor devices |
Mar. 8, 2005 |
| 6864174 |
Iteratively selective gas flow control and dynamic database to achieve CD uniformity |
Mar. 8, 2005 |
| 6861758 |
Structure and manufacturing process of localized shunt to reduce electromigration failure of copper dual damascene process |
Mar. 1, 2005 |
| 6861358 |
Deposition mask and method of preparing the same |
Mar. 1, 2005 |
| 6858153 |
Integrated low K dielectrics and etch stops |
Feb. 22, 2005 |
| 6855638 |
Process to pattern thick TiW metal layers using uniform and selective etching |
Feb. 15, 2005 |
| 6855567 |
Etch endpoint detection |
Feb. 15, 2005 |
| 6852617 |
Semiconductor device fabrication method |
Feb. 8, 2005 |
| 6852560 |
Fabrication of a microchip-based electrospray device |
Feb. 8, 2005 |
| 6852563 |
Process of fabricating electro-optic polymer devices with polymer sustained microelectrodes |
Feb. 8, 2005 |
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