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Class Information
Number: 438/687
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Copper of copper alloy conductor
Description: Processes for forming a contact using copper (Cu) or an alloy thereof.










Patents under this class:
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Patent Number Title Of Patent Date Issued
6821891 Atomic layer deposition of copper using a reducing gas and non-fluorinated copper precursors Nov. 23, 2004
6822331 Method of mounting a circuit component and joint structure therefor Nov. 23, 2004
6818556 Method of plating a metal or metal compound on a semiconductor substrate that includes using the same main component in both plating and etching solutions Nov. 16, 2004
6818557 Method of forming SiC capped copper interconnects with reduced hillock formation and improved electromigration resistance Nov. 16, 2004
6815333 Tri-layer masking architecture for patterning dual damascene interconnects Nov. 9, 2004
6815336 Planarization of copper damascene using reverse current electroplating and chemical mechanical polishing Nov. 9, 2004
6815337 Method to improve borderless metal line process window for sub-micron designs Nov. 9, 2004
6815342 Low resistance metal interconnect lines and a process for fabricating them Nov. 9, 2004
6812136 Method of making a semiconductor device having a multilayer metal film of titanium/titanium nitride/tungsten/tungsten carbide Nov. 2, 2004
6812137 Method of forming coaxial integrated circuitry interconnect lines Nov. 2, 2004
6812143 Process of forming copper structures Nov. 2, 2004
6812144 Method for forming metal wiring in a semiconductor device Nov. 2, 2004
6811670 Method for forming cathode contact areas for an electroplating process Nov. 2, 2004
6811671 Method of controlling zinc-doping in a copper-zinc alloy thin film electroplated on a copper surface and a semiconductor device thereby formed Nov. 2, 2004
6809021 Wiring line and manufacture process thereof and semiconductor device and manufacturing process thereof Oct. 26, 2004
6809029 Semiconductor production device and production method for semiconductor device Oct. 26, 2004
6805138 Semiconductor device production method and semiconductor device production apparatus Oct. 19, 2004
6806103 Method for fabricating semiconductor devices that uses efficient plasmas Oct. 19, 2004
6806181 Method of fabricating an air bridge Oct. 19, 2004
6806185 Method for forming low dielectric constant damascene structure while employing a carbon doped silicon oxide capping layer Oct. 19, 2004
6806191 Semiconductor device with a copper line having an increased resistance against electromigration and a method of forming the same Oct. 19, 2004
6806192 Method of barrier-less integration with copper alloy Oct. 19, 2004
6806578 Copper pad structure Oct. 19, 2004
6806579 Robust via structure and method Oct. 19, 2004
6800548 Method to avoid via poisoning in dual damascene process Oct. 5, 2004
6800554 Copper alloys for interconnections having improved electromigration characteristics and methods of making same Oct. 5, 2004
6800555 Wire bonding process for copper-metallized integrated circuits Oct. 5, 2004
6797608 Method of forming multilayer diffusion barrier for copper interconnections Sep. 28, 2004
6797609 Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit device Sep. 28, 2004
6797620 Method and apparatus for improved electroplating fill of an aperture Sep. 28, 2004
6797652 Copper damascene with low-k capping layer and improved electromigration reliability Sep. 28, 2004
6794287 Process for growing metal or metal carbide thin films utilizing boron-containing reducing agents Sep. 21, 2004
6794288 Method for electroless deposition of phosphorus-containing metal films onto copper with palladium-free activation Sep. 21, 2004
6790757 Wire bonding method for copper interconnects in semiconductor devices Sep. 14, 2004
6790758 Method for fabricating conductive bumps and substrate with metal bumps for flip chip packaging Sep. 14, 2004
6790764 Processing methods for providing metal-comprising materials within high aspect ratio openings Sep. 14, 2004
6790767 Method for formation of copper diffusion barrier film using aluminum Sep. 14, 2004
6790768 Methods and apparatus for polishing substrates comprising conductive and dielectric materials with reduced topographical defects Sep. 14, 2004
6790769 CMP slurry and method of manufacturing semiconductor device Sep. 14, 2004
6790773 Process for forming barrier/seed structures for integrated circuits Sep. 14, 2004
6790774 Method of forming a wiring film by applying high temperature/high pressure Sep. 14, 2004
6790776 Barrier layer for electroplating processes Sep. 14, 2004
6790777 Method for reducing contamination, copper reduction, and depositing a dielectric layer on a semiconductor device Sep. 14, 2004
6790778 Method for capping over a copper layer Sep. 14, 2004
6787434 Method of fabricating polysilicon film by nickel/copper induced lateral crystallization Sep. 7, 2004
6787446 Fabrication method of semiconductor integrated circuit device Sep. 7, 2004
6787458 Polymer memory device formed in via opening Sep. 7, 2004
6787467 Method of forming embedded copper interconnections and embedded copper interconnection structure Sep. 7, 2004
6787470 Sacrificial feature for corrosion prevention during CMP Sep. 7, 2004
6787480 Manufacturing method of semicondcutor device Sep. 7, 2004

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