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Class Information
Number: 438/687
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Copper of copper alloy conductor
Description: Processes for forming a contact using copper (Cu) or an alloy thereof.

Patents under this class:

Patent Number Title Of Patent Date Issued
8232201 Schemes for forming barrier layers for copper in interconnect structures Jul. 31, 2012
8232200 Methods of forming integrated circuit devices having damascene interconnects therein with metal diffusion barrier layers and devices formed thereby Jul. 31, 2012
8227347 Interconnecting structure production method, and interconnecting structure Jul. 24, 2012
8227340 Method for producing a copper connection between two sides of a substrate Jul. 24, 2012
8222142 Semiconductor device and method for manufacturing semiconductor device Jul. 17, 2012
8222141 Method for producing an organometallic layer Jul. 17, 2012
8216940 Method for manufacturing a semiconductor device Jul. 10, 2012
8216865 Display device and method of manufacturing the same Jul. 10, 2012
8211795 Method of forming a dielectric cap layer for a copper metallization by using a hydrogen based thermal-chemical treatment Jul. 3, 2012
8207061 Semiconductor device manufacturing method using valve metal and nitride of valve metal Jun. 26, 2012
8193086 Local silicidation of via bottoms in metallization systems of semiconductor devices Jun. 5, 2012
8178972 Semiconductor device and manufacturing method therefor May. 15, 2012
8178436 Adhesion and electromigration performance at an interface between a dielectric and metal May. 15, 2012
8173537 Methods for reducing UV and dielectric diffusion barrier interaction May. 8, 2012
8168543 Methods of forming a layer for barrier applications in an interconnect structure May. 1, 2012
8168540 Methods and apparatus for depositing copper on tungsten May. 1, 2012
8168528 Restoration method using metal for better CD controllability and Cu filing May. 1, 2012
8163649 Copper interconnection structure, semiconductor device, and method for forming copper interconnection structure Apr. 24, 2012
8158520 Method of forming a via structure dual damascene structure for the manufacture of semiconductor integrated circuit devices Apr. 17, 2012
8156643 Semiconductor device Apr. 17, 2012
8153524 Providing superior electromigration performance and reducing deterioration of sensitive low-k dielectrics in metallization systems of semiconductor devices Apr. 10, 2012
8153510 Semiconductor bond pad patterns and method of formation Apr. 10, 2012
8143162 Interconnect structure having a silicide/germanide cap layer Mar. 27, 2012
8143157 Fabrication of a diffusion barrier cap on copper containing conductive elements Mar. 27, 2012
8138084 Electroless Cu plating for enhanced self-forming barrier layers Mar. 20, 2012
8137791 Fuse and pad stress relief Mar. 20, 2012
8133813 Semiconductor device with a barrier film Mar. 13, 2012
8133812 Methods and systems for barrier layer surface passivation Mar. 13, 2012
8133811 Semiconductor device manufacturing method, semiconductor device manufacturing apparatus, computer program and storage medium Mar. 13, 2012
8129627 Circuit board having semiconductor chip Mar. 6, 2012
8129267 Alpha particle blocking wire structure and method fabricating same Mar. 6, 2012
8125085 Semiconductor device having wiring with oxide layer of impurity from the wiring Feb. 28, 2012
8124532 Semiconductor device comprising a copper alloy as a barrier layer in a copper metallization layer Feb. 28, 2012
8124522 Reducing UV and dielectric diffusion barrier interaction through the modulation of optical properties Feb. 28, 2012
8119526 Method of forming a metal layer and a method of fabricating a semiconductor device Feb. 21, 2012
8119525 Process for selective growth of films during ECP plating Feb. 21, 2012
8110497 Method for manufacturing semiconductor device Feb. 7, 2012
8105937 Conformal adhesion promoter liner for metal interconnects Jan. 31, 2012
8105935 Method of manufacturing a semiconductor device Jan. 31, 2012
8097948 Semiconductor device and manufacturing method of semiconductor device Jan. 17, 2012
8084352 Method of manufacturing semiconductor device Dec. 27, 2011
8076241 Methods for multi-step copper plating on a continuous ruthenium film in recessed features Dec. 13, 2011
8072075 CuSiN/SiN diffusion barrier for copper in integrated-circuit devices Dec. 6, 2011
8069813 Wafer electroless plating system and associated methods Dec. 6, 2011
8067310 Semiconductor device and method for manufacturing of same Nov. 29, 2011
8058164 Methods of fabricating electronic devices using direct copper plating Nov. 15, 2011
8053362 Method of forming metal electrode of system in package Nov. 8, 2011
8053356 Interconnect structure for semiconductor devices Nov. 8, 2011
8048799 Method for forming copper wiring in semiconductor device Nov. 1, 2011
8043968 Dielectric barrier layer for increasing electromigration lifetimes in copper interconnect structures Oct. 25, 2011

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