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Class Information
Number: 438/687
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Copper of copper alloy conductor
Description: Processes for forming a contact using copper (Cu) or an alloy thereof.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| RE40983 |
Method to plate C4 to copper stud |
Nov. 17, 2009 |
| 7618887 |
Semiconductor device with a metal line and method of forming the same |
Nov. 17, 2009 |
| 7615421 |
Method for fabricating thin film transistor |
Nov. 10, 2009 |
| 7611991 |
Technique for increasing adhesion of metallization layers by providing dummy vias |
Nov. 3, 2009 |
| 7608503 |
Side wall active pin memory and manufacturing method |
Oct. 27, 2009 |
| 7605470 |
Dummy patterns and method of manufacture for mechanical strength of low K dielectric materials in copper interconnect structures for semiconductor devices |
Oct. 20, 2009 |
| 7601640 |
Method of manfacturing semiconductor device |
Oct. 13, 2009 |
| 7598172 |
Method for manufacturing semiconductor device by using dual damascene process and method for manufacturing article having communicating hole |
Oct. 6, 2009 |
| 7598166 |
Dielectric layers for metal lines in semiconductor chips |
Oct. 6, 2009 |
| 7595269 |
Semiconductor device comprising a copper alloy as a barrier layer in a copper metallization layer |
Sep. 29, 2009 |
| 7592259 |
Methods and systems for barrier layer surface passivation |
Sep. 22, 2009 |
| 7592258 |
Metallization layer of a semiconductor device having differently thick metal lines and a method of forming the same |
Sep. 22, 2009 |
| 7592246 |
Method and semiconductor device having copper interconnect for bonding |
Sep. 22, 2009 |
| 7589021 |
Copper metal interconnection with a local barrier metal layer |
Sep. 15, 2009 |
| 7588667 |
Depositing rhuthenium films using ionized physical vapor deposition (IPVD) |
Sep. 15, 2009 |
| 7585768 |
Combined copper plating method to improve gap fill |
Sep. 8, 2009 |
| 7585766 |
Methods of manufacturing copper interconnect systems |
Sep. 8, 2009 |
| 7585764 |
VIA bottom contact and method of manufacturing same |
Sep. 8, 2009 |
| 7585762 |
Vapor deposition processes for tantalum carbide nitride materials |
Sep. 8, 2009 |
| 7585687 |
Electron emitter device for data storage applications and method of manufacture |
Sep. 8, 2009 |
| 7582564 |
Process and composition for conductive material removal by electrochemical mechanical polishing |
Sep. 1, 2009 |
| 7582558 |
Reducing corrosion in copper damascene processes |
Sep. 1, 2009 |
| 7579271 |
Method for forming low dielectric constant fluorine-doped layers |
Aug. 25, 2009 |
| 7576006 |
Protective self-aligned buffer layers for damascene interconnects |
Aug. 18, 2009 |
| 7576002 |
Multi-step barrier deposition method |
Aug. 18, 2009 |
| 7572650 |
Suppression of localized metal precipitate formation and corresponding metallization depletion in semiconductor processing |
Aug. 11, 2009 |
| 7569937 |
Technique for forming a copper-based contact layer without a terminal metal |
Aug. 4, 2009 |
| 7569479 |
Method for fabricating semiconductor device |
Aug. 4, 2009 |
| 7569467 |
Semiconductor device and manufacturing method thereof |
Aug. 4, 2009 |
| 7566975 |
Semiconductor device and method for manufacturing the same |
Jul. 28, 2009 |
| 7566664 |
Selective etching of MEMS using gaseous halides and reactive co-etchants |
Jul. 28, 2009 |
| 7563718 |
Method for forming tungsten layer of semiconductor device and method for forming tungsten wiring layer using the same |
Jul. 21, 2009 |
| 7563704 |
Method of forming an interconnect including a dielectric cap having a tensile stress |
Jul. 21, 2009 |
| 7560381 |
Technique for metal deposition by electroless plating using an activation scheme including a substrate heating process |
Jul. 14, 2009 |
| 7560380 |
Chemical dissolution of barrier and adhesion layers |
Jul. 14, 2009 |
| 7560378 |
Method for manufacturing semiconductor device |
Jul. 14, 2009 |
| 7560016 |
Selectively accelerated plating of metal features |
Jul. 14, 2009 |
| 7557447 |
Semiconductor device and method for manufacturing same |
Jul. 7, 2009 |
| 7557035 |
Method of forming semiconductor devices by microwave curing of low-k dielectric films |
Jul. 7, 2009 |
| 7554199 |
Substrate for evaluation |
Jun. 30, 2009 |
| 7553754 |
Electronic device, method of manufacture of the same, and sputtering target |
Jun. 30, 2009 |
| 7553430 |
Polishing slurries and methods for chemical mechanical polishing |
Jun. 30, 2009 |
| 7550386 |
Advanced seed layers for interconnects |
Jun. 23, 2009 |
| 7547633 |
UV assisted thermal processing |
Jun. 16, 2009 |
| 7544606 |
Method to implement stress free polishing |
Jun. 9, 2009 |
| 7544603 |
Method of fabricating silicon nitride layer and method of fabricating semiconductor device |
Jun. 9, 2009 |
| 7541279 |
Method for manufacturing semiconductor device |
Jun. 2, 2009 |
| 7538024 |
Method of fabricating a dual-damascene copper structure |
May. 26, 2009 |
| 7531447 |
Process for forming integrated circuit comprising copper lines |
May. 12, 2009 |
| 7528071 |
Method for fabricating semiconductor device |
May. 5, 2009 |
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