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Class Information
Number: 438/68
Name: Semiconductor device manufacturing: process > Making device or circuit responsive to nonelectrical signal > Responsive to electromagnetic radiation > Substrate dicing
Description: Process having a step of dividing the semiconductor substrate into multiple separate bodies.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7635605 |
Infrared sensor and method of producing the same |
Dec. 22, 2009 |
| 7632713 |
Methods of packaging microelectronic imaging devices |
Dec. 15, 2009 |
| 7632707 |
Electronic device package and method of manufacturing the same |
Dec. 15, 2009 |
| 7625776 |
Methods of fabricating intermediate semiconductor structures by selectively etching pockets of implanted silicon |
Dec. 1, 2009 |
| 7608514 |
MSM binary switch memory |
Oct. 27, 2009 |
| 7598154 |
Manufacturing method of semiconductor device |
Oct. 6, 2009 |
| 7592594 |
Method of construction of CTE matching structure with wafer processing and resulting structure |
Sep. 22, 2009 |
| 7592200 |
Solid-state imaging device and method of manufacturing the same |
Sep. 22, 2009 |
| 7582505 |
Solid-state imaging device and method of manufacturing said solid-state imaging device |
Sep. 1, 2009 |
| 7563694 |
Scribe based bond pads for integrated circuits |
Jul. 21, 2009 |
| 7547572 |
Method of protecting semiconductor chips from mechanical and ESD damage during handling |
Jun. 16, 2009 |
| 7521338 |
Method for sawing semiconductor wafer |
Apr. 21, 2009 |
| 7504317 |
Manufacturing method of semiconductor device |
Mar. 17, 2009 |
| 7488620 |
Method of fabricating leadframe based flash memory cards including singulation by straight line cuts |
Feb. 10, 2009 |
| 7485548 |
Die loss estimation using universal in-line metric (UILM) |
Feb. 3, 2009 |
| 7485576 |
Method of forming conductive pattern, thin film transistor, and method of manufacturing the same |
Feb. 3, 2009 |
| 7479399 |
System and method for providing automated sample preparation for plan view transmission electron microscopy |
Jan. 20, 2009 |
| 7468293 |
Method for the production of window elements which can be soldered into a housing in a hermetically tight manner and of a window element sealing a housing |
Dec. 23, 2008 |
| 7465603 |
Wafer level package structure of optical-electronic device and method for making the same |
Dec. 16, 2008 |
| 7465592 |
Method of making vertical structure semiconductor devices including forming hard and soft copper layers |
Dec. 16, 2008 |
| 7452743 |
Microelectronic imaging units and methods of manufacturing microelectronic imaging units at the wafer level |
Nov. 18, 2008 |
| 7449358 |
Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
Nov. 11, 2008 |
| 7439162 |
Method of dividing wafer into individual devices after forming a recessed portion of the wafer and making thickness of wafer uniform |
Oct. 21, 2008 |
| 7413965 |
Method of manufacturing a thin-film circuit substrate having penetrating structure, and protecting adhesive tape |
Aug. 19, 2008 |
| 7405138 |
Manufacturing method of stack-type semiconductor device |
Jul. 29, 2008 |
| 7405100 |
Packaging of a semiconductor device with a non-opaque cover |
Jul. 29, 2008 |
| 7404248 |
Producing method of producing a solid pickup device |
Jul. 29, 2008 |
| 7396780 |
Method for laser processing of wafer |
Jul. 8, 2008 |
| 7393770 |
Backside method for fabricating semiconductor components with conductive interconnects |
Jul. 1, 2008 |
| 7390688 |
Semiconductor device and manufacturing method thereof |
Jun. 24, 2008 |
| 7387951 |
Method of dicing semiconductor wafer into chips, and apparatus using this method |
Jun. 17, 2008 |
| 7387260 |
MOS electronic article surveillance, RF and/or RF identification tag/device, and methods for making and using the same |
Jun. 17, 2008 |
| 7354786 |
Sensor element with trenched cavity |
Apr. 8, 2008 |
| 7354790 |
Method and apparatus for avoiding dicing chip-outs in integrated circuit die |
Apr. 8, 2008 |
| 7354801 |
Method for manufacturing semiconductor device |
Apr. 8, 2008 |
| 7348193 |
Hermetic seals for micro-electromechanical system devices |
Mar. 25, 2008 |
| 7348199 |
Wafer dividing method |
Mar. 25, 2008 |
| 7326590 |
Method for manufacturing ball grid array package |
Feb. 5, 2008 |
| 7303932 |
Support body for semiconductor element, method for manufacturing the same and semiconductor device |
Dec. 4, 2007 |
| 7294521 |
Method of fabricating vertical devices using a metal support film |
Nov. 13, 2007 |
| 7288435 |
Method for producing a cover, method for producing a packaged device |
Oct. 30, 2007 |
| 7288757 |
Microelectronic imaging devices and associated methods for attaching transmissive elements |
Oct. 30, 2007 |
| 7273765 |
Solid-state imaging device and method for producing the same |
Sep. 25, 2007 |
| 7265032 |
Protective layer during scribing |
Sep. 4, 2007 |
| 7256106 |
Method of dividing a substrate into a plurality of individual chip parts |
Aug. 14, 2007 |
| 7250318 |
System and method for providing automated sample preparation for plan view transmission electron microscopy |
Jul. 31, 2007 |
| 7217992 |
Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device |
May. 15, 2007 |
| 7214116 |
Light-emitting diode and method for its production |
May. 8, 2007 |
| 7211500 |
Pre-process before cutting a wafer and method of cutting a wafer |
May. 1, 2007 |
| 7208335 |
Castellated chip-scale packages and methods for fabricating the same |
Apr. 24, 2007 |
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