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Class Information
Number: 438/68
Name: Semiconductor device manufacturing: process > Making device or circuit responsive to nonelectrical signal > Responsive to electromagnetic radiation > Substrate dicing
Description: Process having a step of dividing the semiconductor substrate into multiple separate bodies.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7452743 |
Microelectronic imaging units and methods of manufacturing microelectronic imaging units at the wafer level |
Nov. 18, 2008 |
| 7449358 |
Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
Nov. 11, 2008 |
| 7439162 |
Method of dividing wafer into individual devices after forming a recessed portion of the wafer and making thickness of wafer uniform |
Oct. 21, 2008 |
| 7413965 |
Method of manufacturing a thin-film circuit substrate having penetrating structure, and protecting adhesive tape |
Aug. 19, 2008 |
| 7405138 |
Manufacturing method of stack-type semiconductor device |
Jul. 29, 2008 |
| 7405100 |
Packaging of a semiconductor device with a non-opaque cover |
Jul. 29, 2008 |
| 7404248 |
Producing method of producing a solid pickup device |
Jul. 29, 2008 |
| 7396780 |
Method for laser processing of wafer |
Jul. 8, 2008 |
| 7393770 |
Backside method for fabricating semiconductor components with conductive interconnects |
Jul. 1, 2008 |
| 7390688 |
Semiconductor device and manufacturing method thereof |
Jun. 24, 2008 |
| 7387260 |
MOS electronic article surveillance, RF and/or RF identification tag/device, and methods for making and using the same |
Jun. 17, 2008 |
| 7387951 |
Method of dicing semiconductor wafer into chips, and apparatus using this method |
Jun. 17, 2008 |
| 7354786 |
Sensor element with trenched cavity |
Apr. 8, 2008 |
| 7354790 |
Method and apparatus for avoiding dicing chip-outs in integrated circuit die |
Apr. 8, 2008 |
| 7354801 |
Method for manufacturing semiconductor device |
Apr. 8, 2008 |
| 7348199 |
Wafer dividing method |
Mar. 25, 2008 |
| 7348193 |
Hermetic seals for micro-electromechanical system devices |
Mar. 25, 2008 |
| 7326590 |
Method for manufacturing ball grid array package |
Feb. 5, 2008 |
| 7303932 |
Support body for semiconductor element, method for manufacturing the same and semiconductor device |
Dec. 4, 2007 |
| 7294521 |
Method of fabricating vertical devices using a metal support film |
Nov. 13, 2007 |
| 7288757 |
Microelectronic imaging devices and associated methods for attaching transmissive elements |
Oct. 30, 2007 |
| 7288435 |
Method for producing a cover, method for producing a packaged device |
Oct. 30, 2007 |
| 7273765 |
Solid-state imaging device and method for producing the same |
Sep. 25, 2007 |
| 7265032 |
Protective layer during scribing |
Sep. 4, 2007 |
| 7256106 |
Method of dividing a substrate into a plurality of individual chip parts |
Aug. 14, 2007 |
| 7250318 |
System and method for providing automated sample preparation for plan view transmission electron microscopy |
Jul. 31, 2007 |
| 7217992 |
Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device |
May. 15, 2007 |
| 7214116 |
Light-emitting diode and method for its production |
May. 8, 2007 |
| 7211500 |
Pre-process before cutting a wafer and method of cutting a wafer |
May. 1, 2007 |
| 7208335 |
Castellated chip-scale packages and methods for fabricating the same |
Apr. 24, 2007 |
| 7198979 |
Method for manufacturing a stack arrangement of a memory module |
Apr. 3, 2007 |
| 7198969 |
Semiconductor chip assemblies, methods of making same and components for same |
Apr. 3, 2007 |
| 7183136 |
Semiconductor element and method for producing the same |
Feb. 27, 2007 |
| 7179723 |
Wafer processing method |
Feb. 20, 2007 |
| 7176051 |
Method of reducing charging damage to integrated circuits during semiconductor manufacturing |
Feb. 13, 2007 |
| 7166487 |
Manufacturing method of optical devices |
Jan. 23, 2007 |
| 7152804 |
MOS electronic article surveillance, RF and/or RF identification tag/device, and methods for making and using the same |
Dec. 26, 2006 |
| 7141443 |
Semiconductor wafer dividing method utilizing laser beam |
Nov. 28, 2006 |
| 7135352 |
Method of fabricating a cover plate bonded over an encapsulated OLEDs |
Nov. 14, 2006 |
| 7127793 |
Method of producing solid state pickup device |
Oct. 31, 2006 |
| 7115483 |
Stacked chip package having upper chip provided with trenches and method of manufacturing the same |
Oct. 3, 2006 |
| 7112456 |
Vertical GaN light emitting diode and method for manufacturing the same |
Sep. 26, 2006 |
| 7112882 |
Structures and methods for heat dissipation of semiconductor integrated circuits |
Sep. 26, 2006 |
| 7102224 |
Encapsulated component and method for the production thereof |
Sep. 5, 2006 |
| 7087463 |
Laser separation of encapsulated submount |
Aug. 8, 2006 |
| 7087452 |
Edge arrangements for integrated circuit chips |
Aug. 8, 2006 |
| 7074638 |
Solid-state imaging device and method of manufacturing said solid-state imaging device |
Jul. 11, 2006 |
| 7074696 |
Semiconductor circuit module and method for fabricating semiconductor circuit modules |
Jul. 11, 2006 |
| 7074695 |
DBG system and method with adhesive layer severing |
Jul. 11, 2006 |
| 7026224 |
Method for dicing semiconductor chips and corresponding semiconductor chip system |
Apr. 11, 2006 |
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