Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Engineering
Class Information
Number: 438/687
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Copper of copper alloy conductor
Description: Processes for forming a contact using copper (Cu) or an alloy thereof.










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Next

Patent Number Title Of Patent Date Issued
6919274 LSI device etching method and apparatus thereof Jul. 19, 2005
6919275 Method of preventing diffusion of copper through a tantalum-comprising barrier layer Jul. 19, 2005
6916737 Methods of manufacturing a semiconductor device Jul. 12, 2005
6916741 Capture compounds for electronic plating compositions and electronic packaging device manufacture Jul. 12, 2005
6913995 Method of forming a barrier metal in a semiconductor device Jul. 5, 2005
6911229 Structure comprising an interlayer of palladium and/or platinum and method for fabrication thereof Jun. 28, 2005
6911394 Semiconductor devices and methods of manufacturing such semiconductor devices Jun. 28, 2005
6911405 Semiconductor device and method of manufacturing the same Jun. 28, 2005
6908847 Method of manufacturing a semiconductor device having an interconnect embedded in an insulating film Jun. 21, 2005
6908851 Corrosion resistance for copper interconnects Jun. 21, 2005
6908859 Low leakage power transistor and method of forming Jun. 21, 2005
6905950 Growing copper vias or lines within a patterned resist using a copper seed layer Jun. 14, 2005
6905964 Method of fabricating self-aligned metal barriers by atomic layer deposition on the copper layer Jun. 14, 2005
6905965 Reactive preclean prior to metallization for sub-quarter micron application Jun. 14, 2005
6903008 Method for forming an interconnection in a semiconductor element Jun. 7, 2005
6903014 Low temperature reflow method for filling high aspect ratio contacts Jun. 7, 2005
6903015 Method of manufacturing a semiconductor device using a wet process Jun. 7, 2005
6903016 Combined conformal/non-conformal seed layers for metallic interconnects Jun. 7, 2005
6903019 CMP process leaving no residual oxide layer or slurry particles Jun. 7, 2005
6903020 Method of forming buried wiring in semiconductor device Jun. 7, 2005
6898851 Electronic device manufacturing method May. 31, 2005
6900127 Multilayer integrated circuit copper plateable barriers May. 31, 2005
6900131 Method of manufacturing semiconductor device May. 31, 2005
6897144 Cu capping layer deposition with improved integrated circuit reliability May. 24, 2005
6897147 Solution for copper hillock induced by thermal strain with buffer zone for strain relaxation May. 24, 2005
6897148 Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby May. 24, 2005
6897150 Semiconductor wafer surface and method of treating a semiconductor wafer surface May. 24, 2005
6897151 Methods of filling a feature on a substrate with copper nanocrystals May. 24, 2005
6897152 Copper bath composition for electroless and/or electrolytic filling of vias and trenches for integrated circuit fabrication May. 24, 2005
6893541 Multi-step process for depositing copper seed layer in a via May. 17, 2005
6893905 Method of forming substantially hillock-free aluminum-containing components May. 17, 2005
6893953 Fabrication process of a semiconductor device including a CVD process of a metal film May. 17, 2005
6890793 Method for producing a semiconductor die package using leadframe with locating holes May. 10, 2005
6890846 Method for manufacturing semiconductor integrated circuit device May. 10, 2005
6890852 Semiconductor device and manufacturing method of the same May. 10, 2005
6890853 Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module May. 10, 2005
6887781 Method for the formation of diffusion barrier May. 3, 2005
6887789 Process and manufacturing tool architecture for use in the manufacture of one or more protected metallization structures on a workpiece May. 3, 2005
6887790 Method of forming dummy copper plug to improve low k structure mechanical strength and plug fill uniformity May. 3, 2005
6888258 Semiconductor device including copper interconnect line and bonding pad, and method of manufacturing the same May. 3, 2005
6884652 Semiconductor package free of substrate and fabrication method thereof Apr. 26, 2005
6884710 Semiconductor device having multi-layer copper line and method of forming same Apr. 26, 2005
6884720 Forming copper interconnects with Sn coatings Apr. 26, 2005
6881661 Manufacturing method of semiconductor device Apr. 19, 2005
6881666 Method of fabricating semiconductor device Apr. 19, 2005
6881671 Process for depositing metal contacts on a buried grid solar cell and solar cell obtained by the process Apr. 19, 2005
6881673 Integrated deposition process for copper metallization Apr. 19, 2005
6878617 Method of forming copper wire on semiconductor device Apr. 12, 2005
6878621 Method of fabricating barrierless and embedded copper damascene interconnects Apr. 12, 2005
6878628 In situ reduction of copper oxide prior to silicon carbide deposition Apr. 12, 2005

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Next










 
 
  Recently Added Patents
Multi-chip package with a supporting member and method of manufacturing the same
Off-line converter with digital control
Conductive polymer and a solid electrolytic capacitor using the same as a solid electrolyte
Method of adenoviral vector synthesis
Coordinate measuring device and method for measuring with a coordinate measuring device
Bluetooth headset
Network based JIT on a priori knowledge of a set of disparate clients
  Randomly Featured Patents
Process for synthesizing noncrystalline lithium based mixed oxides by high energy milling
Controlling the reception of a data signal stream of a progressive format type file
Sauna
High stability aseismic bearing
Faucet handle
Process for hollowing out a cavity formed of a plurality of sub-cavities in a thin layer of salt
Plasma etching methods
Thermoplastic hollow molded body
Alkali recycle process for recovery of heavy oils and bitumens
Indexing system and method for nearest neighbor searches in high dimensional data spaces