Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Engineering
Class Information
Number: 438/687
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Copper of copper alloy conductor
Description: Processes for forming a contact using copper (Cu) or an alloy thereof.










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Next

Patent Number Title Of Patent Date Issued
7129160 Method for simultaneously removing multiple conductive materials from microelectronic substrates Oct. 31, 2006
7122484 Process for removing organic materials during formation of a metal interconnect Oct. 17, 2006
7122473 Edge and bevel cleaning process and system Oct. 17, 2006
7122466 Two step semiconductor manufacturing process for copper interconnects Oct. 17, 2006
7122465 Method for achieving increased control over interconnect line thickness across a wafer and between wafers Oct. 17, 2006
7119439 Semiconductor device and method for manufacturing the same Oct. 10, 2006
7119019 Capping of copper structures in hydrophobic ILD using aqueous electro-less bath Oct. 10, 2006
7119018 Copper conductor Oct. 10, 2006
7119009 Semiconductor device with dual damascene wiring Oct. 10, 2006
7115510 Method for electrochemically processing a workpiece Oct. 3, 2006
7115503 Method and apparatus for processing thin metal layers Oct. 3, 2006
7115498 Method of ultra-low energy ion implantation to form alloy layers in copper Oct. 3, 2006
7115440 SO.sub.2 treatment of oxidized CuO for copper sulfide formation of memory element growth Oct. 3, 2006
7112528 Fully planarized dual damascene metallization using copper line interconnect and selective CVD aluminum plug Sep. 26, 2006
7109127 Manufacturing method of semiconductor device Sep. 19, 2006
7109112 Method of providing a structure using self-aligned features Sep. 19, 2006
7109109 Contact plug in semiconductor device and method of forming the same Sep. 19, 2006
7105445 Interconnect structures with encasing cap and methods of making thereof Sep. 12, 2006
7101788 Semiconductor devices and methods of manufacturing such semiconductor devices Sep. 5, 2006
7101790 Method of forming a robust copper interconnect by dilute metal doping Sep. 5, 2006
7098133 Method of forming copper wiring in a semiconductor device Aug. 29, 2006
7098134 Method for fabricating semiconductor device Aug. 29, 2006
7094675 Structure having spatially separated photo-excitable electron-hole pairs and method of manufacturing same Aug. 22, 2006
7094680 Formation of a tantalum-nitride layer Aug. 22, 2006
7094681 Semiconductor device fabrication method Aug. 22, 2006
7094692 Semiconductor device and method of manufacturing the same Aug. 22, 2006
7087520 Method for fabricating metal wiring Aug. 8, 2006
7087524 Method of forming copper wiring in semiconductor device Aug. 8, 2006
7084056 Electrical interconnection, method of forming the electrical interconnection, image sensor having the electrical interconnection and method of manufacturing the image sensor Aug. 1, 2006
7084059 CMP system for metal deposition Aug. 1, 2006
7084510 Semiconductor device and method of manufacturing the same Aug. 1, 2006
7078336 Method and system for fabricating a copper barrier layer with low dielectric constant and leakage current Jul. 18, 2006
7078340 Metal deposit process Jul. 18, 2006
7074709 Localized doping and/or alloying of metallization for increased interconnect performance Jul. 11, 2006
7074716 Method of manufacturing a semiconductor device Jul. 11, 2006
7074719 ALD deposition of ruthenium Jul. 11, 2006
7071013 Fixture and method for uniform electroless metal deposition on integrated circuit bond pads Jul. 4, 2006
7067424 Method of manufacturing an electronic device Jun. 27, 2006
7064057 Method and apparatus for localized material removal by electrochemical polishing Jun. 20, 2006
7064060 Method for manufacturing semiconductor device Jun. 20, 2006
7064064 Copper recess process with application to selective capping and electroless plating Jun. 20, 2006
7064065 Silver under-layers for electroless cobalt alloys Jun. 20, 2006
7064068 Method to improve planarity of electroplated copper Jun. 20, 2006
7060617 Method of protecting a seed layer for electroplating Jun. 13, 2006
7060618 Semiconductor device, method for manufacturing the same, and plating solution Jun. 13, 2006
7060619 Reduction of the shear stress in copper via's in organic interlayer dielectric material Jun. 13, 2006
7060631 Methods of cleaning surfaces of copper-containing materials, and methods of forming openings to copper-containing substrates Jun. 13, 2006
7056826 Method of forming copper interconnects Jun. 6, 2006
7052987 Method for fabricating a low capacitance wiring layout May. 30, 2006
7052993 Thin film transistor having copper alloy wire and method of manufacturing the same May. 30, 2006

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Next










 
 
  Recently Added Patents
Chemical method of making a suspension, emulsion or dispersion of pyrithione particles
Linear jet ionizer
Computer network running a distributed application
Battery-operated massager and soap dispensing wand
System and method for multi-tiered meta-data caching and distribution in a clustered computer environment
Reactor core of liquid metal cooled reactor
Plants and seeds of hybrid corn variety CH450823
  Randomly Featured Patents
Pressurization method for aerosol dispenser
Laser beam scanning apparatus with compact SOS sensor
Video transcoder with bitstream look ahead for rate control and statistical multiplexing
Stabilizing electro-absorption modulators (EAM's) performance by maintaining constant absorption with the use of integrated tap couplers
Insert sintering
Electrical conductor connecting system incorporating cutting ledge
Riser tensioner system for use on offshore platforms using elastomeric pads or helical metal compression springs
Pixel coupled to three horizontal lines and organic light emitting display device using the same
Station of a TDMA communication network capable of quickly changing communication traffic without causing an overlap between transmission bursts
Conductive infrared window