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Class Information
Number: 438/678
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Electroless deposition of conductive layer
Description: Processes wherein the formation of the conductive layer is accomplished by immersion of the semiconductor substrate in a metallic salt solution and deposition therefrom without the use of electricity.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| RE40983 |
Method to plate C4 to copper stud |
Nov. 17, 2009 |
| 7618887 |
Semiconductor device with a metal line and method of forming the same |
Nov. 17, 2009 |
| 7615491 |
Defectivity and process control of electroless deposition in microelectronics applications |
Nov. 10, 2009 |
| 7611987 |
Defectivity and process control of electroless deposition in microelectronics applications |
Nov. 3, 2009 |
| 7611988 |
Defectivity and process control of electroless deposition in microelectronics applications |
Nov. 3, 2009 |
| 7605082 |
Capping before barrier-removal IC fabrication method |
Oct. 20, 2009 |
| 7595268 |
Semiconductor package having re-distribution lines for supplying power and a method for manufacturing the same |
Sep. 29, 2009 |
| 7592205 |
Over-passivation process of forming polymer layer over IC chip |
Sep. 22, 2009 |
| 7585768 |
Combined copper plating method to improve gap fill |
Sep. 8, 2009 |
| 7579275 |
Electric plating method, electric plating apparatus, program for plating, recording medium, and manufacturing method and manufacturing apparatus for semiconductor device |
Aug. 25, 2009 |
| 7575994 |
Semiconductor device and manufacturing method of the same |
Aug. 18, 2009 |
| 7566661 |
Electroless treatment of noble metal barrier and adhesion layer |
Jul. 28, 2009 |
| 7560381 |
Technique for metal deposition by electroless plating using an activation scheme including a substrate heating process |
Jul. 14, 2009 |
| 7557030 |
Method for fabricating a recess gate in a semiconductor device |
Jul. 7, 2009 |
| 7521360 |
Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby |
Apr. 21, 2009 |
| 7521361 |
Method for manufacturing wiring substrate |
Apr. 21, 2009 |
| 7517782 |
Method of forming a metal layer over a patterned dielectric by wet chemical deposition including an electroless and a powered phase |
Apr. 14, 2009 |
| 7504272 |
Method for producing color-converting light-emitting device using electrophoresis |
Mar. 17, 2009 |
| 7501345 |
Selective silicide formation by electrodeposit displacement reaction |
Mar. 10, 2009 |
| 7498261 |
Method and apparatus for forming metal film |
Mar. 3, 2009 |
| 7491634 |
Methods for forming roughened surfaces and applications thereof |
Feb. 17, 2009 |
| 7488678 |
Method of manufacturing interconnect substrate |
Feb. 10, 2009 |
| 7485561 |
Filling deep features with conductors in semiconductor manufacturing |
Feb. 3, 2009 |
| 7482264 |
Method of forming metal line of semiconductor device, and semiconductor device |
Jan. 27, 2009 |
| 7476616 |
Reagent activator for electroless plating |
Jan. 13, 2009 |
| 7473642 |
Method for fabricating conductive layer |
Jan. 6, 2009 |
| 7470619 |
Interconnect with high aspect ratio plugged vias |
Dec. 30, 2008 |
| 7468320 |
Reduced electromigration and stressed induced migration of copper wires by surface coating |
Dec. 23, 2008 |
| 7459396 |
Method for thin film deposition using multi-tray film precursor evaporation system |
Dec. 2, 2008 |
| 7456092 |
Self-releasing spring structures and methods |
Nov. 25, 2008 |
| 7452749 |
Method for manufacturing flip-chip type semiconductor device featuring nickel electrode pads, and plating apparatus used in such method |
Nov. 18, 2008 |
| 7449412 |
Interconnect circuitry, multichip module, and methods of manufacturing thereof |
Nov. 11, 2008 |
| 7446040 |
Structure for optimizing fill in semiconductor features deposited by electroplating |
Nov. 4, 2008 |
| 7446041 |
Full sequence metal and barrier layer electrochemical mechanical processing |
Nov. 4, 2008 |
| 7435680 |
Method of manufacturing a circuit substrate and method of manufacturing an electronic parts packaging structure |
Oct. 14, 2008 |
| 7432200 |
Filling narrow and high aspect ratio openings using electroless deposition |
Oct. 7, 2008 |
| 7419903 |
Thin films |
Sep. 2, 2008 |
| 7413983 |
Plating method including pretreatment of a surface of a base metal |
Aug. 19, 2008 |
| 7410899 |
Defectivity and process control of electroless deposition in microelectronics applications |
Aug. 12, 2008 |
| 7410666 |
Metal nitride carbide deposition by ALD |
Aug. 12, 2008 |
| 7393782 |
Process for producing layer structures for signal distribution |
Jul. 1, 2008 |
| 7393786 |
Method for manufacturing copper wires on substrate of flat panel display device |
Jul. 1, 2008 |
| 7390742 |
Method for producing a rewiring printed circuit board |
Jun. 24, 2008 |
| 7377032 |
Process for producing a printed wiring board for mounting electronic components |
May. 27, 2008 |
| 7378345 |
Metal electroplating process of an electrically connecting pad structure of circuit board and structure thereof |
May. 27, 2008 |
| 7371682 |
Production method for electronic component and electronic component |
May. 13, 2008 |
| 7368380 |
Method of manufacturing semiconductor device |
May. 6, 2008 |
| 7361582 |
Method of forming a damascene structure with integrated planar dielectric layers |
Apr. 22, 2008 |
| 7361594 |
Method of manufacturing a thin film transistor, thin film transistor, thin film transistor circuit, electronic device, and electronic apparatus |
Apr. 22, 2008 |
| 7358186 |
Method and apparatus for material deposition in semiconductor fabrication |
Apr. 15, 2008 |
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