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Class Information
Number: 438/687
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Copper of copper alloy conductor
Description: Processes for forming a contact using copper (Cu) or an alloy thereof.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 8710666 |
Semiconductor device and method for fabricating the same |
Apr. 29, 2014 |
| 8709548 |
Method of making a CIG target by spray forming |
Apr. 29, 2014 |
| 8703615 |
Copper electroplating process for uniform across wafer deposition and void free filling on ruthenium coated wafers |
Apr. 22, 2014 |
| 8691688 |
Method of manufacturing semiconductor structure |
Apr. 8, 2014 |
| 8691597 |
Method for manufacturing a semiconductor device including application of a plating voltage |
Apr. 8, 2014 |
| 8685809 |
Semiconductor structures having improved contact resistance |
Apr. 1, 2014 |
| 8673779 |
Interconnect with self-formed barrier |
Mar. 18, 2014 |
| 8673764 |
Method and system for making and cleaning semiconductor device |
Mar. 18, 2014 |
| 8669182 |
Metal cap with ultra-low .kappa. dielectric material for circuit interconnect applications |
Mar. 11, 2014 |
| 8669181 |
Diffusion barrier and etch stop films |
Mar. 11, 2014 |
| 8664759 |
Integrated circuit with heat conducting structures for localized thermal control |
Mar. 4, 2014 |
| 8659170 |
Semiconductor device having conductive pads and a method of manufacturing the same |
Feb. 25, 2014 |
| 8653664 |
Barrier layers for copper interconnect |
Feb. 18, 2014 |
| 8647983 |
Simplified copper-copper bonding |
Feb. 11, 2014 |
| 8647980 |
Method of forming wiring and method of manufacturing semiconductor substrates |
Feb. 11, 2014 |
| 8643027 |
Milled particle compositions and related methods and structures |
Feb. 4, 2014 |
| 8642472 |
Method for manufacturing a semiconductor device |
Feb. 4, 2014 |
| 8623773 |
Etchant for metal layer including copper or a copper alloy, method of manufacturing a display substrate using the same and display substrate |
Jan. 7, 2014 |
| 8623761 |
Method of forming a graphene cap for copper interconnect structures |
Jan. 7, 2014 |
| 8618677 |
Wirebonded semiconductor package |
Dec. 31, 2013 |
| 8609540 |
Reliable packaging and interconnect structures |
Dec. 17, 2013 |
| 8609526 |
Preventing UBM oxidation in bump formation processes |
Dec. 17, 2013 |
| 8603913 |
Porous dielectrics K value restoration by thermal treatment and or solvent treatment |
Dec. 10, 2013 |
| 8603846 |
Processing for overcoming extreme topography |
Dec. 10, 2013 |
| 8580688 |
Copper interconnection structure and method for forming copper interconnections |
Nov. 12, 2013 |
| 8580687 |
Semiconductor structure and method for making same |
Nov. 12, 2013 |
| 8580665 |
MOSFET integrated circuit having doped conductive interconnects and methods for its manufacture |
Nov. 12, 2013 |
| 8575029 |
Technique for forming metal lines in a semiconductor by adapting the temperature dependence of the line resistance |
Nov. 5, 2013 |
| 8575028 |
Method and apparatus for filling interconnect structures |
Nov. 5, 2013 |
| 8575021 |
Substrate processing including a masking layer |
Nov. 5, 2013 |
| 8564136 |
Semiconductor device and method for fabricating the same |
Oct. 22, 2013 |
| 8563423 |
Fluorine depleted adhesion layer for metal interconnect structure |
Oct. 22, 2013 |
| 8563419 |
Method of manufacturing an interconnect structure and design structure thereof |
Oct. 22, 2013 |
| 8552559 |
Very thick metal interconnection scheme in IC chips |
Oct. 8, 2013 |
| 8546944 |
Multilayer dielectric memory device |
Oct. 1, 2013 |
| 8541307 |
Treatment method for reducing particles in dual damascene silicon nitride process |
Sep. 24, 2013 |
| 8531041 |
Semiconductor component having a plated through-hole and method for the production thereof |
Sep. 10, 2013 |
| 8530360 |
Method for low stress flip-chip assembly of fine-pitch semiconductor devices |
Sep. 10, 2013 |
| 8518825 |
Method to manufacture trench-first copper interconnection |
Aug. 27, 2013 |
| 8513124 |
Copper electroplating process for uniform across wafer deposition and void free filling on semi-noble metal coated wafers |
Aug. 20, 2013 |
| 8507381 |
Method for fabricating silicon and/or germanium nanowires |
Aug. 13, 2013 |
| 8497208 |
Semiconductor device and method for manufacturing the same |
Jul. 30, 2013 |
| 8492808 |
Semiconductor device and manufacturing method thereof |
Jul. 23, 2013 |
| 8492266 |
Semiconductor device having insulating film with surface modification layer and method for manufacturing the same |
Jul. 23, 2013 |
| 8491807 |
Abrasive liquid for metal and method for polishing |
Jul. 23, 2013 |
| 8486836 |
Semiconductor device and method of manufacturing the same |
Jul. 16, 2013 |
| 8476161 |
Method for forming Cu electrical interconnection film |
Jul. 2, 2013 |
| 8470692 |
Method and device for preparing compound semiconductor film |
Jun. 25, 2013 |
| 8461046 |
Process for producing a metallization level and a via level and corresponding integrated circuit |
Jun. 11, 2013 |
| 8450210 |
Sequential station tool for wet processing of semiconductor wafers |
May. 28, 2013 |
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