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Class Information
Number: 438/686
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Noble group metal (i.e., silver (ag), gold (au), platinum (pt), palladium (pd), rhodium (rh), ruthenium (ru), iridium (ir), osmium (os), or alloy thereof)
Description: Processes for forming a contact using one of the noble group elements (e.g., silver (Ag), gold(Au), platinum (Pt), palladium (Pd), rhodium (Rh), ruthenium (Ru), iridium (Ir), osmium (Os), or alloy thereof).
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7618890 |
Methods for forming conductive structures and structures regarding same |
Nov. 17, 2009 |
| 7615402 |
Electrostatically operated tunneling transistor |
Nov. 10, 2009 |
| 7605078 |
Integration of a variable thickness copper seed layer in copper metallization |
Oct. 20, 2009 |
| 7588667 |
Depositing rhuthenium films using ionized physical vapor deposition (IPVD) |
Sep. 15, 2009 |
| 7585687 |
Electron emitter device for data storage applications and method of manufacture |
Sep. 8, 2009 |
| 7585766 |
Methods of manufacturing copper interconnect systems |
Sep. 8, 2009 |
| 7582199 |
Plating method |
Sep. 1, 2009 |
| 7566661 |
Electroless treatment of noble metal barrier and adhesion layer |
Jul. 28, 2009 |
| 7560016 |
Selectively accelerated plating of metal features |
Jul. 14, 2009 |
| 7557047 |
Method of forming a layer of material using an atomic layer deposition process |
Jul. 7, 2009 |
| 7553746 |
Method for manufacturing electrodes on a semiconducting material of type II-VI or on a compound of this material |
Jun. 30, 2009 |
| 7547627 |
Method for manufacturing semiconductor device |
Jun. 16, 2009 |
| 7541284 |
Method of depositing Ru films having high density |
Jun. 2, 2009 |
| 7538031 |
Method of manufacturing a wiring substrate and an electronic instrument |
May. 26, 2009 |
| 7538035 |
Lapping of gold pads in a liquid medium for work hardening the surface of the pads |
May. 26, 2009 |
| 7527188 |
Self-encapsulated silver alloys for interconnects |
May. 5, 2009 |
| 7521361 |
Method for manufacturing wiring substrate |
Apr. 21, 2009 |
| 7507665 |
Method of manufacturing electrical parts |
Mar. 24, 2009 |
| 7504333 |
Method of forming bit line of semiconductor device |
Mar. 17, 2009 |
| 7498262 |
Method of fabricating a thin film and metal wiring in a semiconductor device |
Mar. 3, 2009 |
| 7494927 |
Method of growing electrical conductors |
Feb. 24, 2009 |
| 7491646 |
Electrically conductive feature fabrication process |
Feb. 17, 2009 |
| 7482691 |
Semiconductor device and method for fabricating the same |
Jan. 27, 2009 |
| 7476615 |
Deposition process for iodine-doped ruthenium barrier layers |
Jan. 13, 2009 |
| 7476618 |
Selective formation of metal layers in an integrated circuit |
Jan. 13, 2009 |
| 7473640 |
Reactive gate electrode conductive barrier |
Jan. 6, 2009 |
| 7456101 |
Method for enhancing the nucleation and morphology of ruthenium films on dielectric substrates using amine containing compounds |
Nov. 25, 2008 |
| 7449099 |
Selectively accelerated plating of metal features |
Nov. 11, 2008 |
| 7446037 |
Cladded silver and silver alloy metallization for improved adhesion and electromigration resistance |
Nov. 4, 2008 |
| 7442633 |
Decoupling capacitor for high frequency noise immunity |
Oct. 28, 2008 |
| 7439178 |
Technique for stable processing of thin/fragile substrates |
Oct. 21, 2008 |
| 7435679 |
Alloyed underlayer for microelectronic interconnects |
Oct. 14, 2008 |
| 7435678 |
Method of depositing noble metal electrode using oxidation-reduction reaction |
Oct. 14, 2008 |
| 7436066 |
Semiconductor element |
Oct. 14, 2008 |
| 7432202 |
Method of substrate manufacture that decreases the package resistance |
Oct. 7, 2008 |
| 7410900 |
Metallisation |
Aug. 12, 2008 |
| 7405153 |
Method for direct electroplating of copper onto a non-copper plateable layer |
Jul. 29, 2008 |
| 7400042 |
Substrate with adhesive bonding metallization with diffusion barrier |
Jul. 15, 2008 |
| 7396766 |
Low-temperature chemical vapor deposition of low-resistivity ruthenium layers |
Jul. 8, 2008 |
| 7393785 |
Methods and apparatus for forming rhodium-containing layers |
Jul. 1, 2008 |
| 7390678 |
Method for fabricating semiconductor device |
Jun. 24, 2008 |
| 7365441 |
Semiconductor device fabricating apparatus and semiconductor device fabricating method |
Apr. 29, 2008 |
| 7358188 |
Method of forming conductive metal silicides by reaction of metal with silicon |
Apr. 15, 2008 |
| 7351652 |
Method of manufacturing semiconductor device |
Apr. 1, 2008 |
| 7351655 |
Copper interconnect systems which use conductive, metal-based cap layers |
Apr. 1, 2008 |
| 7344982 |
System and method of selectively depositing Ruthenium films by digital chemical vapor deposition |
Mar. 18, 2008 |
| 7341947 |
Methods of forming metal-containing films over surfaces of semiconductor substrates |
Mar. 11, 2008 |
| 7341946 |
Methods for the electrochemical deposition of copper onto a barrier layer of a work piece |
Mar. 11, 2008 |
| 7338884 |
Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device |
Mar. 4, 2008 |
| 7335591 |
Method for forming three-dimensional structures on a substrate |
Feb. 26, 2008 |
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