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Class Information
Number: 438/688
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Aluminum or aluminum alloy conductor
Description: Processes for forming a contact using aluminum (Al) or an alloy thereof.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615868 |
Electrode, method for producing same and semiconductor device using same |
Nov. 10, 2009 |
| 7611615 |
Process for manufacturing a metal electrode |
Nov. 3, 2009 |
| 7608535 |
Method for forming metal contact in semiconductor device |
Oct. 27, 2009 |
| 7601641 |
Two step optical planarizing layer etch |
Oct. 13, 2009 |
| 7585692 |
Thin film layer, heating electrode, phase change memory including thin film layer and methods for forming the same |
Sep. 8, 2009 |
| 7579051 |
Method for manufacturing an electron emitter |
Aug. 25, 2009 |
| 7575963 |
Method for manufacturing contact structures of wiring |
Aug. 18, 2009 |
| 7566647 |
Method of disposing and arranging dummy patterns |
Jul. 28, 2009 |
| 7563704 |
Method of forming an interconnect including a dielectric cap having a tensile stress |
Jul. 21, 2009 |
| 7538001 |
Transistor gate forming methods and integrated circuits |
May. 26, 2009 |
| 7521352 |
Method for manufacturing a semiconductor device |
Apr. 21, 2009 |
| 7517793 |
Method of forming metal wire in semiconductor device |
Apr. 14, 2009 |
| 7488681 |
Method for fabricating Al metal line |
Feb. 10, 2009 |
| 7488684 |
Organic aluminum precursor and method of forming a metal wire using the same |
Feb. 10, 2009 |
| 7473644 |
Method for forming controlled geometry hardmasks including subresolution elements |
Jan. 6, 2009 |
| 7468321 |
Application of impressed-current cathodic protection to prevent metal corrosion and oxidation |
Dec. 23, 2008 |
| 7468319 |
Method for preventing a metal corrosion in a semiconductor device |
Dec. 23, 2008 |
| 7462942 |
Die pillar structures and a method of their formation |
Dec. 9, 2008 |
| 7459387 |
Semiconductor electronic device and method of manufacturing thereof |
Dec. 2, 2008 |
| 7452805 |
Aluminum based conductor for via fill and interconnect |
Nov. 18, 2008 |
| 7446037 |
Cladded silver and silver alloy metallization for improved adhesion and electromigration resistance |
Nov. 4, 2008 |
| 7432203 |
Methods for fabricating a metal layer pattern |
Oct. 7, 2008 |
| 7425765 |
Zinc-aluminum solder alloy |
Sep. 16, 2008 |
| 7416932 |
Power composite integrated semiconductor device and manufacturing method thereof |
Aug. 26, 2008 |
| 7402519 |
Interconnects having sealing structures to enable selective metal capping layers |
Jul. 22, 2008 |
| 7381645 |
Method for the production of an integrated circuit bar arrangement comprising a metal nitride layer and integrated circuit arrangement |
Jun. 3, 2008 |
| 7378002 |
Aluminum sputtering while biasing wafer |
May. 27, 2008 |
| 7358195 |
Method for fabricating liquid crystal display device |
Apr. 15, 2008 |
| 7344986 |
Plating solution, semiconductor device and method for manufacturing the same |
Mar. 18, 2008 |
| 7341942 |
Method for forming metal line of semiconductor device |
Mar. 11, 2008 |
| 7329365 |
Etchant composition for indium oxide layer and etching method using the same |
Feb. 12, 2008 |
| 7312152 |
Lactate-containing corrosion inhibitor |
Dec. 25, 2007 |
| 7297640 |
Method for reducing argon diffusion from high density plasma films |
Nov. 20, 2007 |
| 7288442 |
Method for manufacturing contact structures of wirings |
Oct. 30, 2007 |
| 7276434 |
Method for filling a contact hole having a small diameter and a large aspect ratio |
Oct. 2, 2007 |
| 7262135 |
Methods of forming layers |
Aug. 28, 2007 |
| 7259096 |
Method for forming aluminum interconnect |
Aug. 21, 2007 |
| 7241692 |
Method and structure for aluminum chemical mechanical polishing and protective layer |
Jul. 10, 2007 |
| 7241685 |
Semiconductor device and method of manufacturing the same |
Jul. 10, 2007 |
| 7235310 |
Hillock-free aluminum layer and method of forming the same |
Jun. 26, 2007 |
| 7226854 |
Methods of forming metal lines in semiconductor devices |
Jun. 5, 2007 |
| 7226858 |
Submicron contact fill using a CVD TiN barrier and high temperature PVD aluminum alloy deposition |
Jun. 5, 2007 |
| 7217661 |
Small grain size, conformal aluminum interconnects and method for their formation |
May. 15, 2007 |
| 7214602 |
Method of forming a conductive structure |
May. 8, 2007 |
| 7196008 |
Aluminum oxide as liner or cover layer to spacers in memory device |
Mar. 27, 2007 |
| 7176081 |
Low temperature method for metal deposition |
Feb. 13, 2007 |
| 7163884 |
Semiconductor device and fabrication method thereof |
Jan. 16, 2007 |
| 7141500 |
Methods for forming aluminum containing films utilizing amino aluminum precursors |
Nov. 28, 2006 |
| 7135399 |
Deposition method for wiring thin film |
Nov. 14, 2006 |
| 7122458 |
Method for fabricating pad redistribution layer |
Oct. 17, 2006 |
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