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Class Information
Number: 438/687
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Copper of copper alloy conductor
Description: Processes for forming a contact using copper (Cu) or an alloy thereof.










Patents under this class:

Patent Number Title Of Patent Date Issued
7790497 Method to prevent alloy formation when forming layered metal oxides by metal oxidation Sep. 7, 2010
7781339 Method of fabricating semiconductor interconnections Aug. 24, 2010
7781325 Copper pillar tin bump on semiconductor chip and method of forming the same Aug. 24, 2010
7781318 Semiconductor device and method of manufacturing the same Aug. 24, 2010
7780867 Edge bevel removal of copper from silicon wafers Aug. 24, 2010
RE41538 Method for making integrated circuit including interconnects with enhanced electromigration resistance using doped seed layer and integrated circuits produced thereby Aug. 17, 2010
7776743 Method of forming semiconductor devices containing metal cap layers Aug. 17, 2010
7776741 Process for through silicon via filing Aug. 17, 2010
7772699 Semiconductor device and method of manufacturing the same Aug. 10, 2010
7772124 Method of manufacturing a through-silicon-via on-chip passive MMW bandpass filter Aug. 10, 2010
7767585 Method of cleaning and process for producing semiconductor device Aug. 3, 2010
7763537 Metal interconnection of semiconductor device and method for forming the same Jul. 27, 2010
7759247 Manufacturing method of semiconductor device with a barrier layer and a metal layer Jul. 20, 2010
7749906 Using unstable nitrides to form semiconductor structures Jul. 6, 2010
7749892 Embedded nano UV blocking and diffusion barrier for improved reliability of copper/ultra low K interlevel dielectric electronic devices Jul. 6, 2010
7749361 Multi-component doping of copper seed layer Jul. 6, 2010
7745335 Semiconductor device manufactured by reducing hillock formation in metal interconnects Jun. 29, 2010
7745327 Method of forming a copper-based metallization layer including a conductive cap layer by an advanced integration regime Jun. 29, 2010
7745280 Metal-insulator-metal capacitor structure Jun. 29, 2010
7741214 Method of forming a semiconductor device featuring copper wiring layers of different widths having metal capping layers of different thicknesses formed thereon Jun. 22, 2010
7737029 Methods of forming metal interconnect structures on semiconductor substrates using oxygen-removing plasmas and interconnect structures formed thereby Jun. 15, 2010
7737028 Selective ruthenium deposition on copper materials Jun. 15, 2010
7737013 Implantation of multiple species to address copper reliability Jun. 15, 2010
7732334 Method for manufacturing semiconductor device Jun. 8, 2010
7732331 Copper interconnect structure having stuffed diffusion barrier Jun. 8, 2010
7732304 Method of manufacturing semiconductor device Jun. 8, 2010
7727891 Method of manufacturing a semiconductor device using a wet process Jun. 1, 2010
7727890 High aspect ratio electroplated metal feature and method Jun. 1, 2010
7727881 Protective self-aligned buffer layers for damascene interconnects Jun. 1, 2010
7727880 Protective self-aligned buffer layers for damascene interconnects Jun. 1, 2010
7718522 Method and apparatus for plating a semiconductor package May. 18, 2010
7713877 Method for fabricating dielectric on metal by baking dielectric precursor under reduced pressure atmosphere May. 11, 2010
7713876 Method for integrating a ruthenium layer with bulk copper in copper metallization May. 11, 2010
7713874 Periodic plasma annealing in an ALD-type process May. 11, 2010
7709344 Integrated circuit fabrication process using gas cluster ion beam etching May. 4, 2010
7704886 Multi-step Cu seed layer formation for improving sidewall coverage Apr. 27, 2010
7704873 Protective self-aligned buffer layers for damascene interconnects Apr. 27, 2010
7700487 Semiconductor device and manufacturing method of semiconductor device Apr. 20, 2010
7700477 Method for fabricating semiconductor device Apr. 20, 2010
7699945 Substrate treatment method and film forming method, film forming apparatus, and computer program Apr. 20, 2010
7696093 Methods for forming copper interconnects for semiconductor devices Apr. 13, 2010
7696092 Method of using ternary copper alloy to obtain a low resistance and large grain size interconnect Apr. 13, 2010
7695981 Seed layers, cap layers, and thin films and methods of making thereof Apr. 13, 2010
7694413 Method of making a bottomless via Apr. 13, 2010
7691736 Minimizing low-k dielectric damage during plasma processing Apr. 6, 2010
7691697 Power composite integrated semiconductor device and manufacturing method thereof Apr. 6, 2010
7682975 Semiconductor device fabrication method Mar. 23, 2010
7682967 Method of forming metal wire in semiconductor device Mar. 23, 2010
7682966 Multistep method of depositing metal seed layers Mar. 23, 2010
7679123 Integrated circuit devices including a capacitor Mar. 16, 2010











 
 
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