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Class Information
Number: 438/687
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Copper of copper alloy conductor
Description: Processes for forming a contact using copper (Cu) or an alloy thereof.

Patents under this class:

Patent Number Title Of Patent Date Issued
8450206 Method of forming a semiconductor device including a stress buffer material formed above a low-k metallization system May. 28, 2013
8445382 Side wall pore sealing for low-k dielectrics May. 21, 2013
8445377 Mechanically robust metal/low-k interconnects May. 21, 2013
8444868 Method for removing copper oxide layer May. 21, 2013
8440577 Method for reducing metal, multilayer interconnection structure and manufacturing method for the same, and semiconductor device and manufacturing method for the same May. 14, 2013
8440564 Schemes for forming barrier layers for copper in interconnect structures May. 14, 2013
8435905 Manufacturing method of semiconductor device, and substrate processing apparatus May. 7, 2013
8435887 Copper interconnect formation May. 7, 2013
8432031 Semiconductor die including a current routing line having non-metallic slots Apr. 30, 2013
8431483 Methods of forming electrically conductive plugs and method of forming resistance variable elements Apr. 30, 2013
8431032 Method for continual preparation of polycrystalline silicon using a fluidized bed reactor Apr. 30, 2013
8421193 Integrated circuit device having through via and method for preparing the same Apr. 16, 2013
8420538 Liquid for protecting copper wiring surface and method for manufacturing semiconductor circuit element Apr. 16, 2013
8420535 Copper interconnection, method for forming copper interconnection structure, and semiconductor device Apr. 16, 2013
8420529 Copper wiring surface protective liquid and method for manufacturing semiconductor circuit Apr. 16, 2013
8399317 Transistor having an etch stop layer including a metal compound that is selectively formed over a metal gate, and method therefor Mar. 19, 2013
8395200 Method and system for manufacturing copper-based capacitor Mar. 12, 2013
8395160 Organic light emitting display apparatus and method of manufacturing the same Mar. 12, 2013
8390453 Integrated circuit with a rectifier element Mar. 5, 2013
8377824 Methods and apparatus for depositing copper on tungsten Feb. 19, 2013
8373273 Methods of forming integrated circuit devices having damascene interconnects therein with metal diffusion barrier layers and devices formed thereby Feb. 12, 2013
8367547 Method for creating a metal crystalline region, in particular in an integrated circuit Feb. 5, 2013
8354341 Method for forming an interconnect structure Jan. 15, 2013
8349731 Methods for forming copper diffusion barriers for semiconductor interconnect structures Jan. 8, 2013
8349724 Method for improving electromigration lifetime of copper interconnection by extended post anneal Jan. 8, 2013
8349145 Method of burying metal and apparatus of depositing metal in concave portion Jan. 8, 2013
8337715 CMP slurry for metallic film, polishing method and method of manufacturing semiconductor device Dec. 25, 2012
8337675 Method of plasma vapour deposition Dec. 25, 2012
8334204 Semiconductor device and manufacturing method therefor Dec. 18, 2012
8330276 Semiconductor device and method for manufacturing the same Dec. 11, 2012
8330275 Interconnect structure for semiconductor devices Dec. 11, 2012
8329584 Method of manufacturing semiconductor device Dec. 11, 2012
8324104 Surface treatment in semiconductor manufacturing Dec. 4, 2012
8324097 Method of forming a copper topped interconnect structure that has thin and thick copper traces Dec. 4, 2012
8324095 Integration of ALD tantalum nitride for copper metallization Dec. 4, 2012
8309395 Method of fabricating a high-temperature compatible power semiconductor module Nov. 13, 2012
8298948 Capping of copper interconnect lines in integrated circuit devices Oct. 30, 2012
8298947 Semiconductor device having solder-free gold bump contacts for stability in repeated temperature cycles Oct. 30, 2012
8298936 Multistep method of depositing metal seed layers Oct. 30, 2012
8298869 Resin package and production method thereof Oct. 30, 2012
8283485 Process for selectively depositing copper thin films on substrates with copper and ruthenium areas via vapor deposition Oct. 9, 2012
8273656 Method of forming conductive layer and semiconductor device Sep. 25, 2012
8273651 Method for fabricating wiring structure of wiring board Sep. 25, 2012
8258057 Copper-filled trench contact for transistor performance improvement Sep. 4, 2012
8252693 Self-alignment for semiconductor patterns Aug. 28, 2012
8252690 In situ Cu seed layer formation for improving sidewall coverage Aug. 28, 2012
8252680 Methods and architectures for bottomless interconnect vias Aug. 28, 2012
8252679 Semiconductor process Aug. 28, 2012
8247321 Method of manufacturing semiconductor device, semiconductor device, electronic instrument, semiconductor manufacturing apparatus, and storage medium Aug. 21, 2012
8247301 Substrate and manufacturing method therefor Aug. 21, 2012

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