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Class Information
Number: 438/687
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Copper of copper alloy conductor
Description: Processes for forming a contact using copper (Cu) or an alloy thereof.










Patents under this class:

Patent Number Title Of Patent Date Issued
7910475 Method for forming low dielectric constant fluorine-doped layers Mar. 22, 2011
7910474 Method of manufacturing a semiconductor device Mar. 22, 2011
7906430 Method of manufacturing a semiconductor device with a peeling prevention layer Mar. 15, 2011
7902061 Interconnect structures with encasing cap and methods of making thereof Mar. 8, 2011
7901545 Ionized physical vapor deposition (iPVD) process Mar. 8, 2011
7897198 Electroless layer plating process and apparatus Mar. 1, 2011
7892976 Semiconductor device and method for manufacturing the same Feb. 22, 2011
7892967 Semiconductor device and method for manufacturing the same Feb. 22, 2011
7888254 Semiconductor device having a refractory metal containing film and method for manufacturing the same Feb. 15, 2011
7884019 Poison-free and low ULK damage integration scheme for damascene interconnects Feb. 8, 2011
7884008 Semiconductor device fabrication method Feb. 8, 2011
7880763 Semiconductor device and manufacturing method therefor Feb. 1, 2011
7879716 Metal seed layer deposition Feb. 1, 2011
7877865 Method of forming a wiring having carbon nanotube Feb. 1, 2011
7871935 Non-plasma capping layer for interconnect applications Jan. 18, 2011
7871929 Method of forming semiconductor devices containing metal cap layers Jan. 18, 2011
7871676 System for depositing a film by modulated ion-induced atomic layer deposition (MII-ALD) Jan. 18, 2011
7867906 Semiconductor device and method for manufacturing same Jan. 11, 2011
7863744 Semiconductor device and method for manufacturing same Jan. 4, 2011
7863194 Implantation of multiple species to address copper reliability Jan. 4, 2011
7858525 Fluorine-free precursors and methods for the deposition of conformal conductive films for nanointerconnect seed and fill Dec. 28, 2010
7858519 Integrated circuit and manufacturing method of copper germanide and copper silicide as copper capping layer Dec. 28, 2010
7855454 Semiconductor device structures including nickel plated aluminum, copper, and tungsten structures Dec. 21, 2010
7855144 Method of forming metal lines and bumps for semiconductor devices Dec. 21, 2010
7851358 Low temperature method for minimizing copper hillock defects Dec. 14, 2010
7846841 Method for forming cobalt nitride cap layers Dec. 7, 2010
7838999 System and method of manufacture for interconnecting an integrated circuit and a substrate Nov. 23, 2010
7838423 Method of forming capping structures on one or more material layer surfaces Nov. 23, 2010
7833900 Interconnections for integrated circuits including reducing an overburden and annealing Nov. 16, 2010
7833893 Method for forming conductive structures Nov. 16, 2010
7829454 Method for integrating selective ruthenium deposition into manufacturing of a semiconductior device Nov. 9, 2010
7825026 Method for processing copper surface, method for forming copper pattern wiring and semiconductor device manufactured using such method Nov. 2, 2010
7820535 Method for analyzing copper electroplating solution, apparatus for the analysis, and method for fabricating semiconductor product Oct. 26, 2010
7816268 Semiconductor device and manufacturing method of semiconductor device Oct. 19, 2010
7816267 Method for forming inlaid interconnect Oct. 19, 2010
7816266 Copper diffusion barrier Oct. 19, 2010
7813133 Semiconductor device Oct. 12, 2010
7811912 Method for manufacturing semiconductor device Oct. 12, 2010
7807572 Micropad formation for a semiconductor Oct. 5, 2010
7807568 Methods for reducing damage to substrate layers in deposition processes Oct. 5, 2010
7807560 Solder bump forming method Oct. 5, 2010
7799684 Two step process for uniform across wafer deposition and void free filling on ruthenium coated wafers Sep. 21, 2010
7799683 Copper interconnect wiring and method and apparatus for forming thereof Sep. 21, 2010
7799681 Method for forming a ruthenium metal cap layer Sep. 21, 2010
7799674 Ruthenium alloy film for copper interconnects Sep. 21, 2010
7795150 Metal capping of damascene structures to improve reliability using hyper selective chemical-mechanical deposition Sep. 14, 2010
7795145 Patterning crystalline compounds on surfaces Sep. 14, 2010
RE41653 Method of forming metal wiring of semiconductor device Sep. 7, 2010
7791897 Multi-layer embedded capacitance and resistance substrate core Sep. 7, 2010
7790617 Formation of metal silicide layer over copper interconnect for reliability enhancement Sep. 7, 2010











 
 
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