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Class Information
Number: 438/689
Name: Semiconductor device manufacturing: process > Chemical etching
Description: Processes having a step of removing material from a semiconductor substrate through the action of a chemical agent, wherein the intent is to use the electrical properties of the semiconductor for at least one of the purposes outlined in section I, C, of the class definition for this class (438).


Sub-classes under this class:

Class Number Class Name Patents
438/705 Altering etchability of substrate region by compositional or crystalline modification 345
438/694 Combined with coating step 901
438/690 Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) 485
438/704 Having liquid and vapor etching steps 425
438/745 Liquid phase etching 1,163
438/706 Vapor phase etching (i.e., dry etching) 1,331


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14

Patent Number Title Of Patent Date Issued
5925212 Apparatus and method for attaining repeatable temperature versus time profiles for plasma heated interactive parts used in mass production plasma processing Jul. 20, 1999
5906948 Method for etching high aspect-ratio multilevel contacts May. 25, 1999
5904566 Reactive ion etch method for forming vias through nitrogenated silicon oxide layers May. 18, 1999
5904567 Layer member forming method May. 18, 1999
5895530 Method and apparatus for directing fluid through a semiconductor processing chamber Apr. 20, 1999
5869398 Etching of indium phosphide materials for microelectronics fabrication Feb. 9, 1999
5858863 Fabrication system and method having inter-apparatus transporter Jan. 12, 1999
5843250 Method of forming an image pattern on a die plate Dec. 1, 1998
5837610 Chemical mechanical polishing (CMP) apparatus and CMP method using the same Nov. 17, 1998
5789322 Low volume gas distribution assembly for a chemical downstream etch tool Aug. 4, 1998
5780313 Method of fabricating semiconductor device Jul. 14, 1998
5776826 Crack stop formation for high-productivity processes Jul. 7, 1998
5733468 Pattern plating method for fabricating printed circuit boards Mar. 31, 1998
5730798 Masking methods during semiconductor device fabrication Mar. 24, 1998
5723384 Method for manufacturing a capacitor in a semiconductor device using selective tungsten nitride thin film Mar. 3, 1998
5714039 Method for making sub-lithographic images by etching the intersection of two spacers Feb. 3, 1998
5702567 Plurality of photolithographic alignment marks with shape, size and spacing based on circuit pattern features Dec. 30, 1997
5647999 Method for fine patterning of a polymeric film Jul. 15, 1997
5601686 Wafer transport method Feb. 11, 1997
5259926 Method of manufacturing a thin-film pattern on a substrate Nov. 9, 1993
4875971 Fabrication of customized integrated circuits Oct. 24, 1989
4845053 Flame ashing process for stripping photoresist Jul. 4, 1989
4544446 VLSI chemical reactor Oct. 1, 1985

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