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Class Information
Number: 438/687
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Copper of copper alloy conductor
Description: Processes for forming a contact using copper (Cu) or an alloy thereof.

Patents under this class:

Patent Number Title Of Patent Date Issued
7678699 Method of forming an insulating capping layer for a copper metallization layer by using a silane reaction Mar. 16, 2010
7674700 Apparatus for manufacturing semiconductor device and method for manufacturing semiconductor device using the same Mar. 9, 2010
7670951 Grid array connection device and method Mar. 2, 2010
7670941 Method for production of semiconductor devices Mar. 2, 2010
7666787 Grain growth promotion layer for semiconductor interconnect structures Feb. 23, 2010
7666292 Method of manufacturing printed circuit board using imprinting process Feb. 23, 2010
7659197 Selective resputtering of metal seed layers Feb. 9, 2010
7655556 Interconnect structures for semiconductor devices Feb. 2, 2010
7648908 Method for forming inlaid interconnect Jan. 19, 2010
7646077 Methods and structure for forming copper barrier layers integral with semiconductor substrates structures Jan. 12, 2010
7645696 Deposition of thin continuous PVD seed layers having improved adhesion to the barrier layer Jan. 12, 2010
7642189 Synergy effect of alloying materials in interconnect structures Jan. 5, 2010
7642186 Metal line of semiconductor device and method of forming the same Jan. 5, 2010
7638434 Method for filling a trench in a semiconductor product Dec. 29, 2009
7633161 Semiconductor device and method of forming metal interconnection layer thereof Dec. 15, 2009
7629249 Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods Dec. 8, 2009
7626264 Substrate for device bonding and method for manufacturing same Dec. 1, 2009
RE40983 Method to plate C4 to copper stud Nov. 17, 2009
7618887 Semiconductor device with a metal line and method of forming the same Nov. 17, 2009
7615421 Method for fabricating thin film transistor Nov. 10, 2009
7611991 Technique for increasing adhesion of metallization layers by providing dummy vias Nov. 3, 2009
7608503 Side wall active pin memory and manufacturing method Oct. 27, 2009
7605470 Dummy patterns and method of manufacture for mechanical strength of low K dielectric materials in copper interconnect structures for semiconductor devices Oct. 20, 2009
7601640 Method of manfacturing semiconductor device Oct. 13, 2009
7598172 Method for manufacturing semiconductor device by using dual damascene process and method for manufacturing article having communicating hole Oct. 6, 2009
7598166 Dielectric layers for metal lines in semiconductor chips Oct. 6, 2009
7595269 Semiconductor device comprising a copper alloy as a barrier layer in a copper metallization layer Sep. 29, 2009
7592259 Methods and systems for barrier layer surface passivation Sep. 22, 2009
7592258 Metallization layer of a semiconductor device having differently thick metal lines and a method of forming the same Sep. 22, 2009
7592246 Method and semiconductor device having copper interconnect for bonding Sep. 22, 2009
7589021 Copper metal interconnection with a local barrier metal layer Sep. 15, 2009
7588667 Depositing rhuthenium films using ionized physical vapor deposition (IPVD) Sep. 15, 2009
7585768 Combined copper plating method to improve gap fill Sep. 8, 2009
7585766 Methods of manufacturing copper interconnect systems Sep. 8, 2009
7585764 VIA bottom contact and method of manufacturing same Sep. 8, 2009
7585762 Vapor deposition processes for tantalum carbide nitride materials Sep. 8, 2009
7585687 Electron emitter device for data storage applications and method of manufacture Sep. 8, 2009
7582564 Process and composition for conductive material removal by electrochemical mechanical polishing Sep. 1, 2009
7582558 Reducing corrosion in copper damascene processes Sep. 1, 2009
7579271 Method for forming low dielectric constant fluorine-doped layers Aug. 25, 2009
7576006 Protective self-aligned buffer layers for damascene interconnects Aug. 18, 2009
7576002 Multi-step barrier deposition method Aug. 18, 2009
7572650 Suppression of localized metal precipitate formation and corresponding metallization depletion in semiconductor processing Aug. 11, 2009
7569937 Technique for forming a copper-based contact layer without a terminal metal Aug. 4, 2009
7569479 Method for fabricating semiconductor device Aug. 4, 2009
7569467 Semiconductor device and manufacturing method thereof Aug. 4, 2009
7566975 Semiconductor device and method for manufacturing the same Jul. 28, 2009
7566664 Selective etching of MEMS using gaseous halides and reactive co-etchants Jul. 28, 2009
7563718 Method for forming tungsten layer of semiconductor device and method for forming tungsten wiring layer using the same Jul. 21, 2009
7563704 Method of forming an interconnect including a dielectric cap having a tensile stress Jul. 21, 2009

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