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Class Information
Number: 438/687
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Copper of copper alloy conductor
Description: Processes for forming a contact using copper (Cu) or an alloy thereof.










Patents under this class:
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Patent Number Title Of Patent Date Issued
7354853 Selective dry etching of tantalum and tantalum nitride Apr. 8, 2008
7354849 Catalytically enhanced atomic layer deposition process Apr. 8, 2008
7351655 Copper interconnect systems which use conductive, metal-based cap layers Apr. 1, 2008
7351651 Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuits Apr. 1, 2008
7344913 Spin on memory cell active layer doped with metal ions Mar. 18, 2008
7341948 Method of making a semiconductor structure with a plating enhancement layer Mar. 11, 2008
7341947 Methods of forming metal-containing films over surfaces of semiconductor substrates Mar. 11, 2008
7341946 Methods for the electrochemical deposition of copper onto a barrier layer of a work piece Mar. 11, 2008
7341945 Method of fabricating semiconductor device Mar. 11, 2008
7338910 Method of fabricating semiconductor devices and method of removing a spacer Mar. 4, 2008
7338903 Sequential reducing plasma and inert plasma pre-treatment method for oxidizable conductor layer Mar. 4, 2008
7338893 Integration of pore sealing liner into dual-damascene methods and devices Mar. 4, 2008
7335596 Method for fabricating copper-based interconnections for semiconductor device Feb. 26, 2008
7335591 Method for forming three-dimensional structures on a substrate Feb. 26, 2008
7329607 Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby Feb. 12, 2008
7326641 Semiconductor device and method for manufacturing the same Feb. 5, 2008
7326632 Method for fabricating metal wirings of semiconductor device Feb. 5, 2008
7323408 Metal barrier cap fabrication by polymer lift-off Jan. 29, 2008
7319073 Method of reducing silicon damage around laser marking region of wafers in STI CMP process Jan. 15, 2008
7319071 Methods for forming a metallic damascene structure Jan. 15, 2008
7319065 Semiconductor component and method of manufacture Jan. 15, 2008
7315084 Copper interconnection and the method for fabricating the same Jan. 1, 2008
7312160 Removing solution, cleaning method for semiconductor substrate, and process for production of semiconductor device Dec. 25, 2007
7312151 System for ultraviolet atmospheric seed layer remediation Dec. 25, 2007
7312149 Copper plating of semiconductor devices using single intermediate low power immersion step Dec. 25, 2007
7309651 Method for improving reliability of copper interconnects Dec. 18, 2007
7306988 Memory cell and method of making the memory cell Dec. 11, 2007
7303992 Copper electrodeposition in microelectronics Dec. 4, 2007
7300866 Method for fabricating metal line in a semiconductor Nov. 27, 2007
7297640 Method for reducing argon diffusion from high density plasma films Nov. 20, 2007
7297630 Methods of fabricating via hole and trench Nov. 20, 2007
7297629 Ultra-thick metal-copper dual damascene process Nov. 20, 2007
7294574 Sputter deposition and etching of metallization seed layer for overhang and sidewall improvement Nov. 13, 2007
7294241 Method to form alpha phase Ta and its application to IC manufacturing Nov. 13, 2007
7291562 Method to form topography in a deposited layer above a substrate Nov. 6, 2007
7291558 Copper interconnect wiring and method of forming thereof Nov. 6, 2007
7291557 Method for forming an interconnection structure for ic metallization Nov. 6, 2007
7288205 Hermetic low dielectric constant layer for barrier applications Oct. 30, 2007
7285494 Multiple stage electroless deposition of a metal layer Oct. 23, 2007
7285492 Method for processing substrate Oct. 23, 2007
7285489 Dual damascene process for forming a multi-layer low-k dielectric interconnect Oct. 23, 2007
7282445 Multiple seed layers for interconnects Oct. 16, 2007
7279423 Forming a copper diffusion barrier Oct. 9, 2007
7279231 Electroless plating structure Oct. 9, 2007
7276457 Selective heating using flash anneal Oct. 2, 2007
7273808 Reactive barrier/seed preclean process for damascene process Sep. 25, 2007
7272889 Production method of suspension board with circuit Sep. 25, 2007
7271095 Process for producing metallic interconnects and contact surfaces on electronic components Sep. 18, 2007
7271088 Slurry composition with high planarity and CMP process of dielectric film using the same Sep. 18, 2007
7268087 Manufacturing method of semiconductor device Sep. 11, 2007

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