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Class Information
Number: 438/687
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Copper of copper alloy conductor
Description: Processes for forming a contact using copper (Cu) or an alloy thereof.










Patents under this class:
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Patent Number Title Of Patent Date Issued
7048973 Metal film vapor phase deposition method and vapor phase deposition apparatus May. 23, 2006
7049234 Multiple stage electroless deposition of a metal layer May. 23, 2006
7045461 Metal plating method, pretreatment agent, and semiconductor wafer and semiconductor device obtained using these May. 16, 2006
7037824 Copper to aluminum interlayer interconnect using stud and via liner May. 2, 2006
7037826 Method for forming semiconductor device bonding pads May. 2, 2006
7037836 Method of manufacturing a semiconductor device without oxidized copper layer May. 2, 2006
7037837 Method of fabricating robust nucleation/seed layers for subsequent deposition/fill of metallization layers May. 2, 2006
7033928 Method of fabricating semiconductor device Apr. 25, 2006
7033930 Interconnect structures in a semiconductor device and processes of formation Apr. 25, 2006
7033940 Method of forming composite barrier layers with controlled copper interface surface roughness Apr. 25, 2006
7029937 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument Apr. 18, 2006
7030016 Post ECP multi-step anneal/H2 treatment to reduce film impurity Apr. 18, 2006
7030021 Method of fabricating metal interconnection of semiconductor device Apr. 18, 2006
7026244 Low resistance and reliable copper interconnects by variable doping Apr. 11, 2006
7026716 Self-assembled sub-nanolayers as interfacial adhesion enhancers and diffusion barriers Apr. 11, 2006
7021320 Method of removing a via fence Apr. 4, 2006
7022606 Underlayer film for copper, and a semiconductor device including the underlayer film Apr. 4, 2006
7018925 Post high voltage gate oxide pattern high-vacuum outgas surface treatment Mar. 28, 2006
7015110 Method and structure of manufacturing high capacitance metal on insulator capacitors in copper Mar. 21, 2006
7015136 Method for preventing formation of photoresist scum Mar. 21, 2006
7015138 Multi-layered barrier metal thin films for Cu interconnect by ALCVD Mar. 21, 2006
7011981 Method for forming thin film and method for fabricating liquid crystal display using the same Mar. 14, 2006
7008867 Method for forming copper bump antioxidation surface Mar. 7, 2006
7008871 Selective capping of copper wiring Mar. 7, 2006
7001841 Production method of semiconductor device Feb. 21, 2006
6998325 Method for manufacturing semiconductor device Feb. 14, 2006
6998337 Thermal annealing for Cu seed layer enhancement Feb. 14, 2006
6998342 Electronic device manufacturing method Feb. 14, 2006
6995087 Integrated circuit with simultaneous fabrication of dual damascene via and trench Feb. 7, 2006
6995088 Surface treatment of copper to improve interconnect formation Feb. 7, 2006
6995471 Self-passivated copper interconnect structure Feb. 7, 2006
6992004 Implanted barrier layer to improve line reliability and method of forming same Jan. 31, 2006
6992005 Semiconductor device and method of manufacturing the same Jan. 31, 2006
6992006 Method for fabricating semiconductor device Jan. 31, 2006
6992012 Method and apparatus for forming improved metal interconnects Jan. 31, 2006
6992200 Copper complexes and process for formation of copper-containing thin films by using the same Jan. 31, 2006
6989328 Method of manufacturing semiconductor device having damascene interconnection Jan. 24, 2006
6987059 Method and structure for creating ultra low resistance damascene copper wiring Jan. 17, 2006
6984532 Method of judging residual film by optical measurement Jan. 10, 2006
6984582 Method of making semiconductor device by polishing with intermediate clean polishing Jan. 10, 2006
6979625 Copper interconnects with metal capping layer and selective copper alloys Dec. 27, 2005
6979642 Method of self-annealing conductive lines that separates grain size effects from alloy mobility Dec. 27, 2005
6979645 Method of producing a semiconductor device having copper wiring Dec. 27, 2005
6979646 Hardening of copper to improve copper CMP performance Dec. 27, 2005
6979647 Method for chemical etch control of noble metals in the presence of less noble metals Dec. 27, 2005
6974767 Chemical solution for electroplating a copper-zinc alloy thin film Dec. 13, 2005
6972257 Conductive material patterning methods Dec. 6, 2005
6969301 Filling plugs through chemical mechanical polish Nov. 29, 2005
6969638 Low cost substrate for an integrated circuit device with bondpads free of plated gold Nov. 29, 2005
6969675 Method of forming multilayer diffusion barrier for copper interconnections Nov. 29, 2005

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