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Class Information
Number: 438/687
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Copper of copper alloy conductor
Description: Processes for forming a contact using copper (Cu) or an alloy thereof.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7432205 |
Method for controlling polishing process |
Oct. 7, 2008 |
| 7427565 |
Multi-step etch for metal bump formation |
Sep. 23, 2008 |
| 7427561 |
Method for manufacturing semiconductor device |
Sep. 23, 2008 |
| 7422981 |
Method for manufacturing semiconductor device by using dual damascene process and method for manufacturing article having communicating hole |
Sep. 9, 2008 |
| 7422979 |
Method of forming a semiconductor device having a diffusion barrier stack and structure thereof |
Sep. 9, 2008 |
| 7422977 |
Copper adhesion improvement device and method |
Sep. 9, 2008 |
| 7422976 |
Top layers of metal for high performance IC's |
Sep. 9, 2008 |
| 7420275 |
Boron-doped SIC copper diffusion barrier films |
Sep. 2, 2008 |
| 7419916 |
Manufacturing method of semiconductor device |
Sep. 2, 2008 |
| 7416982 |
Semiconductor devices and methods for manufacturing the same |
Aug. 26, 2008 |
| 7416932 |
Power composite integrated semiconductor device and manufacturing method thereof |
Aug. 26, 2008 |
| 7413985 |
Method for forming a self-aligned nitrogen-containing copper silicide capping layer in a microstructure device |
Aug. 19, 2008 |
| 7413984 |
Multi-step process for forming a barrier film for use in copper layer formation |
Aug. 19, 2008 |
| 7413983 |
Plating method including pretreatment of a surface of a base metal |
Aug. 19, 2008 |
| 7413974 |
Copper-metallized integrated circuits having electroless thick copper bond pads |
Aug. 19, 2008 |
| 7410900 |
Metallisation |
Aug. 12, 2008 |
| 7410666 |
Metal nitride carbide deposition by ALD |
Aug. 12, 2008 |
| 7402519 |
Interconnects having sealing structures to enable selective metal capping layers |
Jul. 22, 2008 |
| 7402514 |
Line-to-line reliability enhancement using a dielectric liner for a low dielectric constant interlevel and intralevel (or intermetal and intrametal) dielectric layer |
Jul. 22, 2008 |
| 7399706 |
Manufacturing method of semiconductor device |
Jul. 15, 2008 |
| 7396759 |
Protection of Cu damascene interconnects by formation of a self-aligned buffer layer |
Jul. 8, 2008 |
| 7396756 |
Top layers of metal for high performance IC's |
Jul. 8, 2008 |
| 7393786 |
Method for manufacturing copper wires on substrate of flat panel display device |
Jul. 1, 2008 |
| 7387962 |
Physical vapor deposition methods for forming hydrogen-stuffed trench liners for copper-based metallization |
Jun. 17, 2008 |
| 7387912 |
Packaging of electronic chips with air-bridge structures |
Jun. 17, 2008 |
| 7381660 |
Dielectric barrier layer for a copper metallization layer having a varying silicon concentration along its thickness |
Jun. 3, 2008 |
| 7381646 |
Method for using a Cu BEOL process to fabricate an integrated circuit (IC) originally having an al design |
Jun. 3, 2008 |
| 7381638 |
Fabrication technique using sputter etch and vacuum transfer |
Jun. 3, 2008 |
| 7378737 |
Structures and methods to enhance copper metallization |
May. 27, 2008 |
| 7375031 |
Technique for forming interconnect structures with reduced electro and stress migration and/or resistivity |
May. 20, 2008 |
| 7375026 |
Local multilayered metallization |
May. 20, 2008 |
| 7371682 |
Production method for electronic component and electronic component |
May. 13, 2008 |
| 7368383 |
Hillock reduction in copper films |
May. 6, 2008 |
| 7368066 |
Gold CMP composition and method |
May. 6, 2008 |
| 7365011 |
Catalytic nucleation monolayer for metal seed layers |
Apr. 29, 2008 |
| 7361589 |
Copper interconnect systems which use conductive, metal-based cap layers |
Apr. 22, 2008 |
| 7358189 |
Copper clad laminate |
Apr. 15, 2008 |
| 7358180 |
Method of forming wiring structure and semiconductor device |
Apr. 15, 2008 |
| 7354859 |
Method of manufacturing semiconductor device |
Apr. 8, 2008 |
| 7354853 |
Selective dry etching of tantalum and tantalum nitride |
Apr. 8, 2008 |
| 7354849 |
Catalytically enhanced atomic layer deposition process |
Apr. 8, 2008 |
| 7351655 |
Copper interconnect systems which use conductive, metal-based cap layers |
Apr. 1, 2008 |
| 7351651 |
Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuits |
Apr. 1, 2008 |
| 7344913 |
Spin on memory cell active layer doped with metal ions |
Mar. 18, 2008 |
| 7341948 |
Method of making a semiconductor structure with a plating enhancement layer |
Mar. 11, 2008 |
| 7341947 |
Methods of forming metal-containing films over surfaces of semiconductor substrates |
Mar. 11, 2008 |
| 7341946 |
Methods for the electrochemical deposition of copper onto a barrier layer of a work piece |
Mar. 11, 2008 |
| 7341945 |
Method of fabricating semiconductor device |
Mar. 11, 2008 |
| 7338910 |
Method of fabricating semiconductor devices and method of removing a spacer |
Mar. 4, 2008 |
| 7338903 |
Sequential reducing plasma and inert plasma pre-treatment method for oxidizable conductor layer |
Mar. 4, 2008 |
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