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Class Information
Number: 438/687
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Copper of copper alloy conductor
Description: Processes for forming a contact using copper (Cu) or an alloy thereof.










Patents under this class:

Patent Number Title Of Patent Date Issued
8710666 Semiconductor device and method for fabricating the same Apr. 29, 2014
8709548 Method of making a CIG target by spray forming Apr. 29, 2014
8703615 Copper electroplating process for uniform across wafer deposition and void free filling on ruthenium coated wafers Apr. 22, 2014
8691688 Method of manufacturing semiconductor structure Apr. 8, 2014
8691597 Method for manufacturing a semiconductor device including application of a plating voltage Apr. 8, 2014
8685809 Semiconductor structures having improved contact resistance Apr. 1, 2014
8673779 Interconnect with self-formed barrier Mar. 18, 2014
8673764 Method and system for making and cleaning semiconductor device Mar. 18, 2014
8669182 Metal cap with ultra-low .kappa. dielectric material for circuit interconnect applications Mar. 11, 2014
8669181 Diffusion barrier and etch stop films Mar. 11, 2014
8664759 Integrated circuit with heat conducting structures for localized thermal control Mar. 4, 2014
8659170 Semiconductor device having conductive pads and a method of manufacturing the same Feb. 25, 2014
8653664 Barrier layers for copper interconnect Feb. 18, 2014
8647983 Simplified copper-copper bonding Feb. 11, 2014
8647980 Method of forming wiring and method of manufacturing semiconductor substrates Feb. 11, 2014
8643027 Milled particle compositions and related methods and structures Feb. 4, 2014
8642472 Method for manufacturing a semiconductor device Feb. 4, 2014
8623773 Etchant for metal layer including copper or a copper alloy, method of manufacturing a display substrate using the same and display substrate Jan. 7, 2014
8623761 Method of forming a graphene cap for copper interconnect structures Jan. 7, 2014
8618677 Wirebonded semiconductor package Dec. 31, 2013
8609540 Reliable packaging and interconnect structures Dec. 17, 2013
8609526 Preventing UBM oxidation in bump formation processes Dec. 17, 2013
8603913 Porous dielectrics K value restoration by thermal treatment and or solvent treatment Dec. 10, 2013
8603846 Processing for overcoming extreme topography Dec. 10, 2013
8580688 Copper interconnection structure and method for forming copper interconnections Nov. 12, 2013
8580687 Semiconductor structure and method for making same Nov. 12, 2013
8580665 MOSFET integrated circuit having doped conductive interconnects and methods for its manufacture Nov. 12, 2013
8575029 Technique for forming metal lines in a semiconductor by adapting the temperature dependence of the line resistance Nov. 5, 2013
8575028 Method and apparatus for filling interconnect structures Nov. 5, 2013
8575021 Substrate processing including a masking layer Nov. 5, 2013
8564136 Semiconductor device and method for fabricating the same Oct. 22, 2013
8563423 Fluorine depleted adhesion layer for metal interconnect structure Oct. 22, 2013
8563419 Method of manufacturing an interconnect structure and design structure thereof Oct. 22, 2013
8552559 Very thick metal interconnection scheme in IC chips Oct. 8, 2013
8546944 Multilayer dielectric memory device Oct. 1, 2013
8541307 Treatment method for reducing particles in dual damascene silicon nitride process Sep. 24, 2013
8531041 Semiconductor component having a plated through-hole and method for the production thereof Sep. 10, 2013
8530360 Method for low stress flip-chip assembly of fine-pitch semiconductor devices Sep. 10, 2013
8518825 Method to manufacture trench-first copper interconnection Aug. 27, 2013
8513124 Copper electroplating process for uniform across wafer deposition and void free filling on semi-noble metal coated wafers Aug. 20, 2013
8507381 Method for fabricating silicon and/or germanium nanowires Aug. 13, 2013
8497208 Semiconductor device and method for manufacturing the same Jul. 30, 2013
8492808 Semiconductor device and manufacturing method thereof Jul. 23, 2013
8492266 Semiconductor device having insulating film with surface modification layer and method for manufacturing the same Jul. 23, 2013
8491807 Abrasive liquid for metal and method for polishing Jul. 23, 2013
8486836 Semiconductor device and method of manufacturing the same Jul. 16, 2013
8476161 Method for forming Cu electrical interconnection film Jul. 2, 2013
8470692 Method and device for preparing compound semiconductor film Jun. 25, 2013
8461046 Process for producing a metallization level and a via level and corresponding integrated circuit Jun. 11, 2013
8450210 Sequential station tool for wet processing of semiconductor wafers May. 28, 2013











 
 
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