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Class Information
Number: 438/687
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Copper of copper alloy conductor
Description: Processes for forming a contact using copper (Cu) or an alloy thereof.










Patents under this class:

Patent Number Title Of Patent Date Issued
8043967 Process for through silicon via filling Oct. 25, 2011
8043966 Method for monitoring patterning integrity of etched openings and forming conductive structures with the openings Oct. 25, 2011
8043957 Semiconductor device, method for manufacturing semiconductor device and apparatus for manufacturing semiconductor Oct. 25, 2011
8039966 Structures of and methods and tools for forming in-situ metallic/dielectric caps for interconnects Oct. 18, 2011
8039395 Technique for forming embedded metal lines having increased resistance against stress-induced material transport Oct. 18, 2011
8039394 Methods of forming layers of alpha-tantalum Oct. 18, 2011
8038898 Abrasive liquid for metal and method for polishing Oct. 18, 2011
8034711 Bonding structure and fabrication thereof Oct. 11, 2011
8026174 Sequential station tool for wet processing of semiconductor wafers Sep. 27, 2011
8026166 Interconnect structures comprising capping layers with low dielectric constants and methods of making the same Sep. 27, 2011
8021980 Methods of manufacturing semiconductor devices including a copper-based conductive layer Sep. 20, 2011
8017523 Deposition of doped copper seed layers having improved reliability Sep. 13, 2011
8017522 Mechanically robust metal/low-.kappa. interconnects Sep. 13, 2011
8017519 Semiconductor device and manufacturing method thereof Sep. 13, 2011
8017024 Method for continual preparation of polycrystalline silicon using a fluidized bed reactor Sep. 13, 2011
8012886 Leadframe treatment for enhancing adhesion of encapsulant thereto Sep. 6, 2011
8008200 Poison-free and low ULK damage integration scheme for damascene interconnects Aug. 30, 2011
8008199 Microstructure modification in copper interconnect structure Aug. 30, 2011
8008198 Large scale method and furnace system for selenization of thin film photovoltaic materials Aug. 30, 2011
8008186 Semiconductor device and method of fabricating the same Aug. 30, 2011
8004087 Semiconductor device with dual damascene wirings and method for manufacturing same Aug. 23, 2011
8003535 Semiconductor device manufacturing method and target substrate processing system Aug. 23, 2011
8003520 Air gap structure having protective metal silicide pads on a metal feature Aug. 23, 2011
8003505 Image sensor and method of fabricating the same Aug. 23, 2011
7994055 Method of manufacturing semiconductor apparatus, and semiconductor apparatus Aug. 9, 2011
7989342 Formation of a reliable diffusion-barrier cap on a Cu-containing interconnect element having grains with different crystal orientations Aug. 2, 2011
7989339 Vapor deposition processes for tantalum carbide nitride materials Aug. 2, 2011
7981790 Semiconductor device and method of fabricating the same Jul. 19, 2011
7977791 Selective formation of boron-containing metal cap pre-layer Jul. 12, 2011
7972941 Method of manufacturing a semiconductor device Jul. 5, 2011
7968464 Memory device with improved data retention Jun. 28, 2011
7964966 Via gouged interconnect structure and method of fabricating same Jun. 21, 2011
7964506 Two step copper electroplating process with anneal for uniform across wafer deposition and void free filling on ruthenium coated wafers Jun. 21, 2011
7964504 PVD-based metallization methods for fabrication of interconnections in semiconductor devices Jun. 21, 2011
7964497 Structure to facilitate plating into high aspect ratio vias Jun. 21, 2011
7964496 Schemes for forming barrier layers for copper in interconnect structures Jun. 21, 2011
7956469 Light emitting device and method of manufacturing the same Jun. 7, 2011
7955980 Method of manufacturing semiconductor device Jun. 7, 2011
7955970 Semiconductor device manufacturing method Jun. 7, 2011
7951714 High aspect ratio electroplated metal feature and method May. 31, 2011
7947602 Conductive pattern formation method May. 24, 2011
7943518 Semiconductor chip, semiconductor mounting module, mobile communication device, and process for producing semiconductor chip May. 17, 2011
7943517 Semiconductor device with a barrier film May. 17, 2011
7936070 Semiconductor device and method for fabricating semiconductor device May. 3, 2011
7935634 Integrated circuits, micromechanical devices, and method of making same May. 3, 2011
7932172 Semiconductor chip and process for forming the same Apr. 26, 2011
7928573 Metal thin film for interconnection of semiconductor device Apr. 19, 2011
7928011 Method for structuring a substrate using a metal mask layer formed using a galvanization process Apr. 19, 2011
7919408 Methods for fabricating fine line/space (FLS) routing in high density interconnect (HDI) substrates Apr. 5, 2011
7915166 Diffusion barrier and etch stop films Mar. 29, 2011











 
 
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