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Class Information
Number: 438/678
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Electroless deposition of conductive layer
Description: Processes wherein the formation of the conductive layer is accomplished by immersion of the semiconductor substrate in a metallic salt solution and deposition therefrom without the use of electricity.










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13

Patent Number Title Of Patent Date Issued
8709948 Tungsten barrier and seed for copper filled TSV Apr. 29, 2014
8691689 Methods for fabricating integrated circuits having low resistance device contacts Apr. 8, 2014
8691694 Solderless back contact solar cell module assembly process Apr. 8, 2014
8685850 System and method of plating conductive gate contacts on metal gates for self-aligned contact interconnections Apr. 1, 2014
8679591 Method for reducing voids in a copper-tin interface and structure formed thereby Mar. 25, 2014
8663746 Stirring apparatus for combinatorial processing Mar. 4, 2014
8647982 Methods of forming interconnects in a semiconductor structure Feb. 11, 2014
8637397 Method for manufacturing a through hole electrode substrate Jan. 28, 2014
8623694 Methods of forming fast ion conductors and memory devices comprising diffused metal ions Jan. 7, 2014
8617992 Method of forming metal silicide contact and metal interconnect Dec. 31, 2013
8592312 Method for depositing a conductive capping layer on metal lines Nov. 26, 2013
8575021 Substrate processing including a masking layer Nov. 5, 2013
8563433 Process to form via hole in semiconductor wafer Oct. 22, 2013
8563434 Semiconductor device contacts Oct. 22, 2013
8524528 Methods for forming resistive-switching metal oxides for nonvolatile memory elements Sep. 3, 2013
8518817 Method of electrolytic plating and semiconductor device fabrication Aug. 27, 2013
8518826 Metallization processes, mixtures, and electronic devices Aug. 27, 2013
8513061 Method of fabricating a TSV for 3D packaging of semiconductor device Aug. 20, 2013
8507376 Method to form solder deposits on substrates Aug. 13, 2013
8492263 Protected solder ball joints in wafer level chip-scale packaging Jul. 23, 2013
8476760 Electroplated posts with reduced topography and stress Jul. 2, 2013
8476170 Method of forming pattern, method of manufacturing semiconductor device, and method of manufacturing template Jul. 2, 2013
8476107 Methods for forming resistive switching memory elements Jul. 2, 2013
8461036 Multiple surface finishes for microelectronic package substrates Jun. 11, 2013
8455352 Method for removing native oxide and associated residue from a substrate Jun. 4, 2013
8455358 Method of manufacturing via hole in a semiconductor device Jun. 4, 2013
8455361 Electroless plating of porous and non-porous nickel layers, and gold layer in semiconductor device Jun. 4, 2013
8445883 Nonvolatile semiconductor memory device and manufacturing method thereof May. 21, 2013
8431484 Stable electroless fine pitch interconnect plating Apr. 30, 2013
8426311 Method and apparatus for manufacturing semiconductor device Apr. 23, 2013
8409982 Method of forming solid blind vias through the dielectric coating on high density interconnect (HDI) substrate materials Apr. 2, 2013
8389406 Method of manufacturing semiconductor device Mar. 5, 2013
8373273 Methods of forming integrated circuit devices having damascene interconnects therein with metal diffusion barrier layers and devices formed thereby Feb. 12, 2013
8367463 Methods for forming resistive-switching metal oxides for nonvolatile memory elements Feb. 5, 2013
8361842 Embedded wafer-level bonding approaches Jan. 29, 2013
8343866 Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric region Jan. 1, 2013
8338297 Selective metal deposition over dielectric layers Dec. 25, 2012
8329577 Method of forming an alloy in an interconnect structure to increase electromigration resistance Dec. 11, 2012
8329505 Method for deposition of cathodes for polymer optoelectronic devices Dec. 11, 2012
8314027 Wafer electroless plating system and associated methods Nov. 20, 2012
8298621 Stirring apparatus for combinatorial processing Oct. 30, 2012
8298946 Method of selective coating of a composite surface production of microelectronic interconnections using said method and integrated circuits Oct. 30, 2012
8299341 Fabrication of vertically aligned metallic nanopillars Oct. 30, 2012
8283205 Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die Oct. 9, 2012
8278215 Noble metal activation layer Oct. 2, 2012
8268724 Alternative to desmear for build-up roughening and copper adhesion promotion Sep. 18, 2012
8252685 Techniques to improve characteristics of processed semiconductor substrates Aug. 28, 2012
8242498 Compound semiconductor substrate, semiconductor device, and processes for producing them Aug. 14, 2012
8241948 Semiconductor device and manufacturing method of the same Aug. 14, 2012
8242019 Selective deposition of metal-containing cap layers for semiconductor devices Aug. 14, 2012

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