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Class Information
Number: 438/686
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Noble group metal (i.e., silver (ag), gold (au), platinum (pt), palladium (pd), rhodium (rh), ruthenium (ru), iridium (ir), osmium (os), or alloy thereof)
Description: Processes for forming a contact using one of the noble group elements (e.g., silver (Ag), gold(Au), platinum (Pt), palladium (Pd), rhodium (Rh), ruthenium (Ru), iridium (Ir), osmium (Os), or alloy thereof).










Patents under this class:
1 2 3 4 5 6 7 8 9 10

Patent Number Title Of Patent Date Issued
8691687 Superfilled metal contact vias for semiconductor devices Apr. 8, 2014
8673766 Methods of forming copper-based conductive structures by forming a copper-based seed layer having an as-deposited thickness profile and thereafter performing an etching process and electroless Mar. 18, 2014
8673773 Method for producing a nanoporous layer Mar. 18, 2014
8658249 Heteroleptic iridium precursors to be used for the deposition of iridium-containing films Feb. 25, 2014
8637402 Conductive line structure and the method of forming the same Jan. 28, 2014
8618677 Wirebonded semiconductor package Dec. 31, 2013
8586480 Power MOSFET having selectively silvered pads for clip and bond wire attach Nov. 19, 2013
8569172 Noble metal/non-noble metal electrode for RRAM applications Oct. 29, 2013
8557702 Plasma-enhanced atomic layers deposition of conductive material over dielectric layers Oct. 15, 2013
8552559 Very thick metal interconnection scheme in IC chips Oct. 8, 2013
8541821 Method of forming a non-volatile electron storage memory and the resulting device Sep. 24, 2013
8536058 Method of growing electrical conductors Sep. 17, 2013
8513057 Integrated circuit packaging system with routable underlayer and method of manufacture thereof Aug. 20, 2013
8513117 Process to remove Ni and Pt residues for NiPtSi applications Aug. 20, 2013
8486828 Semiconductor device manufacturing method Jul. 16, 2013
8466058 Process to remove Ni and Pt residues for NiPtSi applications using chlorine gas Jun. 18, 2013
8461036 Multiple surface finishes for microelectronic package substrates Jun. 11, 2013
8440556 Forming conformal metallic platinum zinc films for semiconductor devices May. 14, 2013
8441077 Method for forming a ruthenium metal layer and a structure comprising the ruthenium metal layer May. 14, 2013
8435905 Manufacturing method of semiconductor device, and substrate processing apparatus May. 7, 2013
8432031 Semiconductor die including a current routing line having non-metallic slots Apr. 30, 2013
8404589 Silicide contact formation Mar. 26, 2013
8390018 Nitride-based compound semiconductor light emitting device and method of fabricating the same Mar. 5, 2013
8377824 Methods and apparatus for depositing copper on tungsten Feb. 19, 2013
8367555 Removal of masking material Feb. 5, 2013
8337675 Method of plasma vapour deposition Dec. 25, 2012
8329583 Metal precursors for semiconductor applications Dec. 11, 2012
8309395 Method of fabricating a high-temperature compatible power semiconductor module Nov. 13, 2012
8298869 Resin package and production method thereof Oct. 30, 2012
8298947 Semiconductor device having solder-free gold bump contacts for stability in repeated temperature cycles Oct. 30, 2012
8293648 Mass production method of semiconductor integrated circuit device and manufacturing method of electronic device Oct. 23, 2012
8288283 Aluminum enhanced palladium CMP process Oct. 16, 2012
8288274 Method of forming noble metal layer using ozone reaction gas Oct. 16, 2012
8268725 Horizontal coffee-stain method using control structure to pattern self-organized line structures Sep. 18, 2012
8247325 Direct growth of metal nanoplates on semiconductor substrates Aug. 21, 2012
8242019 Selective deposition of metal-containing cap layers for semiconductor devices Aug. 14, 2012
8222746 Noble metal barrier layers Jul. 17, 2012
8211800 Ru cap metal post cleaning method and cleaning chemical Jul. 3, 2012
8208241 Crystallographically orientated tantalum pentoxide and methods of making same Jun. 26, 2012
8193030 Methods of fabricating non-volatile memory devices having carbon nanotube layer and passivation layer Jun. 5, 2012
8174121 Semiconductor device and manufacturing method thereof May. 8, 2012
8168540 Methods and apparatus for depositing copper on tungsten May. 1, 2012
8119525 Process for selective growth of films during ECP plating Feb. 21, 2012
8114713 Method of manufacturing a lead frame with a nickel coating Feb. 14, 2012
8114770 Pre-treatment method to increase copper island density of CU on barrier layers Feb. 14, 2012
8105961 Method and apparatus for using flex circuit technology to create a reference electrode channel Jan. 31, 2012
8097960 Semiconductor mounting bonding wire Jan. 17, 2012
8084348 Contact pads for silicon chip packages Dec. 27, 2011
8043944 Process for enhancing solubility and reaction rates in supercritical fluids Oct. 25, 2011
8039966 Structures of and methods and tools for forming in-situ metallic/dielectric caps for interconnects Oct. 18, 2011

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