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Class Information
Number: 438/687
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Copper of copper alloy conductor
Description: Processes for forming a contact using copper (Cu) or an alloy thereof.

Patents under this class:

Patent Number Title Of Patent Date Issued
7560381 Technique for metal deposition by electroless plating using an activation scheme including a substrate heating process Jul. 14, 2009
7560380 Chemical dissolution of barrier and adhesion layers Jul. 14, 2009
7560378 Method for manufacturing semiconductor device Jul. 14, 2009
7560016 Selectively accelerated plating of metal features Jul. 14, 2009
7557447 Semiconductor device and method for manufacturing same Jul. 7, 2009
7557035 Method of forming semiconductor devices by microwave curing of low-k dielectric films Jul. 7, 2009
7554199 Substrate for evaluation Jun. 30, 2009
7553754 Electronic device, method of manufacture of the same, and sputtering target Jun. 30, 2009
7553430 Polishing slurries and methods for chemical mechanical polishing Jun. 30, 2009
7550386 Advanced seed layers for interconnects Jun. 23, 2009
7547633 UV assisted thermal processing Jun. 16, 2009
7544606 Method to implement stress free polishing Jun. 9, 2009
7544603 Method of fabricating silicon nitride layer and method of fabricating semiconductor device Jun. 9, 2009
7541279 Method for manufacturing semiconductor device Jun. 2, 2009
7538024 Method of fabricating a dual-damascene copper structure May. 26, 2009
7531447 Process for forming integrated circuit comprising copper lines May. 12, 2009
7528071 Method for fabricating semiconductor device May. 5, 2009
7524755 Entire encapsulation of Cu interconnects using self-aligned CuSiN film Apr. 28, 2009
7521362 Methods for the optimization of ion energy control in a plasma processing system Apr. 21, 2009
7521352 Method for manufacturing a semiconductor device Apr. 21, 2009
7514361 Selective thin metal cap process Apr. 7, 2009
7507667 Selective heating using flash anneal Mar. 24, 2009
7507666 Manufacture method for semiconductor device having concave portions filled with conductor containing Cu as its main composition Mar. 24, 2009
7507660 Deposition processes for tungsten-containing barrier layers Mar. 24, 2009
7507659 Fabrication process of a semiconductor device Mar. 24, 2009
7504699 Fabrication of a semiconductor device with air gaps for ultra-low capacitance interconnections Mar. 17, 2009
7504335 Grafted seed layer for electrochemical plating Mar. 17, 2009
7504333 Method of forming bit line of semiconductor device Mar. 17, 2009
7498262 Method of fabricating a thin film and metal wiring in a semiconductor device Mar. 3, 2009
7498242 Plasma pre-treating surfaces for atomic layer deposition Mar. 3, 2009
7494928 Method for patterning and etching a passivation layer Feb. 24, 2009
7494927 Method of growing electrical conductors Feb. 24, 2009
7494908 Apparatus for integration of barrier layer and seed layer Feb. 24, 2009
7491640 Method of manufacturing semiconductor device Feb. 17, 2009
7491638 Method of forming an insulating capping layer for a copper metallization layer Feb. 17, 2009
7488677 Interconnect structures with encasing cap and methods of making thereof Feb. 10, 2009
7485340 Production of elemental films using a boron-containing reducing agent Feb. 3, 2009
7479453 Method of manufacturing semiconductor device Jan. 20, 2009
7476619 Semiconductor device Jan. 13, 2009
7476618 Selective formation of metal layers in an integrated circuit Jan. 13, 2009
7476611 Semiconductor device and manufacturing method thereof Jan. 13, 2009
7476605 Method of manufacturing semiconductor device Jan. 13, 2009
7476602 N.sub.2 based plasma treatment for enhanced sidewall smoothing and pore sealing porous low-k dielectric films Jan. 13, 2009
7473643 Dendrite growth control circuit Jan. 6, 2009
7473633 Method for making integrated circuit chip having carbon nanotube composite interconnection vias Jan. 6, 2009
7468321 Application of impressed-current cathodic protection to prevent metal corrosion and oxidation Dec. 23, 2008
7468320 Reduced electromigration and stressed induced migration of copper wires by surface coating Dec. 23, 2008
7462942 Die pillar structures and a method of their formation Dec. 9, 2008
7462565 Method of manufacturing semiconductor device Dec. 9, 2008
7459787 Multi-layered copper line structure of semiconductor device and method for forming the same Dec. 2, 2008

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