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Class Information
Number: 438/687
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Copper of copper alloy conductor
Description: Processes for forming a contact using copper (Cu) or an alloy thereof.










Patents under this class:
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Patent Number Title Of Patent Date Issued
7268071 Dual damascene interconnections having low K layer with reduced damage arising from photoresist stripping Sep. 11, 2007
7268037 Method for fabricating microchips using metal oxide masks Sep. 11, 2007
7267861 Solder joints for copper metallization having reduced interfacial voids Sep. 11, 2007
7262133 Enhancement of copper line reliability using thin ALD tan film to cap the copper line Aug. 28, 2007
7257893 Efficient wafer processing technology Aug. 21, 2007
7256122 Method of fabricating semiconductor device Aug. 14, 2007
7253524 Copper interconnects Aug. 7, 2007
7253110 Method and apparatus for forming a barrier metal layer in semiconductor devices Aug. 7, 2007
7253106 Manufacturable CoWP metal cap process for copper interconnects Aug. 7, 2007
7253103 Method for producing semiconductor devices that includes forming a copper film in contact with a ruthenium film Aug. 7, 2007
7247565 Methods for fabricating a copper interconnect Jul. 24, 2007
7247563 Filling high aspect ratio openings by enhanced electrochemical deposition (ECD) Jul. 24, 2007
7247560 Selective deposition of double damascene metal Jul. 24, 2007
7247555 Method to control dual damascene trench etch profile and trench depth uniformity Jul. 24, 2007
7244677 Method for filling recessed micro-structures with metallization in the production of a microelectronic device Jul. 17, 2007
7241696 Method for depositing a metal layer on a semiconductor interconnect structure having a capping layer Jul. 10, 2007
7241677 Process for producing integrated circuits including reduction using gaseous organic compounds Jul. 10, 2007
7239017 Low-k B-doped SiC copper diffusion barrier films Jul. 3, 2007
7238617 Method for fabricating semiconductor device to minimize terminal effect in ECP process Jul. 3, 2007
7235487 Metal seed layer deposition Jun. 26, 2007
7232765 Utilization of a Ta-containing cap over copper to facilitate concurrent formation of copper vias and memory element structures Jun. 19, 2007
7232757 Semiconductor integrated circuit device and fabrication method for semiconductor integrated circuit device Jun. 19, 2007
7232752 Method of removing contaminants from a silicon wafer after chemical-mechanical polishing operation Jun. 19, 2007
7232746 Method for forming dual damascene interconnection in semiconductor device Jun. 19, 2007
7229924 Surface barriers for copper and silver interconnects produced by a damascene process Jun. 12, 2007
7229923 Multi-step process for forming a barrier film for use in copper layer formation Jun. 12, 2007
7229922 Method for making a semiconductor device having increased conductive material reliability Jun. 12, 2007
7229921 Semiconductor device and manufacturing method for the same Jun. 12, 2007
7229911 Adhesion improvement for low k dielectrics to conductive materials Jun. 12, 2007
7223695 Methods to deposit metal alloy barrier layers May. 29, 2007
7223691 Method of forming low resistance and reliable via in inter-level dielectric interconnect May. 29, 2007
7223690 Substrate processing method May. 29, 2007
7223685 Damascene fabrication with electrochemical layer removal May. 29, 2007
7223680 Method of forming a dual damascene metal trace with reduced RF impedance resulting from the skin effect May. 29, 2007
7220680 Method for photolithography in semiconductor manufacturing May. 22, 2007
7220675 Method of forming metal wiring of semiconductor device May. 22, 2007
7220674 Copper alloys for interconnections having improved electromigration characteristics and methods of making same May. 22, 2007
7217655 Electroplated CoWP composite structures as copper barrier layers May. 15, 2007
7214614 System for controlling metal formation processes using ion implantation May. 8, 2007
7214570 Encapsulating a device May. 8, 2007
7211896 Semiconductor device and method of manufacturing the same May. 1, 2007
7211506 Methods of forming cobalt layers for semiconductor devices May. 1, 2007
7208415 Plasma treatment method for electromigration reduction Apr. 24, 2007
7208411 Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module Apr. 24, 2007
7208404 Method to reduce Rs pattern dependence effect Apr. 24, 2007
7205588 Metal fuse for semiconductor devices Apr. 17, 2007
7205235 Method for reducing corrosion of metal surfaces during semiconductor processing Apr. 17, 2007
7205226 Sacrificial layer for protection during trench etch Apr. 17, 2007
7205223 Method of forming an interconnect structure for a semiconductor device Apr. 17, 2007
7202168 Method of producing semiconductor device Apr. 10, 2007

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